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10AX066N1F40I1HG

Intel

10AX066N1F40I1HG by Intel

Intel's 10AX066N1F40I1HG FPGA boasts 660,000 logic cells and 25,168 CLBs. Utilizing TSMC technology, it offers 588 inputs/outputs for industrial applications requiring high-performance programmable ICs in a compact square package with a grid array style.

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Vyrian

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AZTECH Wire

Italy . 995 parts In-Stock

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Ampacity Inc.

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Texas Native Microelectronics

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Microchip USA

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Kenton Components

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Continental Prestige Electronics

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Qasali Group International

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Overview

Unlock the power of innovation with the Intel 10AX066N1F40I1HG FPGA, designed to elevate your projects to new heights. Crafted by industry-leading manufacturer Intel, this field programmable gate array boasts 660,000 logic cells and 25,168 CLBs for unparalleled performance. Whether you're in automotive, aerospace, or telecommunications, this versatile FPGA offers endless possibilities for customization and optimization. Experience the reliability and cutting-edge technology of Intel, and revolutionize your designs with the 10AX066N1F40I1HG FPGA today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the internal components of the FPGA.

No. of Logic Cells: 660000

With a large number of logic cells, this FPGA can handle complex algorithms and processing tasks efficiently.

Surface Mount: YES

Being surface mountable makes it easy to integrate this FPGA into existing electronic systems or PCBs.

Technology Used: TSMC

Utilizing TSMC technology ensures high performance and reliability in the operation of this FPGA.

No. of Inputs: 588

The large number of inputs allows for a wide range of data to be processed by the FPGA.

Package Shape: SQUARE

The square package shape makes it easy to handle and mount this FPGA onto a PCB.

Form Of Terminal: BALL

The ball form of terminal simplifies the connection process and ensures a secure electrical connection.

No. of Terminals: 1517

Having a high number of terminals provides flexibility in connecting the FPGA to other components in a system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array allows for customization and reprogramming of the FPGA for specific applications.

Package Style (Meter): GRID ARRAY

The grid array package style enhances the reliability and stability of the FPGA for long-term use.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals enables easy and precise soldering during assembly of the FPGA.

Organization: 25168 CLBS

The organized structure of 25168 CLBs ensures efficient operation and processing capabilities of the FPGA.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance even in cold environments.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom simplifies the integration of the FPGA into a PCB layout.

Maximum Seated Height: 3.35 mm

The maximum seated height of 3.35 mm enables compact design and space-saving installation of the FPGA.

Width: 40 mm

The 40 mm width provides a balance between size and functionality for various applications of the FPGA.

No. of Outputs: 588

The large number of outputs allows for a wide range of signals to be generated by the FPGA.

Length: 40 mm

The 40 mm length ensures a compact form factor, suitable for integration into different electronic systems.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature grading ensures reliable performance in demanding industrial environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10AX066N1F40I1HG attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

660000

No. of Inputs:

588

No. of Outputs:

588

No. of CLBs:

25168

Technology:

TSMC

Organization:

25168 CLBS

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

40 mm

Width:

40 mm

Maximum Seated Height:

3.35 mm

Package Equivalence Code:

BGA1517,39X39,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1517

Trade Compliance

10AX066N1F40I1HG Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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