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TDA3606AT

NXP Semiconductors

TDA3606AT by NXP Semiconductors

TDA3606AT by NXP Semiconductors is a versatile power management IC with a nominal voltage of 14.4 V, supporting up to 3 channels. It operates in extreme temperatures from -40 °C to 85 °C and features a compact SO package. Ideal for industrial applications, it ensures reliable performance with low supply current of just 0.12 mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 4,331 parts In-Stock

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4,331

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Chip Stock

USA . 2,990 parts In-Stock

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2,990

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Vyrian

USA . 1,590 parts In-Stock

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1,590

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Anansix

USA . 229 parts In-Stock

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229

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One Stop Electronics

USA . 404 parts In-Stock

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$5.500

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404

$5.500

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UNI Independent Distributors

Spain . 6,571 parts In-Stock

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6,571

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Corphita

USA . 2,894 parts In-Stock

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Metaverse IC Inc.

Canada . 1,140 parts In-Stock

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1,140

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Kepictronics

USA . 1,125 parts In-Stock

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1,125

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock the power of efficiency with the TDA3606AT from NXP Semiconductors. Renowned for top-tier quality and innovation, NXP delivers this versatile Power Management IC designed for diverse applications, ensuring reliability in industrial settings. With superior thermal performance and robust design, the TDA3606AT optimizes power supply management, enhancing device longevity and performance. Choose NXP for unmatched value and seamless integration into your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and adequate protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for easier integration into compact PCB designs, making it ideal for modern electronic applications.

Package Shape: RECTANGULAR

Rectangular package shape optimizes space efficiency on the PCB, enabling a more streamlined design.

Nominal Supply Voltage (Vsup): 14.4 V

This nominal voltage level indicates compatibility with a variety of applications, including industrial power management.

No. of Terminals: 20

Having 20 terminals facilitates a versatile range of connectivity options, enhancing circuit functionality.

Package Style (Meter): SMALL OUTLINE

Small outline packaging allows for reduced footprint and better space management on printed circuit boards.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this IC suitable for use in harsh environments, ensuring reliability.

Minimum Operating Temperature: -40 °C

The wide temperature range allows this product to operate effectively in extreme conditions, perfect for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish ensures excellent solderability and provides long-term reliability and performance.

Terminal Position: DUAL

Dual terminal positioning facilitates easier and more flexible PCB layout design, aiding in efficient circuit assembly.

Maximum Seated Height: 2.65 mm

A low seated height helps in designing slimmer devices without compromising on performance characteristics.

Width: 7.5 mm

The compact width contributes to efficient space utilization on PCBs, making it suitable for space-constrained applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it is essential for ensuring stable power delivery, which enhances device performance.

Minimum Supply Voltage (Vsup): 5.6 V

This minimum voltage requirement allows flexibility in design and compatibility with various low-voltage systems.

Length: 12.8 mm

The controlled length again supports compact PCB layouts while delivering robust electrical performance.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC guarantees durability and reliability in demanding environments.

Maximum Supply Current (Isup): 0.12 mA

Low supply current enhances energy efficiency, making this IC a cost-effective choice for power management.

No. of Channels: 3

Three channels provide multiple output options, increasing the IC's versatility for complex power management tasks.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and insertion into PCBs, ensuring reliable connections.

Terminal Pitch: 1.27 mm

A pitch of 1.27 mm allows for more densely packed designs while maintaining ease of handling during assembly.

Maximum Supply Voltage (Vsup): 25 V

The ability to handle up to 25 V makes this IC versatile for a variety of power supply applications.

Technical Specifications

Power Management ICs TDA3606AT attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current (Isup):

.12 mA

Maximum Supply Voltage (Vsup):

25 V

Minimum Supply Voltage (Vsup):

5.6 V

Nominal Supply Voltage (Vsup):

14.4 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

TDA3606AT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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