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NXP Semiconductors Power Management ICs 465

Power Management ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Adjustable Threshold Other IC type Nominal Bandwidth Control Mode Control Technique Maximum Input Voltage Minimum Input Voltage Nominal Input Voltage JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage (Vsup) Maximum Negative Input Voltage Normal Position (V) No. of Channels No. of Functions No. of Outputs No. of Terminals Maximum On-state Resistance (Ron) Maximum Operating Temperature Minimum Operating Temperature Output (V) Maximum Output Current Maximum Output Voltage Minimum Output Voltage Nominal Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Protection(s) Qualification Main Out Ripple Voltage Screening Level Maximum Seated Height Sub-Category Maximum Supply Current (Isup) Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage (Vsup) Surface Mount Maximum Switch-on Time Switcher Config Switching (V) Maximum Switching Frequency Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Nominal Threshold Voltage (V) Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Maximum Total Power Output Trim or Adjustable Output (V) Width (mm)
MC34PF8101A0EPR2 by NXP Semiconductors

MC34PF8101A0EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.7 V

5 V

YES

INDUSTRIAL

NO LEAD

.5 mm

QUAD

40

8 mm

MC34PF8101A0EP by NXP Semiconductors

MC34PF8101A0EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.7 V

5 V

YES

INDUSTRIAL

NO LEAD

.5 mm

QUAD

40

8 mm

MC32PF1550A0EPR2 by NXP Semiconductors

MC32PF1550A0EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Channels: 7;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

5 mm

3

7

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC32PF1550A9EPR2 by NXP Semiconductors

MC32PF1550A9EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Form: NO LEAD;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC32PF1550A9EP by NXP Semiconductors

MC32PF1550A9EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Supply Voltage (Vsup): 2.5 V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N40

e4

5 mm

3

7

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.5 V

3.6 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+6.5V

40

5 mm

MC33PF8100FJESR2 by NXP Semiconductors

MC33PF8100FJESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Position: QUAD;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

12

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.5 V

5 V

YES

TIN

NO LEAD

.5 mm

QUAD

+2.8V

40

8 mm

MC33PF8100FJES by NXP Semiconductors

MC33PF8100FJES

NXP Semiconductors

MC33PF8100FJES by NXP Semiconductors is a Power Management IC with 12 channels, 56 terminals, and adjustable threshold voltage of +2.8V. It operates b/w -40 to 105 °C and has a package style of CHIP CARRIER. Ideal for power supply management circuits in various applications.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

12

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.5 V

5 V

YES

TIN

NO LEAD

.5 mm

QUAD

+2.8V

40

8 mm

MVR5510AMBA0ESR2 by NXP Semiconductors

MVR5510AMBA0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMBALES by NXP Semiconductors

MVR5510AMBALES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Peak Reflow Temperature (C): 260;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMBALESR2 by NXP Semiconductors

MVR5510AMBALESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMBANES by NXP Semiconductors

MVR5510AMBANES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Width (mm): 8 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMBANESR2 by NXP Semiconductors

MVR5510AMBANESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Peak Reflow Temperature (C): 260;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMDA0ESR2 by NXP Semiconductors

MVR5510AMDA0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Operating Temperature: 125 Cel;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMDALES by NXP Semiconductors

MVR5510AMDALES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Nominal Threshold Voltage (V): +7.5V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMDALESR2 by NXP Semiconductors

MVR5510AMDALESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Nominal Threshold Voltage (V): +7.5V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMDANES by NXP Semiconductors

MVR5510AMDANES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMDANESR2 by NXP Semiconductors

MVR5510AMDANESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Form: NO LEAD;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMMA0ESR2 by NXP Semiconductors

MVR5510AMMA0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Pitch: .5 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMMALES by NXP Semiconductors

MVR5510AMMALES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 3;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMMALESR2 by NXP Semiconductors

MVR5510AMMALESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Width (mm): 8 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMMANES by NXP Semiconductors

MVR5510AMMANES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Seated Height: 1 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

8 mm

MVR5510AMMANESR2 by NXP Semiconductors

MVR5510AMMANESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Nominal Threshold Voltage (V): +7.5V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

8 mm

MVR5510AVMA0EPR2 by NXP Semiconductors

MVR5510AVMA0EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AVMALEP by NXP Semiconductors

MVR5510AVMALEP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Functions: 1;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

8 mm

MVR5510AVMALEPR2 by NXP Semiconductors

MVR5510AVMALEPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Adjustable Threshold: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

8 mm

MVR5510AVMANEP by NXP Semiconductors

MVR5510AVMANEP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Supply Voltage (Vsup): 2.7 V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

8 mm

MVR5510AVMANEPR2 by NXP Semiconductors

MVR5510AVMANEPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

8 mm

MF1S5000XDA4/V1J by NXP Semiconductors

MF1S5000XDA4/V1J

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Shape: RECTANGULAR; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

NO

POWER SUPPLY SUPPORT CIRCUIT

R-PXMA-N16

1

1

16

70 Cel

-25 Cel

PLASTIC/EPOXY

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

YES

OTHER

NO LEAD

UNSPECIFIED

NOT SPECIFIED

MF1S5000XDA8/V1J by NXP Semiconductors

MF1S5000XDA8/V1J

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 14; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Form: NO LEAD;

NO

POWER SUPPLY SUPPORT CIRCUIT

R-PXMA-N14

1

1

14

70 Cel

-25 Cel

PLASTIC/EPOXY

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

YES

OTHER

NO LEAD

UNSPECIFIED

NOT SPECIFIED

TEA1506T/N1,118 by NXP Semiconductors

TEA1506T/N1,118

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE;

