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NXP Semiconductors Power Management ICs 465

Power Management ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Adjustable Threshold Other IC type Nominal Bandwidth Control Mode Control Technique Maximum Input Voltage Minimum Input Voltage Nominal Input Voltage JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage (Vsup) Maximum Negative Input Voltage Normal Position (V) No. of Channels No. of Functions No. of Outputs No. of Terminals Maximum On-state Resistance (Ron) Maximum Operating Temperature Minimum Operating Temperature Output (V) Maximum Output Current Maximum Output Voltage Minimum Output Voltage Nominal Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Protection(s) Qualification Main Out Ripple Voltage Screening Level Maximum Seated Height Sub-Category Maximum Supply Current (Isup) Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage (Vsup) Surface Mount Maximum Switch-on Time Switcher Config Switching (V) Maximum Switching Frequency Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Nominal Threshold Voltage (V) Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Maximum Total Power Output Trim or Adjustable Output (V) Width (mm)
MC32PF1550A2EPR2 by NXP Semiconductors

MC32PF1550A2EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Position: QUAD;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC32PF1550A2EP by NXP Semiconductors

MC32PF1550A2EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Position: QUAD;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC32PF1550A3EPR2 by NXP Semiconductors

MC32PF1550A3EPR2

NXP Semiconductors

MC32PF1550A3EPR2 by NXP Semiconductors is a Power Management IC with 40 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 2.5V to 4.5V and features adjustable threshold voltage at +6.5V, suitable for power supply management circuits in various applications.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC32PF1550A4EPR2 by NXP Semiconductors

MC32PF1550A4EPR2

NXP Semiconductors

MC32PF1550A4EPR2 by NXP Semiconductors is a Power Management IC with 40 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 2.5V to 4.5V and features adjustable threshold voltage at +6.5V, suitable for power supply management circuits in various applications.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC32PF1550A4EP by NXP Semiconductors

MC32PF1550A4EP

NXP Semiconductors

MC32PF1550A4EP by NXP Semiconductors is a Power Management IC with 40 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 2.5V to 4.5V and features adjustable threshold voltage at +6.5V, suitable for power supply management circuits in various applications.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC32PF1550A5EPR2 by NXP Semiconductors

MC32PF1550A5EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Operating Temperature: -40 Cel;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC32PF1550A5EP by NXP Semiconductors

MC32PF1550A5EP

NXP Semiconductors

MC32PF1550A5EP by NXP Semiconductors is a Power Management IC with 1 function. It has a package style of CHIP CARRIER, HEAT SINK/SLUG and very thin profile. It operates at temperatures ranging from -40 to 85 °C and has a nominal voltage of 3.6 V. Its application includes power supply management circuits.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC32PF1550A6EPR2 by NXP Semiconductors

MC32PF1550A6EPR2

NXP Semiconductors

MC32PF1550A6EPR2 by NXP Semiconductors is a Power Management IC with 1 function, operating voltage of 2.5-4.5V, and temperature range of -40 to 85°C. It is used in power supply management circuits for various applications.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC32PF1550A7EPR2 by NXP Semiconductors

MC32PF1550A7EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC32PF1550A7EP by NXP Semiconductors

MC32PF1550A7EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Position: QUAD;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC34PF1510A1EP by NXP Semiconductors

MC34PF1510A1EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3; Terminal Finish: NICKEL PALLADIUM GOLD;

POWER SUPPLY MANAGEMENT CIRCUIT

e4

3

260

NICKEL PALLADIUM GOLD

40

MC34PF1510A2EPR2 by NXP Semiconductors

MC34PF1510A2EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-XQCC-N40

e4

5 mm

3

8

1

40

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC40,.2SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

7 V

3.8 V

5 V

YES

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

40

5 mm

MC34PF1510A2EP by NXP Semiconductors

MC34PF1510A2EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: NICKEL PALLADIUM GOLD;

POWER SUPPLY MANAGEMENT CIRCUIT

e4

3

260

NICKEL PALLADIUM GOLD

40

MC34PF1510A3EPR2 by NXP Semiconductors

MC34PF1510A3EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-XQCC-N40

e4

5 mm

3

8

1

40

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC40,.2SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

7 V

3.8 V

5 V

YES

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

40

5 mm

MC34PF1510A3EP by NXP Semiconductors

MC34PF1510A3EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e4;

POWER SUPPLY MANAGEMENT CIRCUIT

e4

3

260

NICKEL PALLADIUM GOLD

40

MC34PF1510A4EPR2 by NXP Semiconductors

MC34PF1510A4EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-XQCC-N40

e4

5 mm

3

8

1

40

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC40,.2SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

