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TDA3683J

Philips Semiconductors

TDA3683J by Philips Semiconductors

Power Management Circuits; Temperature Grade: INDUSTRIAL; No. of Terminals: 23; Package Code: ZIP; Package Shape: RECTANGULAR; Surface Mount: NO;

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Anansix

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One Stop Electronics

USA . 975 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,167 parts In-Stock

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Kepictronics

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Corphita

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UNI Independent Distributors

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Technical Specifications

Power Management ICs TDA3683J attributes and parameters. Explore more Power Management ICs devices from Philips Semiconductors

Specs

JESD-30 Code:

R-PZIP-T23

No. of Terminals:

23

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP23,.2,.17

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

14.4

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.45 mA

Nominal Supply Voltage (Vsup):

14.4 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA3683J Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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