Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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TDA3683J/N2S,112
NXP Semiconductors
TDA3683J/N2S,112 by NXP is a robust power management IC with a nominal voltage of 14.4V and operates in extreme temperatures from -40 °C to 85 °C. It features 23 terminals in a zig-zag configuration for efficient integration. Ideal for industrial applications, it ensures reliable performance with low supply current of 0.45mA.
R-PZIP-T23
23
85 Cel
-40 Cel
PLASTIC/EPOXY
ZIP
ZIP23,.2,.17TB
RECTANGULAR
IN-LINE
14.4
Not Qualified
Power Management Circuits
.45 mA
14.4 V
NO
CMOS
INDUSTRIAL
THROUGH-HOLE
1.27 mm
ZIG-ZAG
NX5P2553GUZ
NX5P2553GUZ from NXP Semiconductors is a compact power management IC designed for industrial applications. It operates within a temperature range of -40 °C to 85 °C, supports 3/5V supplies, and features a low supply current of 0.225 mA. Its small outline and gull-wing terminals make it ideal for space-constrained designs.
R-PDSO-G6
6
TSOP
TSOP6,.11,37
SMALL OUTLINE, THIN PROFILE
3/5
.225 mA
YES
GULL WING
.95 mm
DUAL
NX5P2553GU6Z
NX5P2553GU6Z from NXP Semiconductors is a compact power management IC designed for industrial applications. It operates within a temperature range of -40 °C to 85 °C, supports 3/5V supplies, and features a low supply current of 0.225 mA. Its surface mount design ensures efficient space utilization in electronic devices.
R-PDSO-N6
SON
SOLCC6,.08,25
SMALL OUTLINE
NO LEAD
.635 mm
NX5P2925CUKZ
NX5P2925CUKZ from NXP Semiconductors is a compact power management IC designed for industrial applications. It operates within a voltage range of 1.2V to 5V, with a max supply current of 0.15mA and supports temperatures from -40 °C to 85 °C. Its surface mount design ensures efficient integration in space-constrained environments.
R-PBGA-B6
1
FBGA
BGA6,2X3,20
GRID ARRAY, FINE PITCH
260
1.2/5
.15 mA
BALL
.5 mm
BOTTOM
NX5P2924CUKZ
NX5P2924CUKZ from NXP Semiconductors is a compact power management IC designed for industrial applications. It operates within a voltage range of 1-5.5V, with a max supply current of 0.11mA and supports temperatures from -40 °C to 85 °C. Its surface mount design ensures efficient integration in various electronic devices.
1/5.5
.11 mA
MF1S5030XDA4,118
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Shape: RECTANGULAR; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;
POWER SUPPLY SUPPORT CIRCUIT
R-PXMA-N16
e4
16
70 Cel
-25 Cel
MICROELECTRONIC ASSEMBLY
OTHER
Silver (Ag)
UNSPECIFIED
MF1S5000XDA4,118
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Shape: RECTANGULAR; Surface Mount: YES; Adjustable Threshold: NO;
MF1S5031XDUD,005
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Surface Mount: YES; Minimum Operating Temperature: -25 Cel;
R-XUUC-N
DIE
UNCASED CHIP
UPPER
74LV4799D,118
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
R-PDSO-G16
9.9 mm
0 Cel
SOP
1.75 mm
6 V
.9 V
1.2 V
COMMERCIAL
NICKEL PALLADIUM GOLD
3.9 mm
74LV4799DB,112
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
6.2 mm
SSOP
SSOP16,.3
SMALL OUTLINE, SHRINK PITCH
3.3
2 mm
Analog Waveform Generation Functions
.65 mm
5.3 mm
74LV4799DB,118
74LV4799N,112
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
R-PDIP-T16
19.025 mm
DIP
DIP16,.3
4.2 mm
2.54 mm
7.62 mm
74LV4799PW,112
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
5 mm
TSSOP
TSSOP16,.25
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
1.1 mm
4.4 mm
74LV4799PW,118
PCF1252-0T/F4,112
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
R-PDSO-G8
8
2.4 V
PCF1252-0T/F4,118
PCF1252-1T/F4,112
PCF1252-1T/F4,118
TDA3616T/N1,118
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
R-PDSO-G20
12.8 mm
2
20
105 Cel
2.65 mm
25 V
5.6 V
7.5 mm
TDA3606T/N1,118
4.9 mm
.12 mA
TDA3606AT/N1,118
3
TDA3606AT/N1,112
74LVCV2G66DP,125
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE; Surface Mount: YES;
S-PDSO-G8
3 mm
30 ohm
125 Cel
TSSOP8,.16
SQUARE
2.5/5
Multiplexer or Switches
5.5 V
2.3 V
3 V
MAKE-BEFORE-BREAK
AUTOMOTIVE
Nickel/Palladium/Gold (Ni/Pd/Au)
30
74LV4799SD,118
NOT SPECIFIED
TEA1506P/N1,112
POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO; Length: 9.5 mm;
R-PDIP-T8
9.5 mm
15 V
TEA1506T/N1,518
POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Pitch: 1.27 mm;
R-PDSO-G14
8.65 mm
14
MC32PF4210A0ESR2
POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 56; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Length: 8 mm;
S-PQCC-N56
8 mm
56
QCCN
CHIP CARRIER, HEAT SINK/SLUG
.9 mm
4.5 V
2.8 V
3.6 V
QUAD
+2.4V
40
MC32PF4210A1ESR2
POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 56; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Form: NO LEAD;
MC32PF4210A2ESR2
POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 56; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Channels: 14;
MC32PF4210A2ES
POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 56; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 40;
MC32PF4210A3ESR2
POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 56; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Operating Temperature: 85 Cel;
MC32PF4210A3ES
MC34PF4210A0ESR2
POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 56; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Nominal Threshold Voltage (V): +2.4V;
MC34PF4210A0ES
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
S-XQCC-N56
HVQCCN
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
MC34PF4210A2ESR2
MC34PF4210A2ES
MC34PF4210A3ESR2
POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 56; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Peak Reflow Temperature (C): 260;
MC34PF4210A3ES
MC32PF1510A2EPR2
POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
POWER SUPPLY MANAGEMENT CIRCUIT
S-XQCC-N40
LCC40,.2SQ,16
7 V
3.8 V
5 V
.4 mm
MC32PF1510A2EP
POWER SUPPLY MANAGEMENT CIRCUIT; Terminal Finish: NICKEL PALLADIUM GOLD; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3;
MC32PF1510A3EP
POWER SUPPLY MANAGEMENT CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL PALLADIUM GOLD;
MC32PF1510A4EPR2
MC32PF1510A4EP
POWER SUPPLY MANAGEMENT CIRCUIT; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e4;
MC32PF1510A5EPR2
MC32PF1510A5EP
POWER SUPPLY MANAGEMENT CIRCUIT; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e4;
MC32PF1510A6EPR2
MC32PF1510A6EPR2 by NXP Semiconductors is a Power Management IC with 40 terminals, operating at -40 to 85°C. It features a nominal voltage of 5V, suitable for industrial applications requiring power supply management circuits in compact square chip carrier packages.
MC32PF1510A7EPR2
MC32PF1510A7EP
POWER SUPPLY MANAGEMENT CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD;
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