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MC33771BSP1AE/R2

NXP Semiconductors

MC33771BSP1AE/R2 by NXP Semiconductors

MC33771BSP1AE/R2 by NXP Semiconductors is a Power Management IC with 14 channels, Vsup range of 9.6V to 61.6V, and operating temp from -40°C to 105°C. Ideal for industrial applications requiring MOS technology in a compact square package with gull wing terminals.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 6,932 parts In-Stock

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Anansix

USA . 2,772 parts In-Stock

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Digiode

USA . 537 parts In-Stock

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Nova Conductors

Japan . 39 parts In-Stock

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39

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Semicontronic

India . 475 parts In-Stock

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$3.500

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$3.412

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$3.395

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475

$3.500

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Corohmni

South Africa . 912 parts In-Stock

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$4.824

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Ampacity Inc.

Singapore . 240 parts In-Stock

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$5.500

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One Stop Electronics

USA . 1,127 parts In-Stock

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$6.500

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Aztec Data Supply Inc.

USA . 3,407 parts In-Stock

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$6.820

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AZTECH Wire

Italy . 692 parts In-Stock

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$14.933

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Microchip USA

USA . 3,253 parts In-Stock

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$41.240

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$40.650

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$40.360

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$40.060

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$40.060

Component Stockers USA

USA . 775 parts In-Stock

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$149.790

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Kepictronics

USA . 32,180 parts In-Stock

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Authorized Procurement Solutions

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Lixinc

USA . 19,743 parts In-Stock

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Futuretech Components

Singapore . 10,000 parts In-Stock

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UNI Independent Distributors

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Continental Prestige Electronics

USA . 4,708 parts In-Stock

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Argo Parts USA

USA . 3,678 parts In-Stock

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Corphita

USA . 3,322 parts In-Stock

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Robosynatics

Brazil . 950 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Unlock the power of advanced Power Management ICs with the MC33771BSP1AE/R2 by NXP Semiconductors. Designed with precision and reliability in mind, this product offers unparalleled performance in a compact package. Perfect for a wide range of applications, this innovative IC delivers efficient power supply support while ensuring optimal functionality. Experience the quality and value of NXP Semiconductors with the MC33771BSP1AE/R2. Elevate your projects to new heights with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Enables easy and efficient assembly onto circuit boards.

Nominal Supply Voltage (Vsup): 56 V

Suitable for applications requiring a stable supply voltage of 56 V.

No. of Terminals: 64

Offers flexibility in connecting various components within the system.

Maximum Operating Temperature: 105 °C

Ensures reliable operation even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Can withstand extremely low temperatures, making it suitable for a wide range of operating conditions.

Technology: MOS

Utilizing MOS technology, this product offers high efficiency and low power consumption.

Maximum Supply Voltage (Vsup): 61.6 V

Provides a safe operating range for the supply voltage, protecting the components from potential damage.

Technical Specifications

Power Management ICs MC33771BSP1AE/R2 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Channels:

14

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

61.6 V

Minimum Supply Voltage (Vsup):

9.6 V

Nominal Supply Voltage (Vsup):

56 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

10 mm

Trade Compliance

MC33771BSP1AE/R2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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