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MC33772CTP2AE

NXP Semiconductors

MC33772CTP2AE by NXP Semiconductors

MC33772CTP2AE by NXP Semiconductors is a Power Management IC with 4 channels, operating temperature range of -40 to 105°C. It has a supply voltage range from 6V to 30V and comes in a rectangular flatpack package suitable for power supply support circuits.

Median Price

$10.555

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 92 parts In-Stock

1+ parts

$8.129

100+ parts

$6.535

1k+ parts

$6.175

10k+ parts

-

92

$8.129

$6.535

$6.175

-

Farnell

UK . 1,009 parts In-Stock

1+ parts

$9.900

100+ parts

$7.010

1k+ parts

$6.690

10k+ parts

-

1,009

$9.900

$7.010

$6.690

-

Newark

USA . 871 parts In-Stock

1+ parts

$11.210

100+ parts

$8.010

1k+ parts

$6.490

10k+ parts

-

871

$11.210

$8.010

$6.490

-

Mouser Electronics

USA . 359 parts In-Stock

1+ parts

$11.300

100+ parts

$7.550

1k+ parts

$6.860

10k+ parts

-

359

$11.300

$7.550

$6.860

-

DigiKey

USA . 325 parts In-Stock

1+ parts

$11.300

100+ parts

$7.543

1k+ parts

$6.866

10k+ parts

-

325

$11.300

$7.543

$6.866

-

Element14

Singapore . 1,009 parts In-Stock

1+ parts

$16.750

100+ parts

$12.530

1k+ parts

$11.970

10k+ parts

-

1,009

$16.750

$12.530

$11.970

-

Verical

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.551

10k+ parts

-

30,000

-

-

$5.551

-

Rochester

USA . 25 parts In-Stock

1+ parts

-

100+ parts

$5.680

1k+ parts

$5.080

10k+ parts

$4.780

25

-

$5.680

$5.080

$4.780

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 163 parts In-Stock

1+ parts

$5.994

100+ parts

-

1k+ parts

-

10k+ parts

-

163

$5.994

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$7.935

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$7.935

-

-

-

Anansix

USA . 2,563 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,563

-

-

-

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Vyrian

USA . 198 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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198

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 445 parts In-Stock

1+ parts

$5.360

100+ parts

$5.226

1k+ parts

$5.199

10k+ parts

-

445

$5.360

$5.226

$5.199

-

Ampacity Inc.

Singapore . 121 parts In-Stock

1+ parts

$5.360

100+ parts

-

1k+ parts

-

10k+ parts

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121

$5.360

-

-

-

Aztec Data Supply Inc.

USA . 3,785 parts In-Stock

1+ parts

$5.670

100+ parts

-

1k+ parts

-

10k+ parts

-

3,785

$5.670

-

-

-

Corphita

USA . 2,261 parts In-Stock

1+ parts

$5.679

100+ parts

-

1k+ parts

-

10k+ parts

-

2,261

$5.679

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

$7.776

100+ parts

-

1k+ parts

$7.465

10k+ parts

-

100

$7.776

-

$7.465

-

Continental Prestige Electronics

USA . 24 parts In-Stock

1+ parts

$10.900

100+ parts

$7.760

1k+ parts

-

10k+ parts

-

24

$10.900

$7.760

-

-

Corohmni

South Africa . 166 parts In-Stock

1+ parts

$21.424

100+ parts

-

1k+ parts

-

10k+ parts

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166

$21.424

-

-

-

Microchip USA

USA . 1,219 parts In-Stock

1+ parts

$32.816

100+ parts

-

1k+ parts

-

10k+ parts

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1,219

$32.816

-

-

-

Lixinc

USA . 7,871 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,871

-

-

-

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Argo Parts USA

USA . 3,450 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,450

-

-

-

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UNI Independent Distributors

Spain . 419 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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419

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Overview

Upgrade your power management systems with the MC33772CTP2AE from NXP Semiconductors. This high-quality Power Management IC offers unmatched reliability and efficiency, making it the ideal choice for a wide range of applications. With its advanced technology and durable construction, this product ensures optimal performance in various conditions. Experience the value and benefits of seamless power supply support with the MC33772CTP2AE, providing customers with a reliable solution that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and insulation, ensuring the safety and longevity of the Power Management IC.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into various electronic devices, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor for easy handling and installation in electronic circuits.

No. of Terminals: 48

Having 48 terminals allows for versatile connectivity options and supports complex power management requirements.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG

Flatpack style with a heat sink/slug design helps in efficient heat dissipation, preventing overheating and enhancing the overall performance of the IC.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this Power Management IC can withstand demanding operating conditions without degradation in performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in cold environments, making it suitable for a wide range of applications.

Terminal Position: QUAD

Quad terminal configuration offers enhanced connectivity options and supports multi-channel power management functions.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically as a power supply support circuit, this IC provides efficient and reliable power management capabilities for various electronic devices.

Minimum Supply Voltage (Vsup): 6 V

Having a low minimum supply voltage allows for operation in low-power situations, ensuring compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature ensures proper soldering during assembly, preventing damage to the IC and ensuring reliable performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for proper soldering of the IC during assembly, ensuring a strong and reliable connection to the PCB.

No. of Channels: 4

With four channels, this Power Management IC can support multiple power management functions simultaneously, offering versatility and flexibility in electronic designs.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable solder connections, ensuring stable operation and longevity of the IC.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the IC can withstand moderate exposure to moisture during storage and handling, enhancing its reliability in various environments.

Maximum Supply Voltage (Vsup): 30 V

With a high maximum supply voltage, this Power Management IC can handle a wide range of input voltage levels, making it suitable for diverse power supply applications.

Technical Specifications

Power Management ICs MC33772CTP2AE attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PQFP-G48

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MC33772CTP2AE Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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