Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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Intel's 5AGXBB1D4F40I5G FPGA boasts 300K logic cells, TSMC technology, and 11321 CLBs. Ideal for industrial applications with a max operating temp of 100°C, it features a grid array package style and supports up to 704 inputs/outputs.
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Plastic/Epoxy package material provides good insulation and protection for the internal components, ensuring reliable performance in various environments.
Large number of logic cells offer flexibility and capability to handle complex logic designs and applications.
Surface mount capability enables easy integration onto PCBs, saving space and simplifying assembly processes.
Higher maximum supply voltage tolerance allows for stable operation and compatibility with different power supply configurations.
Abundance of Configurable Logic Blocks (CLBs) enables versatile implementation of logic functions and algorithms.
Utilizing TSMC technology ensures high-quality fabrication and reliable performance of the FPGA.
Large number of input pins provide ample connectivity options for interfacing with external devices and systems.
Square package shape offers efficient use of space and facilitates uniform PCB layout design.
Ball terminals enable secure connections and facilitate reliable signal transmission between the FPGA and other components.
Stable nominal supply voltage ensures consistent performance and minimizes the risk of voltage-related issues.
High number of terminals allow for comprehensive connectivity options and enable versatile system integration.
Being a Field Programmable Gate Array (FPGA) offers flexibility for reprogramming and customizing the logic functions as needed.
Grid array package style with heat sink/slug design ensures efficient heat dissipation and enhances thermal management capabilities.
Low minimum supply voltage requirement allows for energy-efficient operation and flexibility in power supply configurations.
High maximum operating temperature tolerance ensures reliability and performance consistency even in harsh environmental conditions.
Narrow pitch of terminals facilitates compact layout design and enables dense packing of components on the PCB.
Organized configuration of 11321 CLBs offers structured logic design and implementation for efficient system operation.
Low minimum operating temperature tolerance ensures functionality in cold environments and broadens the range of applications.
Terminal positioning at the bottom allows for easy access and simplified routing of connections during PCB assembly.
Moderate maximum seated height provides flexibility in PCB design and allows for integration in various form factors.
Compact width dimension contributes to space-saving design considerations and facilitates integration into tight enclosure spaces.
Generous number of output pins provide ample options for transmitting logic results and signals to external components and systems.
Moderate length dimension offers a balanced form factor for compatibility with standard PCB layout designs and enclosures.
Industrial-grade temperature rating ensures reliable operation in demanding industrial environments with varying temperature conditions.
Field Programmable Gate Arrays (FPGA) 5AGXBB1D4F40I5G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
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5AGXBB1D4F40I5G Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Datasheet Update 09/Aug/2023 Mult PN LABEL 01/08/2023
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
BAV99
Sprague Electric
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1.3 V; Maximum Output Current: .1 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel;
LL4148
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM7805CT/NOPB
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Max): 125 Cel; Maximum Output Voltage-1: 5.25 V;
BSS138-TP
Micro Commercial Components
BSS138-TP by Micro Commercial Components is a N-channel small signal FET with a min DS breakdown voltage of 50V and max drain current of 0.22A. It is commonly used in applications requiring enhancement mode operation, such as power management and switching circuits.
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
SS14
Vishay Intertechnology
Vishay Intertechnology's SS14 is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 1A. Operating at up to 125°C, it has a repetitive peak reverse voltage of 40V. Ideal for surface mount applications, it suits various electronic circuits requiring efficient rectification and low forward voltage drop.
1N4148WT
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
MMBT3906LT1G
Onsemi
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
SMBJ18CA
Littelfuse
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
2N7002-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; Package Shape: RECTANGULAR;
261
Deltrol Controls
Other Relays;
LM358M
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Grande Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Plessey Semiconductors Discrete Components Div
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
A3P1000-FGG256I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
10M25DAF256I7G
Altera
The 10M25DAF256I7G by Altera is a PLASTIC/EPOXY FPGA with 25000 logic cells, CMOS technology, and 178 inputs/outputs. It comes in a BGA package with 256 terminals and a pitch of 1mm. This FPGA operates at a nominal supply voltage of 1.2V and is suitable for various applications requiring programmable ICs.
10CL016YF484C8G
Intel
Intel's 10CL016YF484C8G is a FPGA with 963 CLBs, operating voltage of 1.15-1.25V, and temp range of 0-85°C. It features a grid array package style, square shape, and ball terminals. Ideal for applications requiring high flexibility and customization in electronic circuit design.
XC7A50T-2FGG484I
Xilinx
Xilinx XC7A50T-2FGG484I FPGA features 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.
LCMXO256C-5TN100C
Lattice Semiconductor
LCMXO256C-5TN100C by Lattice Semiconductor is a 256 Logic Cells FPGA with 32 CLBs and 78 Inputs/Outputs. Operating at 1.8V, it has a max supply voltage of 3.465V and can withstand temperatures up to 85°C. Ideal for applications requiring high-performance programmable ICs in compact form factors.
10M40SAE144I7G
The Intel 10M40SAE144I7G is a Field Programmable Gate Array with 40000 logic cells, 2500 CLBs, and 500 inputs/outputs. It operates at temperatures ranging from -40 to 100°C and has a supply voltage of 2.85-3.15V. Ideal for industrial applications requiring high-performance programmable ICs in compact form factors.
