Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MVR5510AMMA6ESR2
NXP Semiconductors
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Width (mm): 8 mm;
YES
POWER SUPPLY MANAGEMENT CIRCUIT
S-PQCC-N56
8 mm
3
9
1
56
125 Cel
-40 Cel
PLASTIC/EPOXY
HVQCCN
SQUARE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
260
AEC-Q100
1 mm
60 V
2.7 V
NO LEAD
.5 mm
QUAD
+7.5V
40
MVR5510AMBAHESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;
MVR5510AMBA6ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Screening Level: AEC-Q100;
MVR5510AVMA4EPR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 3;
105 Cel
MWCT1213VLL
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Surface Mount: YES; Width (mm): 14 mm;
S-PQFP-G100
14 mm
82
100
LFQFP
QFP100,.63SQ,20
FLATPACK, LOW PROFILE, FINE PITCH
1.7 mm
3.6 V
3.3 V
GULL WING
+2.73
MWCT1213AVLH
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Surface Mount: YES; Adjustable Threshold: YES;
S-PQFP-G64
10 mm
54
64
QFP64,.47SQ,20
1.6 mm
MC33772CTC1AE
MC33772CTC1AE by NXP Semiconductors is a Power Management IC with 48 terminals, operating from -40 to 105°C. It supports power supply circuits, with a min Vsup of 6V and max Vsup of 30V. Ideal for applications requiring high-temperature operation and surface mount compatibility.
NO
POWER SUPPLY SUPPORT CIRCUIT
R-PQFP-G48
48
HQFP
RECTANGULAR
FLATPACK, HEAT SINK/SLUG
30 V
6 V
MC33772CTP1AE
MC33772CTP1AE by NXP Semiconductors is a Power Management IC with 6 channels, operating temperature range of -40 to 105°C. It has 48 terminals in a rectangular package style suitable for power supply support circuits. The IC supports a min supply voltage of 6V and max of 30V, making it ideal for various electronic applications.
6
MC33771CTA2AE
MC33771CTA2AE by NXP Semiconductors is a Power Management IC with 8 channels, operating b/w -40 to 105°C. It has a supply voltage range of 9.6V to 61.6V and comes in a rectangular flatpack package style suitable for power supply support circuits.
R-PQFP-G64
8
61.6 V
9.6 V
MC33772CTA2AE
MC33772CTA2AE by NXP Semiconductors is a Power Management IC with 48 terminals, operating temperature range of -40 to 105°C. It is a power supply support circuit used in applications requiring 4 channels and a min supply voltage of 6V.
4
MC33772CTC0AE
MC33772CTC0AE by NXP Semiconductors is a Power Management IC with 1 function. It has a package style of flatpack with heat sink/slug and 48 terminals. It is used as a power supply support circuit in applications requiring a min supply voltage of 6V and max operating temperature of 105°C.
MC33772CTA1AE
MC33772CTA1AE by NXP Semiconductors is a Power Management IC with 6 channels, operating from -40 to 105°C. It has a supply voltage range of 6-30V and comes in a rectangular package with 48 terminals. Ideal for power supply support circuits, it features gull wing terminals and is surface mountable.
MC33771CTP2AE
MC33771CTP2AE by NXP Semiconductors is a Power Management IC with 8 channels, operating temperature range of -40 to 105°C. It has 64 terminals in a rectangular package style suitable for power supply support circuits. The IC supports a min supply voltage of 9.6V and can handle peak reflow temperatures up to 260°C.
MC33771CTA1AER2
MC33771CTA1AER2 by NXP Semiconductors is a Power Management IC with 14 channels, Vsup range of 9.6-61.6V, and AEC-Q100 screening for automotive applications. It features MOS technology, operates b/w -40 to 105°C, and has a compact FLATPACK package suitable for power supply support circuits in vehicles.
14
HLFQFP
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
56 V
MOS
8.5
MC33771CTA2AER2
MC33771CTA2AER2 by NXP Semiconductors is a Power Management IC with 8 channels, Vsup range of 9.6V to 61.6V, and AEC-Q100 screening for automotive applications. It features MOS technology, operates b/w -40°C to 105°C, and has a compact FLATPACK package style suitable for power supply support circuits in vehicles.
