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MC34PF3000A0EP

NXP Semiconductors

MC34PF3000A0EP by NXP Semiconductors

MC34PF3000A0EP by NXP Semiconductors is a 48-terminal Power Management IC with 12 channels. It operates b/w -40 to 105°C, supporting a supply voltage range of 2.8-4.5V. Ideal for industrial applications, this MOS technology chip carrier has a very thin profile and adjustable threshold feature.

Median Price

$6.415

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Arrow

USA . 957 parts In-Stock

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$3.620

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Chip1Stop

Japan . 83 parts In-Stock

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$4.780

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$4.780

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Mouser Electronics

USA . 254 parts In-Stock

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$8.050

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$5.430

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$5.180

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$8.050

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DigiKey

USA . 1,377 parts In-Stock

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$8.780

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$5.775

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$5.353

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$5.226

1,377

$8.780

$5.775

$5.353

$5.226

Verical

USA . 957 parts In-Stock

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Avnet

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EBV Elektronik

Germany . 520 parts In-Stock

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Distrelec

Netherlands . 260 parts In-Stock

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Digiode

USA . 612 parts In-Stock

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$4.940

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Nova Conductors

Japan . 300 parts In-Stock

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$6.345

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$6.345

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Bristol Electronics

USA . 24 parts In-Stock

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$8.960

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Anansix

USA . 2,566 parts In-Stock

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Rebound Electronics

UK . 1,429 parts In-Stock

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IBS Electronics

USA . 520 parts In-Stock

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$5.638

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Vyrian

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Flip Electronics

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Connect4Technologies Inc.

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Ampacity Inc.

Singapore . 628 parts In-Stock

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$4.370

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Corphita

USA . 4,053 parts In-Stock

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$4.680

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Continental Prestige Electronics

USA . 4,600 parts In-Stock

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$6.096

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$5.974

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$6.096

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$5.974

Semicontronic

India . 220 parts In-Stock

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$9.510

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$9.272

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$9.225

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$9.510

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Corohmni

South Africa . 198 parts In-Stock

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$10.577

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Aztec Data Supply Inc.

USA . 3,825 parts In-Stock

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$11.152

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Microchip USA

USA . 2,314 parts In-Stock

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UNI Independent Distributors

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A-Z Elektronik GmbH

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QUARKTWIN TECHNOLOGY LTD

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Argo Parts USA

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S.R.D Solutions

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Authorized Procurement Solutions

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Perfect Parts

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Overview

Elevate your power management solutions with the MC34PF3000A0EP by NXP Semiconductors. Designed with precision and quality in mind, this Power Management IC offers unparalleled efficiency and reliability for a wide range of applications. With its surface mount capability and compact package shape, this innovative product provides customers with enhanced performance and seamless integration. Say goodbye to common power supply issues and hello to a more streamlined and optimized system. Experience the difference with NXP Semiconductors.

Feature Benefit Bullets

Surface Mount: YES

Makes it easy to mount on PCBs for compact designs.

Package Shape: SQUARE

Enables efficient use of PCB space.

Nominal Supply Voltage (Vsup) 3.6 V

Ideal voltage for optimal performance.

No. of Terminals: 48

Provides flexibility in connectivity options.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Ensures efficient heat dissipation and compact design.

Maximum Operating Temperature: 105 °C

Allows for reliable operation in high temperature environments.

Minimum Operating Temperature: -40 °C

Ensures functionality in wide temperature range.

Terminal Finish: TIN

Provides good conductivity for reliable connections.

Terminal Position: QUAD

Simplifies PCB layout and connections.

Maximum Seated Height: 0.9 mm

Low profile design for space-constrained applications.

Width (mm): 7 mm

Compact size for easy integration into designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Provides necessary support for power supply management.

Minimum Supply Voltage (Vsup): 2.8 V

Allows for operation at lower voltages for energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures reliable soldering during manufacturing.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly.

Length: 7 mm

Compact dimensions for space-saving designs.

Temperature Grade: INDUSTRIAL

Suitable for industrial temperature requirements.

No. of Channels: 12

Supports multiple channels for versatile applications.

Technology: MOS

Utilizes MOS technology for efficient power management.

Terminal Form: NO LEAD

Lead-free design for environmental compliance.

Terminal Pitch: 0.5 mm

Fine pitch for dense PCB layouts.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture damage during storage and handling.

Maximum Supply Voltage (Vsup): 4.5 V

Can handle higher supply voltages for flexibility.

Adjustable Threshold: YES

Allows for customization of threshold settings.

Technical Specifications

Power Management ICs MC34PF3000A0EP attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRE SUPPLY VOLTAGE 3.7V TO 5.5V

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

12

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7 mm

Trade Compliance

MC34PF3000A0EP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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