EP4CE115F23I7N
EP4CE115F23I7N by Intel is a FPGA with 114480 logic cells, 7155 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
10M04SCU169C8G
The Intel 10M04SCU169C8G is a FPGA with 4000 logic cells, 250 CLBs, and 246 inputs/outputs. It operates at supply voltages b/w 2.85V to 3.15V and temperatures from 0°C to 85°C. This versatile device in a square grid array package is ideal for applications requiring programmable ICs with high logic cell counts and input/output capabilities.
LCMXO2-640HC-6TG100I
LCMXO2-640HC-6TG100I by Lattice Semiconductor is a 640 Logic Cells FPGA with 80 CLBs and 78 Inputs/Outputs. Operating at 2.5V, it's ideal for applications requiring high-speed data processing in compact electronic systems. The PLASTIC/EPOXY package makes it suitable for surface mount designs in various industries.
EP3C25Q240C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: RECTANGULAR;
EP2C5Q208I8N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Maximum Supply Voltage: 1.25 V;
A3PN250-VQG100I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
M1A3P250-VQG100I
Microchip Technology
Microchip Technology's M1A3P250-VQG100I is a CMOS FPGA with 6144 CLBs and 250000 gates. It operates at temperatures ranging from -40 to 100 °C, with a supply voltage of 1.425V to 1.575V. This field-programmable IC in a square package is ideal for industrial applications requiring high gate count and versatile programmability.
EP1C6Q240C8N
EP1C6Q240C8N by Intel is a Field Programmable Gate Array (FPGA) with 5980 logic cells, 598 CLBs, and a max clock frequency of 275 MHz. It is ideal for applications requiring high-speed processing and customization in electronics design, offering versatility with its 185 inputs and outputs. With a compact square package style and low power supply requirements, it suits various embedded systems projects.
EP3C10F256C8N
EP3C10F256C8N by Intel is a FPGA with 10320 logic cells, 182 inputs/outputs, and a max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities, such as telecommunications equipment and industrial automation systems.
EP4CE22E22C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: HLFQFP; Package Shape: SQUARE;
XC7A100T-2FGG484C
Xilinx XC7A100T-2FGG484C FPGA features 101440 logic cells, 7925 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.
XC6SLX150T-3FGG676I
Xilinx XC6SLX150T-3FGG676I is a FPGA with 147443 logic cells, 11519 CLBs, and max clock frequency of 862 MHz. It operates at industrial temperatures and is suitable for applications requiring high-speed processing and programmable ICs in various industries.
10M08SCU169C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;
LCMXO3LF-6900C-5BG400C
LCMXO3LF-6900C-5BG400C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, 0.8mm terminal pitch, and 400 terminals. Ideal for applications requiring low profile, fine pitch grid arrays in electronics operating b/w 0-85°C.
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5AGXFB7H4F35I3G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: HBGA; Package Shape: SQUARE;
5AGXFB5H4F35I5N
The 5AGXFB5H4F35I5N FPGA by Altera is a powerful and versatile field programmable gate array. It features 420,000 logic cells and has a maximum clock frequency of 622 MHz. With 544 inputs and outputs, it offers flexibility for various applications. The package shape is square with a grid array style and a width and length of 35 mm. It operates on a nominal supply voltage of 1.1 V and supports multiple power supplies. Its technology, CMOS, ensures efficient performance. Suitable for surface mount applications, this FPGA is a reliable choice for advanced electronic designs.
The Intel 5AGXFB5H4F35I5N is a field programmable gate array (FPGA) with 420,000 logic cells. It has a max clock frequency of 622 MHz and can operate in industrial temperature conditions. This FPGA is commonly used for applications requiring high-speed processing and customization.
5AGXFB3H4F40I5G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: HBGA; Package Shape: SQUARE;
5AGXMB1G4F31C4N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: HBGA; Package Shape: SQUARE;
5AGXBB1D4F40I5N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.13 V;
5AGXFB7K4F40C4N
The Intel 5AGXFB7K4F40C4N is a FPGA with 504,000 logic cells and 19,024 CLBs. It operates at a max clock frequency of 670 MHz and has 704 inputs/outputs. This FPGA is ideal for applications requiring high-speed processing and complex logic functions in industries like telecommunications and aerospace.
The Altera 5AGXFB7K4F40C4N FPGA has 503,500 logic cells, operates at a maximum clock frequency of 670 MHz, and has 704 inputs and outputs. It uses CMOS technology and has a maximum supply voltage of 1.13V. Its package is a square-shaped BGA with 1517 terminals. This FPGA is suitable for various applications requiring flexible and programmable digital logic circuits.
5AGXFB3H6F35C6N
The Intel 5AGXFB3H6F35C6N is a Field Programmable Gate Array (FPGA) with 362,000 logic cells. It has a max supply voltage of 1.13V and can operate at temperatures up to 85°C. This FPGA is commonly used in applications requiring high-performance programmable logic solutions.
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;
5AGXMA7G4F35I5G
5AGXFA5H4F35I5G
5AGXMA5G4F35I5G
5AGXBA7D4F35C4N
5AGXFB3H4F40C5N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
5AGXFB5K4F40I5G
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