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MC33771CTP2AER2

NXP Semiconductors

MC33771CTP2AER2 by NXP Semiconductors

MC33771CTP2AER2 by NXP Semiconductors is a Power Management IC with 8 channels, Vsup range of 9.6V to 61.6V, and AEC-Q100 screening for automotive applications. It features MOS technology, operates b/w -40°C to 105°C, and has a compact FLATPACK package with GULL WING terminals suitable for power supply support circuits.

Median Price

$8.430

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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EBV Elektronik

Germany . 6,000 parts In-Stock

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IBS Electronics

USA . 7,500 parts In-Stock

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$8.499

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Vyrian

USA . 7,001 parts In-Stock

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TME

Poland . 6,000 parts In-Stock

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$8.360

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Anansix

USA . 1,434 parts In-Stock

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Flip Electronics

USA . 820 parts In-Stock

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Digiode

USA . 688 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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One Stop Electronics

USA . 426 parts In-Stock

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$0.500

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Semicontronic

India . 1,491 parts In-Stock

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$1.500

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$1.462

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$1.455

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Ampacity Inc.

Singapore . 891 parts In-Stock

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$6.500

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Corohmni

South Africa . 81 parts In-Stock

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AZTECH Wire

Italy . 391 parts In-Stock

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Aztec Data Supply Inc.

USA . 48,179 parts In-Stock

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Microchip USA

USA . 2,555 parts In-Stock

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Argo Parts USA

USA . 4,405 parts In-Stock

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Corphita

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UNI Independent Distributors

Spain . 916 parts In-Stock

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Continental Prestige Electronics

USA . 657 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unlock the power of efficient energy management with the MC33771CTP2AER2 by NXP Semiconductors. This high-quality Power Management IC offers unparalleled performance and reliability, ideal for a range of applications. Trust in the expertise of NXP Semiconductors to provide cutting-edge solutions that streamline operations and maximize efficiency. Elevate your projects with the MC33771CTP2AER2 and experience the value it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a durable and cost-effective solution for housing the components of the Power Management IC, making it a reliable choice.

Surface Mount: YES

The surface mount feature allows for easy integration onto circuit boards, simplifying the manufacturing process and saving space.

Screening Level: AEC-Q100

This high screening level ensures the reliability and quality of the Power Management IC, making it suitable for automotive applications where performance is critical.

Package Shape: SQUARE

The square shape of the package provides a compact footprint, allowing for efficient use of board space.

Nominal Supply Voltage (Vsup): 56 V

With a high nominal supply voltage, this Power Management IC can efficiently handle high power applications, making it a versatile choice.

No. of Terminals: 64

The large number of terminals allows for a greater degree of connectivity and functionality, making this IC suitable for complex power management tasks.

Package Style: FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The various package styles offer flexibility in design and integration, catering to different application requirements.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance even in harsh environments, making this IC a durable choice.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this Power Management IC can function effectively in a wide range of environmental conditions.

Terminal Position: QUAD

The quad terminal position allows for easy soldering and secure connection, contributing to the overall reliability of the IC.

Technical Specifications

Power Management ICs MC33771CTP2AER2 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

61.6 V

Minimum Supply Voltage (Vsup):

9.6 V

Nominal Supply Voltage (Vsup):

56 V

Surface Mount:

YES

Technology:

MOS

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

8.5

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

10 mm

Trade Compliance

MC33771CTP2AER2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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