7 V

3.8 V

5 V

YES

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

40

5 mm

MC34PF1510A4EP by NXP Semiconductors

MC34PF1510A4EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: NICKEL PALLADIUM GOLD; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3;

POWER SUPPLY MANAGEMENT CIRCUIT

e4

3

260

NICKEL PALLADIUM GOLD

40

MC34PF1510A5EPR2 by NXP Semiconductors

MC34PF1510A5EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-XQCC-N40

e4

5 mm

3

8

1

40

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC40,.2SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

7 V

3.8 V

5 V

YES

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

40

5 mm

MC34PF1510A5EP by NXP Semiconductors

MC34PF1510A5EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 3;

POWER SUPPLY MANAGEMENT CIRCUIT

e4

3

260

NICKEL PALLADIUM GOLD

40

MC34PF1510A6EPR2 by NXP Semiconductors

MC34PF1510A6EPR2

NXP Semiconductors

MC34PF1510A6EPR2 by NXP Semiconductors is a Power Management IC with 40 terminals, operating b/w -40 to 105°C. It features an adjustable threshold, 8 channels, and supports a supply voltage range of 3.8V to 7V. Ideal for industrial applications requiring precise power supply management in compact spaces.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-XQCC-N40

e4

5 mm

3

8

1

40

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC40,.2SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

7 V

3.8 V

5 V

YES

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

40

5 mm

MC34PF1510A7EPR2 by NXP Semiconductors

MC34PF1510A7EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-XQCC-N40

e4

5 mm

3

8

1

40

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC40,.2SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

7 V

3.8 V

5 V

YES

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

40

5 mm

MC34PF1510A7EP by NXP Semiconductors

MC34PF1510A7EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: NICKEL PALLADIUM GOLD; Peak Reflow Temperature (C): 260; JESD-609 Code: e4;

POWER SUPPLY MANAGEMENT CIRCUIT

e4

3

260

NICKEL PALLADIUM GOLD

40

MC34PF1550A1EP by NXP Semiconductors

MC34PF1550A1EP

NXP Semiconductors

MC34PF1550A1EP by NXP Semiconductors is a Power Management IC with 40 terminals and a square package. It has a nominal voltage of 3.6V and can operate in temperatures ranging from -40 to 105 °C. This IC is commonly used in power supply management circuits.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

105 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC34PF1550A2EPR2 by NXP Semiconductors

MC34PF1550A2EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Form: NO LEAD;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

105 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC34PF1550A2EP by NXP Semiconductors

MC34PF1550A2EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Seated Height: .9 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

105 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC34PF1550A3EPR2 by NXP Semiconductors

MC34PF1550A3EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Form: NO LEAD;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

105 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC34PF1550A3EP by NXP Semiconductors

MC34PF1550A3EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Pitch: .4 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

105 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC34PF1550A4EPR2 by NXP Semiconductors

MC34PF1550A4EPR2

NXP Semiconductors

MC34PF1550A4EPR2 by NXP Semiconductors is a Power Management IC with 40 terminals, operating b/w -40 to 105°C. It has a nominal voltage of 3.6V and supports up to 7 channels. This IC, suitable for power supply management circuits, comes in a square-shaped package ideal for surface mounting applications.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

105 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC34PF1550A4EP by NXP Semiconductors

MC34PF1550A4EP

NXP Semiconductors

MC34PF1550A4EP by NXP Semiconductors is a Power Management IC with 40 terminals, operating b/w -40 to 105 °C. It has a supply voltage range of 2.5V to 4.5V and features adjustable threshold voltage at +6.5V. This chip carrier is suitable for power supply management circuits in various applications due to its compact size and surface-mount capability.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

105 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC34PF1550A5EPR2 by NXP Semiconductors

MC34PF1550A5EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Nominal Supply Voltage (Vsup): 3.6 V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

105 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC34PF1550A5EP by NXP Semiconductors

MC34PF1550A5EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; JESD-609 Code: e4;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

105 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC34PF1550A6EPR2 by NXP Semiconductors

MC34PF1550A6EPR2

NXP Semiconductors

MC34PF1550A6EPR2 by NXP Semiconductors is a Power Management IC with 40 terminals, operating b/w -40 to 105°C. It features a nominal voltage of 3.6V and is suitable for power supply management circuits. The IC has a compact square shape, surface-mountable design, and adjustable threshold voltage up to +6.5V.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

