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MC34PF1510A4EP

NXP Semiconductors

MC34PF1510A4EP by NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: NICKEL PALLADIUM GOLD; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3;

Median Price

$7.230

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 365 parts In-Stock

1+ parts

$7.230

100+ parts

$4.350

1k+ parts

$3.390

10k+ parts

-

365

$7.230

$4.350

$3.390

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,835 parts In-Stock

1+ parts

$4.056

100+ parts

-

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3,835

$4.056

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Vyrian

USA . 4,269 parts In-Stock

1+ parts

-

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4,269

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Anansix

USA . 2,201 parts In-Stock

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2,201

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,048 parts In-Stock

1+ parts

$3.843

100+ parts

-

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2,048

$3.843

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Microchip USA

USA . 1,958 parts In-Stock

1+ parts

$21.370

100+ parts

$21.240

1k+ parts

$21.180

10k+ parts

$21.110

1,958

$21.370

$21.240

$21.180

$21.110

UNI Independent Distributors

Spain . 8,274 parts In-Stock

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8,274

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Perfect Parts

USA . 1,098 parts In-Stock

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1,098

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Technical Specifications

Power Management ICs MC34PF1510A4EP attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

NICKEL PALLADIUM GOLD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MC34PF1510A4EP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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