Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MCZ33903DS5EKR2
NXP Semiconductors
MCZ33903DS5EKR2 by NXP Semiconductors is a Power Management IC with 32 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 5.5V to 28V and features adjustable threshold. Ideal for automotive applications due to its MOS technology and compact design with small outline package style.
YES
POWER SUPPLY MANAGEMENT CIRCUIT
R-PDSO-G32
e3
11 mm
3
1
32
125 Cel
-40 Cel
PLASTIC/EPOXY
HSSOP
RECTANGULAR
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
260
2.45 mm
28 V
5.5 V
10.5 V
MOS
AUTOMOTIVE
TIN
GULL WING
.65 mm
DUAL
40
7.5 mm
MCZ33903DS5EK
MCZ33903DS5EK by NXP Semiconductors is a Power Management IC with 32 terminals, operating voltage range of 5.5V to 28V, and temperature grade suitable for automotive applications. It features a small outline package with dimensions of 11mm x 7.5mm x 2.45mm and MOS technology, making it ideal for power supply management circuits in automotive systems.
MCZ33904D3EKR2
POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
MCZ33904D3EK
MCZ33904D5EKR2
MCZ33904D5EK
MCZ33905DD3EKR2
POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 54; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
R-PDSO-G54
17.9 mm
54
MCZ33905DD3EK
MCZ33905DD5EKR2
MCZ33905DD5EK
MCZ33905DS3EKR2
MCZ33905DS3EK
MCZ33905DS5EKR2
MCZ33905DS5EK
MC34VR5100A0EPR2
POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Supply Voltage (Vsup): 2.8 V;
POWER SUPPLY SUPPORT CIRCUIT
S-XQCC-N48
7 mm
8
48
105 Cel
UNSPECIFIED
HVQCCN
LCC48,.28SQ,20
SQUARE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
.9 mm
4.5 V
2.8 V
3.6 V
NO LEAD
.5 mm
QUAD
MC34VR5100A0EP
POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Nominal Supply Voltage (Vsup): 3.6 V;
MC34VR5100A1EPR2
MC33PF3001A6ESR2
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V
10
INDUSTRIAL
MC33PF3001A6ES
MC33PF3001A7ESR2
MC33PF3001A7ES
MMPF0100FBANESR2
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
S-XQCC-N56
8 mm
14
56
MMPF0100FBANES
MMPF0100FCAEPR2
85 Cel
MMPF0100FCAEP
MMPF0100FCANESR2
MMPF0100FCANES
MMPF0100FDAEPR2
MMPF0100FDAEP
MWCT1011AVLH
POWER SUPPLY MANAGEMENT CIRCUIT; JESD-609 Code: e3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
MWCT1013AVLH
POWER SUPPLY MANAGEMENT CIRCUIT; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN;
MC32PF3000A8EPR2
POWER SUPPLY SUPPORT CIRCUIT; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN;
MC32PF3000A8EP
POWER SUPPLY SUPPORT CIRCUIT; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3;
MC34PF3000A8EPR2
POWER SUPPLY SUPPORT CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3;
MC34PF3000A8EP
POWER SUPPLY SUPPORT CIRCUIT; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3;
MC32PF4210A0ES
POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 56; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Operating Temperature: 0 Cel;
S-PQCC-N56
0 Cel
QCCN
CHIP CARRIER, HEAT SINK/SLUG
+2.4V
MC32PF1550A1EP
MC32PF1550A1EP by NXP Semiconductors is a Power Management IC with 40 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 2.5V to 4.5V and features adjustable threshold voltage at +6.5V. Ideal for power supply management circuits in compact applications due to its small form factor and surface-mount capability.
S-PQCC-N40
e4
5 mm
7
2.5 V
NICKEL PALLADIUM GOLD
.4 mm
+6.5V
TEA19031AQT/1J
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 10; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
NO
R-PDSO-G10
6.2 mm
5
-25 Cel
SOP
SMALL OUTLINE
1.75 mm
5 V
OTHER
1.27 mm
3.9 mm
TEA19051BAAT/1J
TEA19051BAAT/1J by NXP Semiconductors is a Power Management IC with 14 terminals, operating voltage range of 2.9V to 21V, and temperature range from -20°C to 105°C. It is designed for power supply support circuits in various applications requiring a small outline package style and surface mount capability.
R-PDSO-G14
8.65 mm
-20 Cel
21 V
2.9 V
MC33PF8100A0ES
POWER SUPPLY MANAGEMENT CIRCUIT; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
MC33PF8101A0ES
POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
9
LCC56,.31SQ,20
1 mm
2.7 V
TEA19032CABT/1J
SOP10,.24
0 V
MC33FS5502Y0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 40;
4
AEC-Q100
60 V
+7.5V
MC33FS5502Y0ES
MC33FS5502Y0ES by NXP Semiconductors is a Power Management IC with 4 channels, adjustable threshold voltage of +7.5V, and max supply voltage of 60V. It is designed for automotive applications meeting AEC-Q100 standards, featuring a package style of CHIP CARRIER and operating temperature range from -40 to 125 °C.
MC33FS5502Y3ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Operating Temperature: -40 Cel;
MC33VR5500V0ESR2
Power Management Circuits; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Screening Level: AEC-Q100; JESD-609 Code: e3; Terminal Finish: TIN;
MC33VR5500V1ES
Power Management Circuits; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Screening Level: AEC-Q100; Maximum Time At Peak Reflow Temperature (s): 40;
MC33VR5500V0ES
Power Management Circuits; JESD-609 Code: e3; Terminal Finish: TIN; Screening Level: AEC-Q100; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
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