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MC33771CTA2AER2

NXP Semiconductors

MC33771CTA2AER2 by NXP Semiconductors

MC33771CTA2AER2 by NXP Semiconductors is a Power Management IC with 8 channels, Vsup range of 9.6V to 61.6V, and AEC-Q100 screening for automotive applications. It features MOS technology, operates b/w -40°C to 105°C, and has a compact FLATPACK package style suitable for power supply support circuits in vehicles.

Median Price

$6.071

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 9,000 parts In-Stock

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Vyrian

USA . 8,396 parts In-Stock

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Anansix

USA . 1,769 parts In-Stock

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Flip Electronics

USA . 950 parts In-Stock

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Digiode

USA . 596 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 129 parts In-Stock

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$0.980

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129

$0.980

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Corohmni

South Africa . 250 parts In-Stock

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$4.770

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$4.770

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Ampacity Inc.

Singapore . 930 parts In-Stock

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$5.500

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$5.500

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One Stop Electronics

USA . 271 parts In-Stock

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$6.500

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AZTECH Wire

Italy . 416 parts In-Stock

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$18.070

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Microchip USA

USA . 3,851 parts In-Stock

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$24.696

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UNI Independent Distributors

Spain . 8,086 parts In-Stock

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Corphita

USA . 4,786 parts In-Stock

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Argo Parts USA

USA . 3,126 parts In-Stock

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Infinite Electronics LLP (Excess)

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Continental Prestige Electronics

USA . 890 parts In-Stock

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Advanced Electronics

New Zealand . 72 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Overview

Enhance your power management systems with the MC33771CTA2AER2 from NXP Semiconductors. This top-of-the-line Power Management IC offers unmatched quality and reliability, perfect for a wide range of applications. With advanced technology and innovative design, this product ensures optimal performance and efficiency. Say goodbye to power supply issues and hello to seamless operation with the MC33771CTA2AER2. Upgrade your systems today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Surface Mount: YES

The surface mount design allows for easy installation and integration into PCBs, saving space and reducing assembly time.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high quality and reliability, making this product suitable for automotive applications where ruggedness is crucial.

Nominal Supply Voltage (Vsup): 56 V

The high nominal supply voltage allows for compatibility with a wide range of applications that require power management at higher voltages.

No. of Terminals: 64

Having a higher number of terminals provides flexibility in connecting to various components and peripherals, enhancing the product's usability.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The diverse package styles offer options for different mounting and cooling requirements, making this product versatile for various environments and applications.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can withstand demanding conditions without compromising performance or safety.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the product to function reliably in both extreme cold and hot environments, ensuring consistent performance.

Terminal Position: QUAD

The quad terminal position provides stability and ease of connection during installation, promoting efficient and secure electrical connections.

Maximum Seated Height: 1.6 mm

The low seated height minimizes the overall profile of the product, making it suitable for compact designs and applications with space constraints.

Width (mm): 10 mm

The compact width dimension allows for easy integration into tight layouts or designs where space is limited, optimizing PCB layout and functionality.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC type enhances the efficiency and stability of power management systems, ensuring reliable and consistent operation.

Minimum Supply Voltage (Vsup): 9.6 V

The low minimum supply voltage makes this product suitable for applications requiring lower power consumption while maintaining performance and functionality.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum reflow time ensures proper soldering and assembly during manufacturing processes, guaranteeing a secure and durable connection.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable and consistent soldering of the product during manufacturing, preventing solder joint failure.

Length: 10 mm

The compact length dimension allows for space-saving integration into various electronic devices and products, enhancing overall design efficiency.

Nominal Threshold Voltage (V): 8.5

The nominal threshold voltage provides precise control and regulation of the power management system, ensuring optimal performance and protection of connected components.

No. of Channels: 8

Having multiple channels allows for simultaneous power management and distribution to different components or systems, improving overall efficiency and functionality.

Technology: MOS

The MOS technology offers high efficiency and reliability in power management applications, providing precise control and low power consumption for optimal performance.

Terminal Form: GULL WING

The gull wing terminal form ensures secure and reliable connections on the PCB, preventing signal loss or interference for enhanced performance and stability.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for fine and precise connections, ideal for high-density PCB layouts and applications where space is a premium.

Moisture Sensitivity Level (MSL): 3

With MSL 3 rating, this product can withstand moderate levels of moisture exposure during storage and handling, ensuring long-term reliability and performance.

Maximum Supply Voltage (Vsup): 61.6 V

The high maximum supply voltage capability enables the product to handle power fluctuations and surges, ensuring stability and protection in various operating conditions.

Technical Specifications

Power Management ICs MC33771CTA2AER2 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

61.6 V

Minimum Supply Voltage (Vsup):

9.6 V

Nominal Supply Voltage (Vsup):

56 V

Surface Mount:

YES

Technology:

MOS

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

8.5

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

10 mm

Trade Compliance

MC33771CTA2AER2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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