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MWCT1011AVLH

NXP Semiconductors

MWCT1011AVLH by NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; JESD-609 Code: e3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;

Median Price

$7.632

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 110 parts In-Stock

1+ parts

$10.780

100+ parts

$7.827

1k+ parts

-

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110

$10.780

$7.827

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Verical

USA . 9,600 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$4.484

10k+ parts

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9,600

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$4.484

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Flip Electronics (Authorized)

USA . 934 parts In-Stock

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934

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Distributors (In-Stock)

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Digiode

USA . 1,933 parts In-Stock

1+ parts

$9.756

100+ parts

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1,933

$9.756

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Vyrian

USA . 7,927 parts In-Stock

1+ parts

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7,927

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Anansix

USA . 1,496 parts In-Stock

1+ parts

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1,496

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Flip Electronics

USA . 640 parts In-Stock

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640

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SPM Sales

USA . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,514 parts In-Stock

1+ parts

$9.243

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4,514

$9.243

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Microchip USA

USA . 5,980 parts In-Stock

1+ parts

$31.164

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5,980

$31.164

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UNI Independent Distributors

Spain . 4,181 parts In-Stock

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4,181

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Futuretech Components

Singapore . 743 parts In-Stock

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743

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Kepictronics

USA . 640 parts In-Stock

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640

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Technical Specifications

Power Management ICs MWCT1011AVLH attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MWCT1011AVLH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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