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MC33772CTA2AE

NXP Semiconductors

MC33772CTA2AE by NXP Semiconductors

MC33772CTA2AE by NXP Semiconductors is a Power Management IC with 48 terminals, operating temperature range of -40 to 105°C. It is a power supply support circuit used in applications requiring 4 channels and a min supply voltage of 6V.

Median Price

$8.460

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 250 parts In-Stock

1+ parts

$11.200

100+ parts

$7.210

1k+ parts

$5.820

10k+ parts

-

250

$11.200

$7.210

$5.820

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Verical

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

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$5.721

10k+ parts

$5.502

1,500

-

-

$5.721

$5.502

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$6.006

100+ parts

-

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550

$6.006

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Digiode

USA . 3,846 parts In-Stock

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$9.148

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3,846

$9.148

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Vyrian

USA . 4,034 parts In-Stock

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4,034

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Anansix

USA . 1,991 parts In-Stock

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1,991

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TME

Poland . 1,500 parts In-Stock

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-

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$6.630

10k+ parts

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1,500

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-

$6.630

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,543 parts In-Stock

1+ parts

$6.006

100+ parts

-

1k+ parts

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10k+ parts

$5.886

2,543

$6.006

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-

$5.886

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$6.006

100+ parts

$5.886

1k+ parts

-

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1,000

$6.006

$5.886

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AZTECH Wire

Italy . 224 parts In-Stock

1+ parts

$6.413

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224

$6.413

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Semicontronic

India . 82 parts In-Stock

1+ parts

$8.190

100+ parts

$7.985

1k+ parts

$7.944

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82

$8.190

$7.985

$7.944

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Ampacity Inc.

Singapore . 79 parts In-Stock

1+ parts

$8.190

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79

$8.190

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Corphita

USA . 2,605 parts In-Stock

1+ parts

$8.667

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2,605

$8.667

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Aztec Data Supply Inc.

USA . 4,770 parts In-Stock

1+ parts

$15.530

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4,770

$15.530

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Microchip USA

USA . 2,137 parts In-Stock

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$20.592

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2,137

$20.592

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Corohmni

South Africa . 4 parts In-Stock

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$24.456

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4

$24.456

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UNI Independent Distributors

Spain . 6,735 parts In-Stock

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Argo Parts USA

USA . 1,082 parts In-Stock

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1,082

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Overview

Discover the MC33772CTA2AE from NXP Semiconductors, a power management IC that stands out for its exceptional quality and performance. Designed by a trusted manufacturer, this IC offers numerous advantages that set it apart in its category. With its surface mount capability and compact package shape, it is perfect for a wide range of applications. Whether you need power supply support or require multiple channels, this IC has got you covered. Benefit from its high maximum operating temperature and low minimum supply voltage, ensuring reliability and efficiency. Experience the value and benefits this product brings to your projects with NXP Semiconductors' MC33772CTA2AE.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the power management IC, making it a reliable choice for various applications.

Surface Mount: YES

With surface mount capability, this power management IC offers easy and convenient installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 1

This power management IC integrates multiple functions into one component, simplifying the design and reducing the overall system complexity.

Package Shape: RECTANGULAR

The rectangular package shape ensures compatibility with standard mounting techniques, allowing for easy integration into existing designs.

No. of Terminals: 48

The high number of terminals provides ample connectivity options, enabling versatile application possibilities for the power management IC.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG

The flatpack package style combined with a heat sink/slug design helps dissipate heat efficiently, ensuring reliable operation even under high-load conditions.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, this power management IC can handle demanding environments and maintain stable performance.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range of -40°C ensures the power management IC's suitability for both extreme cold and normal operating conditions.

Terminal Position: QUAD

The quad terminal position allows for easy and secure connections during installation, ensuring proper functionality and minimizing the risk of connectivity issues.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This power management IC operates as a power supply support circuit, ensuring stable and efficient power delivery to the connected devices, making it an essential component for reliable power management.

Minimum Supply Voltage (Vsup): 6 V

With a minimum supply voltage of 6V, this power management IC can operate efficiently even with low input power sources, offering versatility and compatibility with various systems.

Maximum Time At Peak Reflow Temperature (s): 40

The power management IC can withstand the peak reflow temperature for up to 40 seconds during the soldering process, ensuring reliable assembly and reducing the risk of component damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature threshold of 260°C allows for proper soldering and bonding during the manufacturing process, ensuring secure connections and long-term reliability.

No. of Channels: 4

With four channels, this power management IC provides multiple output options, allowing for efficient distribution of power to different components, enhancing overall system performance.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and connection, ensuring a secure and reliable electrical interface, making it suitable for various applications.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that this power management IC has a moderate moisture sensitivity level, allowing for proper handling and soldering without requiring special precautions.

Maximum Supply Voltage (Vsup): 30 V

With a maximum supply voltage of 30V, this power management IC can handle higher input power sources, making it suitable for applications with higher voltage requirements.

Technical Specifications

Power Management ICs MC33772CTA2AE attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PQFP-G48

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MC33772CTA2AE Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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