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TDA3606T

NXP Semiconductors

TDA3606T by NXP Semiconductors

TDA3606T by NXP Semiconductors is a versatile power management IC designed for industrial applications. It operates within a supply voltage range of 5.6V to 25V, with a max temp of 85 °C and features an 8-terminal gull-wing package. Ideal for efficient power supply support circuits, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,421 parts In-Stock

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4,421

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Digiode

USA . 2,560 parts In-Stock

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2,560

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Anansix

USA . 713 parts In-Stock

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713

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Distributors (Availability)

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One Stop Electronics

USA . 279 parts In-Stock

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$3.500

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279

$3.500

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UNI Independent Distributors

Spain . 4,530 parts In-Stock

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Corphita

USA . 3,604 parts In-Stock

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Futuretech Components

Singapore . 194 parts In-Stock

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Overview

Elevate your designs with the TDA3606T from NXP Semiconductors—a powerhouse in power management ICs. Renowned for their unmatched quality and reliability, NXP ensures that this compact solution delivers superior performance across a range of applications. With wide supply voltage capabilities and exceptional thermal resilience, the TDA3606T is perfect for industrial environments, providing enhanced efficiency and longevity that empower your innovation. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and contributes to reliable performance in various environments.

Surface Mount: YES

Surface mount capability allows for efficient manufacturing processes and saves board space in modern designs.

Package Shape: RECTANGULAR

A rectangular package shape is ideal for compact layouts, making it versatile for different applications.

Nominal Supply Voltage (Vsup): 14.4 V

This nominal supply voltage is suitable for a wide range of electronic applications, ensuring compatibility with many systems.

No. of Terminals: 8

Having 8 terminals provides ample connectivity options for various configurations while maintaining a compact size.

Package Style (Meter): SMALL OUTLINE

The small outline package style maximizes PCB space efficiency, facilitating advanced designs with minimal footprint.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable operation in high-temperature environments, enhancing product lifespan.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C makes this IC suitable for harsh conditions, broadening its application range in industrial settings.

Terminal Position: DUAL

The dual terminal positioning allows for more flexible routing on PCBs, aiding in varied design requirements.

Maximum Seated Height: 1.75 mm

The low seated height contributes to a slim design profile, making it ideal for height-restricted applications.

Width: 3.9 mm

A compact width of 3.9 mm saves space on the PCB, making it easier to design dense electronic assemblies.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit makes this IC essential for energy management, improving system efficiency.

Minimum Supply Voltage (Vsup): 5.6 V

The minimum supply voltage of 5.6 V allows compatibility with various lower voltage systems, increasing flexibility.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum reflow time of 40 seconds ensures reliable solder joints, improving manufacturing yield and quality.

Peak Reflow Temperature °C: 260

The ability to withstand peak reflow temperatures of up to 260 °C makes this IC suitable for modern soldering processes.

Length: 4.9 mm

With a length of 4.9 mm, this IC is compact yet offers valuable functionality, fitting well into tight spaces.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates robustness under varying temperature conditions, assuring long-term reliability.

Maximum Supply Current (Isup): 0.12 mA

The low maximum supply current of 0.12 mA signifies energy efficiency, beneficial for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form enhances mechanical stability during assembly and ensures strong electrical connectivity.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for many surface mount applications, ensuring compatibility with most manufacturing processes.

Maximum Supply Voltage (Vsup): 25 V

Supporting a maximum supply voltage of 25 V enhances adaptability for various high-voltage applications, ensuring versatility.

Technical Specifications

Power Management ICs TDA3606T attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current (Isup):

.12 mA

Maximum Supply Voltage (Vsup):

25 V

Minimum Supply Voltage (Vsup):

5.6 V

Nominal Supply Voltage (Vsup):

14.4 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

TDA3606T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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