YES

POWER SUPPLY SUPPORT CIRCUIT

R-PDSO-G14

e4

8.65 mm

1

1

14

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

1.75 mm

15 V

YES

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

3.9 mm

UBA2025T/N1,518 by NXP Semiconductors

UBA2025T/N1,518

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;

NO

POWER SUPPLY SUPPORT CIRCUIT

R-PDSO-G16

10.3 mm

1

1

16

150 Cel

-40 Cel

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

11

Not Qualified

2.65 mm

Switching Regulator or Controllers

11 V

YES

AUTOMOTIVE

GULL WING

1.27 mm

DUAL

7.5 mm

UBA2028T/N1,518 by NXP Semiconductors

UBA2028T/N1,518

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;

NO

POWER SUPPLY SUPPORT CIRCUIT

R-PDSO-G20

12.8 mm

1

1

20

80 Cel

-25 Cel

PLASTIC/EPOXY

SOP

SOP20,.4

RECTANGULAR

SMALL OUTLINE

13

Not Qualified

2.65 mm

Switching Regulator or Controllers

13.6 V

8.6 V

13 V

YES

COMMERCIAL EXTENDED

GULL WING

1.27 mm

DUAL

7.5 mm

NX1A4WPZ by NXP Semiconductors

NX1A4WPZ

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 42; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PBGA-B42

3.56 mm

1

1

1

42

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.61 mm

18 V

6.1 V

YES

INDUSTRIAL

BALL

.5 mm

BOTTOM

3.41 mm

NX2A4WPZ by NXP Semiconductors

NX2A4WPZ

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 42; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PBGA-B42

3.56 mm

1

3

1

42

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.61 mm

18 V

6.1 V

YES

INDUSTRIAL

BALL

.5 mm

BOTTOM

3.41 mm

NXQ1TXA5/404J by NXP Semiconductors

NXQ1TXA5/404J

NXP Semiconductors

NXQ1TXA5/404J by NXP Semiconductors is a Power Management IC with 32 terminals, operating voltage of 3.5-5.25V, and max current of 5000mA. It is used in power supply support circuits due to its compact square shape, low profile design, and surface mount capability for efficient heat dissipation.

SEATED HEIGHT-NOM

NO

POWER SUPPLY SUPPORT CIRCUIT

S-PQCC-N32

5 mm

1

2

1

32

85 Cel

-20 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.5/5.25

Not Qualified

.85 mm

Power Management Circuits

5000 mA

5.25 V

3.5 V

5 V

YES

OTHER

NO LEAD

.5 mm

QUAD

5 mm

MC32PF3001A1EPR2 by NXP Semiconductors

MC32PF3001A1EPR2

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N48

e3

7 mm

3

10

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

40

7 mm

MC32PF3001A1EP by NXP Semiconductors

MC32PF3001A1EP

NXP Semiconductors

MC32PF3001A1EP by NXP Semiconductors is a Power Management IC with 48 terminals, operating b/w -40 to 85°C. It supports 10 channels, has an adjustable threshold, and a supply voltage range of 2.8V to 4.5V. Ideal for industrial applications requiring precise power supply support circuits in compact square chip carrier packages.

OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N48

e3

7 mm

3

10

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

40

7 mm

MC32PF3001A2EPR2 by NXP Semiconductors

MC32PF3001A2EPR2

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N48

e3

7 mm

3

10

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

40

7 mm

MC32PF3001A2EP by NXP Semiconductors

MC32PF3001A2EP

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N48

e3

7 mm

3

10

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

40

7 mm

MC32PF3001A3EPR2 by NXP Semiconductors

MC32PF3001A3EPR2

NXP Semiconductors

MC32PF3001A3EPR2 by NXP Semiconductors is a Power Management IC with 48 terminals, operating at -40 to 85°C. It supports 10 channels, has a supply voltage range of 2.8V to 4.5V, and features an adjustable threshold. Ideal for industrial applications requiring precise power supply support circuits in compact spaces.

OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N48

e3

7 mm

3

10

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

40

7 mm

MC32PF3001A3EP by NXP Semiconductors

MC32PF3001A3EP

NXP Semiconductors

MC32PF3001A3EP by NXP Semiconductors is a Power Management IC with 48 terminals, operating at -40 to 85°C. It has a supply voltage range of 2.8V to 4.5V and features adjustable threshold with 10 channels for industrial applications in compact square package style.

OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N48

e3

7 mm

3

10

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

40

7 mm

MC32PF3001A4EPR2 by NXP Semiconductors

MC32PF3001A4EPR2

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N48

e3

7 mm

3

10

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

40

7 mm

MC32PF3001A4EP by NXP Semiconductors

MC32PF3001A4EP

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N48

e3

7 mm

3

10

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

40

7 mm

MC32PF3001A5EPR2 by NXP Semiconductors

MC32PF3001A5EPR2

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N48

e3

7 mm

3

10

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

40

7 mm

MC32PF3001A5EP by NXP Semiconductors

MC32PF3001A5EP

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N48

e3

7 mm

3

10

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

40

7 mm

MC32PF3001A6EPR2 by NXP Semiconductors

MC32PF3001A6EPR2

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N48

e3

7 mm

3

10

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

40

7 mm

MC32PF3001A6EP by NXP Semiconductors

MC32PF3001A6EP

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N48

e3

7 mm

3

10

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

40

7 mm

MC32PF3001A7EPR2 by NXP Semiconductors

MC32PF3001A7EPR2

NXP Semiconductors

MC32PF3001A7EPR2 by NXP Semiconductors is a Power Management IC with 10 channels, adjustable threshold, and 3.6V nominal voltage. Ideal for industrial applications, it features a square package shape, -40 to 85°C operating temperature range, and surface mount capability.

OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N48

e3

7 mm

3

10

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

40

7 mm