105 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC34PF1550A6EP by NXP Semiconductors

MC34PF1550A6EP

NXP Semiconductors

MC34PF1550A6EP by NXP Semiconductors is a Power Management IC with 40 terminals, operating b/w -40 to 105 °C. It has a supply voltage range of 2.5V to 4.5V and features adjustable threshold voltage at +6.5V. Ideal for power supply management circuits in compact applications due to its small form factor and surface-mount capability.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

105 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC34PF1550A7EPR2 by NXP Semiconductors

MC34PF1550A7EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 40;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

105 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC34PF1550A7EP by NXP Semiconductors

MC34PF1550A7EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Operating Temperature: 105 Cel;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

105 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC33771BSA2AE/R2 by NXP Semiconductors

MC33771BSA2AE/R2

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Surface Mount: YES;

NO

POWER SUPPLY SUPPORT CIRCUIT

S-PQFP-G64

10 mm

8

1

64

105 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.6 mm

61.6 V

9.6 V

56 V

YES

MOS

INDUSTRIAL

GULL WING

.5 mm

QUAD

10 mm

MC33771BSP1AE/R2 by NXP Semiconductors

MC33771BSP1AE/R2

NXP Semiconductors

MC33771BSP1AE/R2 by NXP Semiconductors is a Power Management IC with 14 channels, Vsup range of 9.6V to 61.6V, and operating temp from -40°C to 105°C. Ideal for industrial applications requiring MOS technology in a compact square package with gull wing terminals.

NO

POWER SUPPLY SUPPORT CIRCUIT

S-PQFP-G64

10 mm

14

1

64

105 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.6 mm

61.6 V

9.6 V

56 V

YES

MOS

INDUSTRIAL

GULL WING

.5 mm

QUAD

10 mm

MC33771BSP2AE/R2 by NXP Semiconductors

MC33771BSP2AE/R2

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Surface Mount: YES;

NO

POWER SUPPLY SUPPORT CIRCUIT

S-PQFP-G64

10 mm

8

1

64

105 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.6 mm

61.6 V

9.6 V

56 V

YES

MOS

INDUSTRIAL

GULL WING

.5 mm

QUAD

10 mm

MC33771BTA2AE/R2 by NXP Semiconductors

MC33771BTA2AE/R2

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Surface Mount: YES;

NO

POWER SUPPLY SUPPORT CIRCUIT

S-PQFP-G64

10 mm

8

1

64

105 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.6 mm

61.6 V

9.6 V

56 V

YES

MOS

INDUSTRIAL

GULL WING

.5 mm

QUAD

10 mm

MC33771BTB1AE/R2 by NXP Semiconductors

MC33771BTB1AE/R2

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Surface Mount: YES;

NO

POWER SUPPLY SUPPORT CIRCUIT

S-PQFP-G64

10 mm

14

1

64

105 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.6 mm

61.6 V

9.6 V

56 V

YES

MOS

INDUSTRIAL

GULL WING

.5 mm

QUAD

10 mm

MC33771BTP2AE/R2 by NXP Semiconductors

MC33771BTP2AE/R2

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Surface Mount: YES;

NO

POWER SUPPLY SUPPORT CIRCUIT

S-PQFP-G64

10 mm

8

1

64

105 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.6 mm

61.6 V

9.6 V

56 V

YES

MOS

INDUSTRIAL

GULL WING

.5 mm

QUAD

10 mm

MC32PF1550A8EPR2 by NXP Semiconductors

MC32PF1550A8EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 40;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC32PF1550A8EP by NXP Semiconductors

MC32PF1550A8EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Nominal Threshold Voltage (V): +6.5V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

5 mm

3

7

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC34PF1550A0EPR2 by NXP Semiconductors

MC34PF1550A0EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; JESD-30 Code: S-PQCC-N40;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

105 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC34PF1550A0EP by NXP Semiconductors

MC34PF1550A0EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Length: 5 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

105 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC34PF1550A8EPR2 by NXP Semiconductors

MC34PF1550A8EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Channels: 7;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

105 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC34PF1550A8EP by NXP Semiconductors

MC34PF1550A8EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Length: 5 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

105 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC32PF4210A4ESR2 by NXP Semiconductors

MC32PF4210A4ESR2

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 56; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Supply Voltage (Vsup): 2.8 V;

YES

POWER SUPPLY SUPPORT CIRCUIT

S-PQCC-N56

8 mm

3

14

1

56

85 Cel

0 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

NO LEAD

.5 mm

QUAD

+2.4V

40

8 mm