MC33771CTP2AER2
MC33771CTP2AER2 by NXP Semiconductors is a Power Management IC with 8 channels, Vsup range of 9.6V to 61.6V, and AEC-Q100 screening for automotive applications. It features MOS technology, operates b/w -40°C to 105°C, and has a compact FLATPACK package with GULL WING terminals suitable for power supply support circuits.
MC33771CTP1AER2
MC33771CTP1AER2 by NXP Semiconductors is a Power Management IC with 14 channels, Vsup ranging from 9.6V to 61.6V, and operating temperature of -40°C to 105°C. Ideal for power supply support circuits in automotive applications due to AEC-Q100 screening level and MOS technology.
MFS8620BMDA0ES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
R-PQCC-N48
LCC48(UNSPEC)
36 V
4.5 V
MFS8621BMBA0ES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Peak Reflow Temperature (C): 260; Terminal Position: QUAD;
MFS8622BMBA0ES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Form: NO LEAD; Maximum Supply Voltage (Vsup): 36 V;
MFS8622BMBA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Screening Level: AEC-Q100; Minimum Operating Temperature: -40 Cel;
MFS8623BMDA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Form: NO LEAD; Terminal Position: QUAD;
MFS8602BMDA0ES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Position: QUAD; Minimum Operating Temperature: -40 Cel;
MFS8602BMDA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Minimum Operating Temperature: -40 Cel; No. of Channels: 1;
MFS8603BMBA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Package Equivalence Code: LCC48(UNSPEC); Terminal Form: NO LEAD;
MFS8610BMBA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; No. of Functions: 1;
MFS8610BMDA0ES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Peak Reflow Temperature (C): 260; Package Body Material: PLASTIC/EPOXY;
MFS8611BMBA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Minimum Supply Voltage (Vsup): 4.5 V; Package Equivalence Code: LCC48(UNSPEC);
MFS8612BMBA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Position: QUAD; Maximum Supply Voltage (Vsup): 60 V;
MFS8613BMDA0ES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Screening Level: AEC-Q100; Maximum Operating Temperature: 125 Cel;
MFS8622BMDA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Position: QUAD; Adjustable Threshold: NO;
MFS8631BMBA0ES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 125 Cel;
MFS8633BMBA0ES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Adjustable Threshold: NO; Terminal Form: NO LEAD;
MFS8633BMBA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Adjustable Threshold: NO; Package Body Material: PLASTIC/EPOXY;
MFS8600BMBA0ES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Minimum Operating Temperature: -40 Cel; Adjustable Threshold: NO;
MFS8600BMBA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Minimum Operating Temperature: -40 Cel; Terminal Position: QUAD;
MFS8600BMDA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; JESD-30 Code: R-PQCC-N48; Terminal Form: NO LEAD;
MFS8601BMBA0ESR2
MFS8601BMDA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Adjustable Threshold: NO; Screening Level: AEC-Q100;
MFS8602BMBA0ES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; No. of Channels: 1; Terminal Form: NO LEAD;
MFS8602BMBA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; No. of Channels: 1; Maximum Supply Voltage (Vsup): 60 V;
MFS8610BMBA0ES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Position: QUAD; Peak Reflow Temperature (C): 260;
MFS8611BMBA0ES
MFS8611BMDA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Adjustable Threshold: NO; Package Equivalence Code: LCC48(UNSPEC);
MFS8612BMBA0ES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Maximum Supply Voltage (Vsup): 60 V; Package Body Material: PLASTIC/EPOXY;
MFS8612BMDA0ES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 40; Minimum Operating Temperature: -40 Cel;
MFS8620BMBA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Adjustable Threshold: NO; Maximum Supply Voltage (Vsup): 36 V;
MFS8620BMDA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Shape: RECTANGULAR; Surface Mount: YES; Maximum Operating Temperature: 125 Cel; Maximum Supply Voltage (Vsup): 36 V;
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