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TDA3683J/N2S,112

NXP Semiconductors

TDA3683J/N2S,112 by NXP Semiconductors

TDA3683J/N2S,112 by NXP is a robust power management IC with a nominal voltage of 14.4V and operates in extreme temperatures from -40 °C to 85 °C. It features 23 terminals in a zig-zag configuration for efficient integration. Ideal for industrial applications, it ensures reliable performance with low supply current of 0.45mA.

Median Price

$4.650

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 252 parts In-Stock

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$4.650

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$4.160

10k+ parts

$3.910

252

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$4.650

$4.160

$3.910

Distributors (In-Stock)

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Digiode

USA . 3,484 parts In-Stock

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$4.912

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3,484

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Vyrian

USA . 7,135 parts In-Stock

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7,135

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Anansix

USA . 570 parts In-Stock

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570

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Corphita

USA . 4,024 parts In-Stock

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$4.653

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4,024

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AZTECH Wire

Italy . 327 parts In-Stock

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$8.350

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327

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Microchip USA

USA . 4,439 parts In-Stock

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4,439

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UNI Independent Distributors

Spain . 3,213 parts In-Stock

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Overview

Elevate your power management solutions with the TDA3683J/N2S,112 from NXP Semiconductors. Renowned for its exceptional quality and reliability, this versatile IC is designed to thrive in demanding industrial environments, ensuring optimal performance from -40 °C to 85 °C. Enjoy peace of mind knowing that you're backed by a trusted manufacturer committed to innovation. Experience enhanced efficiency and reliability in your applications while powering your success with this cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making the IC suitable for various applications.

Package Shape: RECTANGULAR

A rectangular package shape allows for efficient space utilization on PCBs, facilitating easier integration into designs.

Nominal Supply Voltage (Vsup): 14.4 V

The nominal supply voltage of 14.4V is ideal for a range of power management applications, ensuring compatibility with various systems.

Power Supplies (V): 14.4

This consistent power supply voltage ensures reliable operation, minimizing disruptions and enhancing performance.

No. of Terminals: 23

With 23 terminals, this IC offers flexibility in design and connectivity options, allowing for intricate circuit configurations.

Package Style (Meter): IN-LINE

The in-line packaging style simplifies the assembly process and is compatible with standard PCB manufacturing practices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature enhances the IC's reliability in demanding environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operating at temperatures as low as -40 °C ensures functionality in extreme conditions, increasing its versatility in various settings.

Terminal Position: ZIG-ZAG

The zig-zag terminal position allows for efficient space management on the PCB, enabling denser circuit layouts.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades means this IC is built to withstand harsher environments, ensuring longevity and reliability.

Maximum Supply Current (Isup): 0.45 mA

Low supply current operation enhances the overall energy efficiency of the device, making it ideal for power-sensitive applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this IC suitable for a wide variety of electronics.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer strong mechanical support and are advantageous in applications where durability and stability are critical.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for many applications, facilitating compatibility with existing manufacturing processes and designs.

Technical Specifications

Power Management ICs TDA3683J/N2S,112 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PZIP-T23

No. of Terminals:

23

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP23,.2,.17TB

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

14.4

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.45 mA

Nominal Supply Voltage (Vsup):

14.4 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA3683J/N2S,112 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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