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NX2A4WPZ

NXP Semiconductors

NX2A4WPZ by NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 42; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,463 parts In-Stock

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4,463

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Digiode

USA . 2,891 parts In-Stock

1+ parts

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2,891

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Anansix

USA . 1,783 parts In-Stock

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1,783

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Chip Stock

USA . 1,035 parts In-Stock

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1,035

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,300 parts In-Stock

1+ parts

$4.500

100+ parts

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1,300

$4.500

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Microchip USA

USA . 103 parts In-Stock

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$6.188

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103

$6.188

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AZTECH Wire

Italy . 372 parts In-Stock

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$21.500

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372

$21.500

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Corphita

USA . 553 parts In-Stock

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553

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UNI Independent Distributors

Spain . 522 parts In-Stock

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522

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Vigor

Singapore . 216 parts In-Stock

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216

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Technical Specifications

Power Management ICs NX2A4WPZ attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B42

Length:

3.56 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

42

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.61 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6.1 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width (mm):

3.41 mm

Trade Compliance

NX2A4WPZ Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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