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MC33772CTC0AE

NXP Semiconductors

MC33772CTC0AE by NXP Semiconductors

MC33772CTC0AE by NXP Semiconductors is a Power Management IC with 1 function. It has a package style of flatpack with heat sink/slug and 48 terminals. It is used as a power supply support circuit in applications requiring a min supply voltage of 6V and max operating temperature of 105°C.

Median Price

$9.630

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 45 parts In-Stock

1+ parts

$8.710

100+ parts

$6.060

1k+ parts

$5.720

10k+ parts

-

45

$8.710

$6.060

$5.720

-

DigiKey

USA . 745 parts In-Stock

1+ parts

$9.630

100+ parts

$6.372

1k+ parts

$5.784

10k+ parts

-

745

$9.630

$6.372

$5.784

-

Mouser Electronics

USA . 650 parts In-Stock

1+ parts

$9.630

100+ parts

$6.370

1k+ parts

$5.630

10k+ parts

-

650

$9.630

$6.370

$5.630

-

Newark

USA . 237 parts In-Stock

1+ parts

$11.710

100+ parts

$8.510

1k+ parts

$7.720

10k+ parts

-

237

$11.710

$8.510

$7.720

-

Element14

Singapore . 45 parts In-Stock

1+ parts

$14.570

100+ parts

$10.830

1k+ parts

$9.400

10k+ parts

-

45

$14.570

$10.830

$9.400

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 68 parts In-Stock

1+ parts

$6.972

100+ parts

-

1k+ parts

-

10k+ parts

-

68

$6.972

-

-

-

Digiode

USA . 908 parts In-Stock

1+ parts

$8.274

100+ parts

-

1k+ parts

-

10k+ parts

-

908

$8.274

-

-

-

Anansix

USA . 2,641 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,641

-

-

-

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Vyrian

USA . 2,476 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,476

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$6.972

100+ parts

-

1k+ parts

$6.623

10k+ parts

$6.484

1,000

$6.972

-

$6.623

$6.484

Ampacity Inc.

Singapore . 132 parts In-Stock

1+ parts

$7.400

100+ parts

-

1k+ parts

-

10k+ parts

-

132

$7.400

-

-

-

Semicontronic

India . 21 parts In-Stock

1+ parts

$7.400

100+ parts

$7.215

1k+ parts

$7.178

10k+ parts

-

21

$7.400

$7.215

$7.178

-

Corphita

USA . 600 parts In-Stock

1+ parts

$7.839

100+ parts

-

1k+ parts

-

10k+ parts

-

600

$7.839

-

-

-

AZTECH Wire

Italy . 508 parts In-Stock

1+ parts

$8.155

100+ parts

-

1k+ parts

-

10k+ parts

-

508

$8.155

-

-

-

Continental Prestige Electronics

USA . 160 parts In-Stock

1+ parts

$9.220

100+ parts

$6.580

1k+ parts

-

10k+ parts

-

160

$9.220

$6.580

-

-

Aztec Data Supply Inc.

USA . 1,285 parts In-Stock

1+ parts

$14.150

100+ parts

-

1k+ parts

-

10k+ parts

-

1,285

$14.150

-

-

-

Corohmni

South Africa . 42 parts In-Stock

1+ parts

$24.970

100+ parts

-

1k+ parts

-

10k+ parts

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42

$24.970

-

-

-

Microchip USA

USA . 962 parts In-Stock

1+ parts

$31.220

100+ parts

-

1k+ parts

-

10k+ parts

-

962

$31.220

-

-

-

Argo Parts USA

USA . 4,477 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,477

-

-

-

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UNI Independent Distributors

Spain . 1,889 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,889

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Overview

Enhance your power management capabilities with the MC33772CTC0AE by NXP Semiconductors. As a leading manufacturer in the industry, NXP is known for delivering high-quality and reliable solutions. With its advanced technology, this Power Management IC offers exceptional performance and efficiency. Whether you're designing consumer electronics, automotive systems, or industrial applications, this product will provide the reliability and flexibility you need. Say goodbye to power supply issues and hello to seamless operation. Experience the value, benefits, and advantages of the MC33772CTC0AE today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is durable and allows for efficient heat dissipation, making this product a reliable choice for power management.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into various electronic devices.

Package Shape: RECTANGULAR

The rectangular shape is compact and space-saving, making it ideal for applications where board space is limited.

No. of Terminals: 48

With 48 terminals, this power management IC provides versatile connectivity options for multiple components and circuits.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG

The flatpack style combined with a heat sink/slug design ensures efficient thermal management for optimal performance.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105 °C ensures reliability and stability in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows for use in a wide range of temperature conditions.

Terminal Position: QUAD

The quad terminal position provides a secure connection for stability and reliability in power distribution.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This power management IC is designed specifically for power supply support, ensuring efficient and stable power delivery.

Minimum Supply Voltage (Vsup): 6 V

With a minimum supply voltage of 6V, this IC can operate effectively with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and assembly for reliable performance.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C allows for secure and durable solder joints during assembly.

Terminal Form: GULL WING

The gull wing terminal form provides a strong and reliable connection for stable power distribution.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this IC is suitable for a variety of environmental conditions without compromising performance.

Maximum Supply Voltage (Vsup): 30 V

The high maximum supply voltage of 30V allows for compatibility with a wide range of power sources and applications.

Technical Specifications

Power Management ICs MC33772CTC0AE attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PQFP-G48

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MC33772CTC0AE Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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