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MC34PF4210A1ESR2

NXP Semiconductors

MC34PF4210A1ESR2 by NXP Semiconductors

MC34PF4210A1ESR2 by NXP Semiconductors is a Power Management IC with 56 terminals, operating voltage range of 2.8V to 4.5V, and industrial temperature grade up to 105°C. It features 14 channels in a square chip carrier package suitable for power supply support circuits.

Median Price

$7.511

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,884 parts In-Stock

1+ parts

$11.570

100+ parts

$7.740

1k+ parts

$7.512

10k+ parts

$6.874

3,884

$11.570

$7.740

$7.512

$6.874

Arrow

USA . 4,000 parts In-Stock

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-

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$7.511

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$7.511

Verical

USA . 4,000 parts In-Stock

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$5.309

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$5.309

Distributors (In-Stock)

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Nova Conductors

Japan . 91 parts In-Stock

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$7.092

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91

$7.092

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Digiode

USA . 1,827 parts In-Stock

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$9.756

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Chip Stock

USA . 5,488 parts In-Stock

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Vyrian

USA . 3,678 parts In-Stock

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Cyclops Electronics Ltd

UK . 908 parts In-Stock

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Anansix

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Distributors (Availability)

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Continental Prestige Electronics

USA . 1,264 parts In-Stock

1+ parts

$7.092

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$6.950

1,264

$7.092

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$6.950

Ampacity Inc.

Singapore . 3,542 parts In-Stock

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$8.730

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$8.730

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Semicontronic

India . 3,537 parts In-Stock

1+ parts

$8.730

100+ parts

$8.512

1k+ parts

$8.468

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3,537

$8.730

$8.512

$8.468

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Corphita

USA . 3,917 parts In-Stock

1+ parts

$9.243

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$9.243

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Aztec Data Supply Inc.

USA . 2,807 parts In-Stock

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$12.850

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$12.850

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Modulus Dynamics

Lithuania . 3,213 parts In-Stock

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$14.374

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$14.374

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$14.374

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$14.374

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Microchip USA

USA . 5,728 parts In-Stock

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$16.017

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Corohmni

South Africa . 22 parts In-Stock

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$18.411

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22

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$23.793

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$22.603

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$22.603

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$23.793

$22.603

$22.603

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Perfect Parts

USA . 8,960 parts In-Stock

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UNI Independent Distributors

Spain . 4,273 parts In-Stock

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Lixinc

USA . 4,145 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$6.950

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$6.737

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$6.595

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$6.737

$6.595

Robosynatics

Brazil . 1,607 parts In-Stock

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Lucentia Tech

USA . 1,607 parts In-Stock

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$5.046

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$4.943

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$4.943

1,607

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$4.943

$4.943

Argo Parts USA

USA . 1,433 parts In-Stock

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Futuretech Components

Singapore . 100 parts In-Stock

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Overview

Elevate your power management capabilities with the MC34PF4210A1ESR2 by NXP Semiconductors. As a trusted manufacturer in the industry, NXP delivers top-quality Power Management ICs that are surface mountable and feature a square package shape for easy integration. With a wide operating temperature range from -40°C to 105°C and a nominal supply voltage of 3.6V, this IC is perfect for industrial applications requiring reliable power supply support. Experience the benefits of adjustable threshold settings, 14 channels, and a compact design that maximizes efficiency without compromising performance. Upgrade your power management solutions today with NXP Semiconductors.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and reducing overall manufacturing costs.

Nominal Supply Voltage (Vsup): 3.6 V

Ideal voltage level for powering various electronic devices, ensuring compatibility and optimal performance.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides excellent thermal management capabilities, ensuring stable and reliable operation even under high temperature conditions.

Maximum Operating Temperature: 105 °C

Suitable for industrial applications where higher temperatures may be encountered, ensuring reliability in harsh environments.

Minimum Operating Temperature: -40 °C

Ensures functionality even in extremely cold environments, making it versatile for a wide range of operating conditions.

No. of Channels: 14

Offers ample channels for power distribution and management, making it suitable for complex electronic systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for higher density PCB designs, enabling compact and efficient electronic devices.

Adjustable Threshold: YES

Allows for customization of voltage thresholds, enabling flexibility in power management and protection settings.

Technical Specifications

Power Management ICs MC34PF4210A1ESR2 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N56

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

14

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

8 mm

Trade Compliance

MC34PF4210A1ESR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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