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MMPF0100FCAEP

NXP Semiconductors

MMPF0100FCAEP by NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

Median Price

$5.771

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,080 parts In-Stock

1+ parts

-

100+ parts

$5.130

1k+ parts

$4.590

10k+ parts

$4.320

15,080

-

$5.130

$4.590

$4.320

Verical

USA . 10,920 parts In-Stock

1+ parts

-

100+ parts

$6.412

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$5.737

10k+ parts

$5.400

10,920

-

$6.412

$5.737

$5.400

Distributors (In-Stock)

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Digiode

USA . 128 parts In-Stock

1+ parts

$4.912

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128

$4.912

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Vyrian

USA . 3,563 parts In-Stock

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Anansix

USA . 2,182 parts In-Stock

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Flip Electronics

USA . 1,318 parts In-Stock

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1,318

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Distributors (Availability)

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Corphita

USA . 3,059 parts In-Stock

1+ parts

$4.653

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3,059

$4.653

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AZTECH Wire

Italy . 209 parts In-Stock

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$15.020

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$15.020

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QUARKTWIN TECHNOLOGY LTD

USA . 19,666 parts In-Stock

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19,666

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UNI Independent Distributors

Spain . 5,391 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,511 parts In-Stock

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Microchip USA

USA . 2,964 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Technical Specifications

Power Management ICs MMPF0100FCAEP attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N56

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

14

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

8 mm

Trade Compliance

MMPF0100FCAEP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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