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MMPF0100F0AZES

NXP Semiconductors

MMPF0100F0AZES by NXP Semiconductors

NXP Semiconductors' MMPF0100F0AZES is a Power Management IC with 3.3V nominal voltage, 56 terminals, and 105°C max operating temp. Ideal for industrial applications requiring a compact chip carrier package with very thin profile and adjustable threshold feature.

Median Price

$7.875

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 260 parts In-Stock

1+ parts

$4.946

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260

$4.946

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Chip1Stop

Japan . 260 parts In-Stock

1+ parts

$10.000

100+ parts

$6.480

1k+ parts

$6.050

10k+ parts

$5.450

260

$10.000

$6.480

$6.050

$5.450

Mouser Electronics

USA . 140 parts In-Stock

1+ parts

$10.270

100+ parts

$6.760

1k+ parts

$6.350

10k+ parts

$6.220

140

$10.270

$6.760

$6.350

$6.220

DigiKey

USA . 4,960 parts In-Stock

1+ parts

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$5.750

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4,960

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$5.750

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Distributors (In-Stock)

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Flip Electronics

USA . 4,960 parts In-Stock

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$3.750

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4,960

$3.750

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Nova Conductors

Japan . 100 parts In-Stock

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$7.690

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100

$7.690

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Digiode

USA . 3,331 parts In-Stock

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$9.196

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3,331

$9.196

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Chip Stock

USA . 17,180 parts In-Stock

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Demsay Elektronik

Türkiye . 13,260 parts In-Stock

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Vyrian

USA . 6,145 parts In-Stock

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6,145

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Cyclops Electronics Ltd

UK . 1,932 parts In-Stock

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Anansix

USA . 1,786 parts In-Stock

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Amalfi Trading

USA . 141 parts In-Stock

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141

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Distributors (Availability)

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$7.536

100+ parts

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1k+ parts

$7.235

10k+ parts

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50

$7.536

-

$7.235

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Continental Prestige Electronics

USA . 6,756 parts In-Stock

1+ parts

$7.680

100+ parts

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10k+ parts

$7.526

6,756

$7.680

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$7.526

Corohmni

South Africa . 122 parts In-Stock

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$8.147

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122

$8.147

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Semicontronic

India . 156 parts In-Stock

1+ parts

$8.190

100+ parts

$7.985

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$7.944

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156

$8.190

$7.985

$7.944

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Ampacity Inc.

Singapore . 27 parts In-Stock

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$8.190

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27

$8.190

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Corphita

USA . 1,498 parts In-Stock

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$8.712

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1,498

$8.712

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AZTECH Wire

Italy . 673 parts In-Stock

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$14.328

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673

$14.328

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$17.282

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$16.418

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$16.418

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2,000

$17.282

$16.418

$16.418

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Aztec Data Supply Inc.

USA . 3,205 parts In-Stock

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$18.961

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$18.961

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Microchip USA

USA . 1,148 parts In-Stock

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$29.540

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Lixinc

USA . 18,312 parts In-Stock

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S.R.D Solutions

India . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 9,048 parts In-Stock

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Kepictronics

USA . 7,000 parts In-Stock

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Perfect Parts

USA . 6,854 parts In-Stock

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Argo Parts USA

USA . 4,089 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 1,040 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,032 parts In-Stock

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UNI Independent Distributors

Spain . 646 parts In-Stock

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iodParts Technologies Inc.

India . 26 parts In-Stock

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26

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Overview

Power up your devices with the MMPF0100F0AZES Power Management IC by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers top-quality products that exceed expectations. This versatile IC is perfect for a wide range of applications, offering customers reliable performance and efficiency. With its compact square package shape and surface mount design, the MMPF0100F0AZES provides easy integration and space-saving solutions. Trust NXP Semiconductors to provide you with advanced technology that meets all your power management needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount package allows for easy and convenient mounting on PCBs, saving space and simplifying manufacturing processes.

Nominal Supply Voltage (Vsup): 3.3 V

Offers a stable and commonly used supply voltage for powering various components, ensuring compatibility with standard systems.

No. of Terminals: 56

Having a higher number of terminals allows for more connections and functionalities, making it versatile for different power management applications.

Maximum Operating Temperature: 105 °C

With a high operating temperature range, this IC can withstand harsh environments and heavy loads without overheating, improving reliability.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, enhancing the longevity and performance of the IC.

Technology: MOS

MOS technology is known for its efficiency and low power consumption, making this IC suitable for power management applications where energy efficiency is crucial.

Adjustable Threshold: YES

The ability to adjust the threshold allows for fine-tuning and customization of power management settings, catering to specific requirements and optimizing performance.

Technical Specifications

Power Management ICs MMPF0100F0AZES attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N56

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

14

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

8 mm

Trade Compliance

MMPF0100F0AZES Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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