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XCKU11P-2FFVE1517E

Xilinx

XCKU11P-2FFVE1517E by Xilinx

Xilinx XCKU11P-2FFVE1517E FPGA offers 653100 logic cells, 37320 CLBs, and 512 inputs/outputs. Ideal for applications requiring high-speed processing and complex algorithms in industries like telecommunications, aerospace, and automotive. Operating temperature range from 0 to 100°C with a max supply voltage of 0.876V.

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Vyrian

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Semicontronic

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AZTECH Wire

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Modulus Dynamics

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One Stop Electronics

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MARBEL Systems

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Overview

Unlock endless possibilities with the XCKU11P-2FFVE1517E by Xilinx, a top-tier manufacturer of Field Programmable Gate Arrays (FPGA). With over 653,000 logic cells and 37,320 CLBs, this FPGA offers unparalleled performance for a wide range of applications. From aerospace to telecommunications, this versatile product delivers high-quality results while providing customers with exceptional value and flexibility. Experience the innovation and reliability that only Xilinx can offer with the XCKU11P-2FFVE1517E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the FPGA, ensuring reliable performance under various conditions.

No. of Logic Cells: 653100

With a high number of logic cells, this FPGA is capable of handling complex and large-scale designs efficiently.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and making the overall design more compact.

Maximum Supply Voltage: 0.876 V

Efficient power consumption with a low maximum supply voltage, helping to reduce overall energy usage.

No. of CLBs: 37320

A large number of Configurable Logic Blocks allows for greater flexibility in implementing different logic functions and configurations.

No. of Inputs: 512

With a high number of inputs, this FPGA can accommodate a wide range of input signals in complex applications.

Package Shape: SQUARE

Square package shape is space-efficient and allows for easier placement on PCBs.

Form Of Terminal: BALL

Ball terminals provide reliable connections and are suitable for surface mounting, making installation easier.

Nominal Supply Voltage (V): 0.85

Stable nominal supply voltage for consistent performance and compatibility with standard power sources.

No. of Terminals: 1517

High number of terminals allow for more connectivity options and compatibility with various PCB layouts.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this product offers flexibility for design changes and updates without replacing hardware.

Package Style (Meter): GRID ARRAY

Grid array package style offers better thermal and electrical performance, enhancing the overall reliability of the FPGA.

Minimum Supply Voltage: 0.825 V

Low minimum supply voltage ensures lower power consumption and heat generation, increasing energy efficiency.

Maximum Operating Temperature: 100 °C

High maximum operating temperature range allows for operation in harsh environments without compromising performance.

Pitch Of Terminal: 1 mm

Compact terminal pitch enables high-density mounting on PCBs, saving space and improving overall design efficiency.

Organization: 37320 CLBS

Organized into 37320 Configurable Logic Blocks, offering structured logic implementation for easier design and debugging.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable performance even in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Terminal finishing with Tin, Silver, and Copper ensures reliable connections and prevents corrosion, enhancing long-term reliability.

Position Of Terminal: BOTTOM

Bottom terminal position allows for better heat dissipation and overall thermal management, improving reliability.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates resistance to moisture during handling and assembly, ensuring product reliability in humid environments.

Maximum Seated Height: 3.51 mm

Low maximum seated height allows for more compact designs and easier integration into space-constrained systems.

Width: 40 mm

40 mm width provides a balance between compact size and adequate surface area for mounting and heat dissipation.

No. of Outputs: 512

High number of outputs allows for driving multiple external devices and signals, increasing the versatility of the FPGA.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this FPGA can be reliably integrated into PCB assembly processes without degrading performance.

Peak Reflow Temperature °C: 245

Peak reflow temperature of 245°C ensures proper soldering and mechanical stability during assembly, enhancing product reliability.

Length: 40 mm

40 mm length provides a balanced form factor for easy integration into various PCB layouts and enclosures.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU11P-2FFVE1517E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

653100

No. of Inputs:

512

No. of Outputs:

512

No. of CLBs:

37320

Organization:

37320 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

40 mm

Width:

40 mm

Maximum Seated Height:

3.51 mm

Package Equivalence Code:

BGA1517,39X39,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Trade Compliance

XCKU11P-2FFVE1517E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.7.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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