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5AGXBB1D4F40I5G

Intel

5AGXBB1D4F40I5G by Intel

Intel's 5AGXBB1D4F40I5G FPGA boasts 300K logic cells, TSMC technology, and 11321 CLBs. Ideal for industrial applications with a max operating temp of 100°C, it features a grid array package style and supports up to 704 inputs/outputs.

Median Price

$2,179.740

Lifecycle Status

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Arrow

USA . 7 parts In-Stock

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Verical

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VNN

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Vyrian

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Chip Stock

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Digiode

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Nova Conductors

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Ampacity Inc.

Singapore . 474 parts In-Stock

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AZTECH Wire

Italy . 39 parts In-Stock

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MARBEL Systems

Belgium . 367 parts In-Stock

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Texas Native Microelectronics

USA . 50 parts In-Stock

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Kenton Components

USA . 329 parts In-Stock

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Microchip USA

USA . 2,447 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Qasali Group International

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Overview

Unleash the power of cutting-edge technology with the 5AGXBB1D4F40I5G by Intel. As a leader in the field programmable gate arrays (FPGA) industry, Intel delivers unparalleled quality and reliability. This FPGA offers endless possibilities for customization and optimization, making it perfect for a wide range of applications. Experience the value of superior performance, flexibility, and efficiency that only Intel can provide. Upgrade your projects with the 5AGXBB1D4F40I5G and take your innovations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package material provides good insulation and protection for the internal components, ensuring reliable performance in various environments.

No. of Logic Cells: 300000

Large number of logic cells offer flexibility and capability to handle complex logic designs and applications.

Surface Mount: YES

Surface mount capability enables easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.13 V

Higher maximum supply voltage tolerance allows for stable operation and compatibility with different power supply configurations.

No. of CLBs: 11321

Abundance of Configurable Logic Blocks (CLBs) enables versatile implementation of logic functions and algorithms.

Technology Used: TSMC

Utilizing TSMC technology ensures high-quality fabrication and reliable performance of the FPGA.

No. of Inputs: 704

Large number of input pins provide ample connectivity options for interfacing with external devices and systems.

Package Shape: SQUARE

Square package shape offers efficient use of space and facilitates uniform PCB layout design.

Form Of Terminal: BALL

Ball terminals enable secure connections and facilitate reliable signal transmission between the FPGA and other components.

Nominal Supply Voltage (V): 1.1

Stable nominal supply voltage ensures consistent performance and minimizes the risk of voltage-related issues.

No. of Terminals: 1517

High number of terminals allow for comprehensive connectivity options and enable versatile system integration.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) offers flexibility for reprogramming and customizing the logic functions as needed.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

Grid array package style with heat sink/slug design ensures efficient heat dissipation and enhances thermal management capabilities.

Minimum Supply Voltage: 1.07 V

Low minimum supply voltage requirement allows for energy-efficient operation and flexibility in power supply configurations.

Maximum Operating Temperature: 100 °C

High maximum operating temperature tolerance ensures reliability and performance consistency even in harsh environmental conditions.

Pitch Of Terminal: 1 mm

Narrow pitch of terminals facilitates compact layout design and enables dense packing of components on the PCB.

Organization: 11321 CLBS

Organized configuration of 11321 CLBs offers structured logic design and implementation for efficient system operation.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance ensures functionality in cold environments and broadens the range of applications.

Position Of Terminal: BOTTOM

Terminal positioning at the bottom allows for easy access and simplified routing of connections during PCB assembly.

Maximum Seated Height: 2.7 mm

Moderate maximum seated height provides flexibility in PCB design and allows for integration in various form factors.

Width: 40 mm

Compact width dimension contributes to space-saving design considerations and facilitates integration into tight enclosure spaces.

No. of Outputs: 704

Generous number of output pins provide ample options for transmitting logic results and signals to external components and systems.

Length: 40 mm

Moderate length dimension offers a balanced form factor for compatibility with standard PCB layout designs and enclosures.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in demanding industrial environments with varying temperature conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5AGXBB1D4F40I5G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

704

No. of Outputs:

704

No. of CLBs:

11321

Technology:

TSMC

Organization:

11321 CLBS

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Heat Sink/Slug

Package Code:

Package Shape:

Length:

40 mm

Width:

40 mm

Maximum Seated Height:

2.7 mm

Package Equivalence Code:

BGA1517,39X39,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1517

Trade Compliance

5AGXBB1D4F40I5G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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