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MC32PF3001A7EPR2

NXP Semiconductors

MC32PF3001A7EPR2 by NXP Semiconductors

MC32PF3001A7EPR2 by NXP Semiconductors is a Power Management IC with 10 channels, adjustable threshold, and 3.6V nominal voltage. Ideal for industrial applications, it features a square package shape, -40 to 85°C operating temperature range, and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 6,620 parts In-Stock

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Anansix

USA . 2,417 parts In-Stock

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Vyrian

USA . 2,384 parts In-Stock

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Digiode

USA . 1,969 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,017 parts In-Stock

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$1.990

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$1.990

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One Stop Electronics

USA . 877 parts In-Stock

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$3.500

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877

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Ampacity Inc.

Singapore . 1,053 parts In-Stock

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$4.500

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$4.500

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AZTECH Wire

Italy . 495 parts In-Stock

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$5.525

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Corohmni

South Africa . 489 parts In-Stock

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$5.832

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489

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Microchip USA

USA . 6,416 parts In-Stock

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$19.960

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$19.840

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$19.770

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$19.710

6,416

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$19.840

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$19.710

Continental Prestige Electronics

USA . 4,195 parts In-Stock

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Corphita

USA . 3,087 parts In-Stock

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UNI Independent Distributors

Spain . 1,273 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Experience superior power management with the MC32PF3001A7EPR2 by NXP Semiconductors. As a leader in semiconductor technology, NXP delivers top-quality solutions for various applications in the power management ICs category. This innovative product boasts a square package shape, a wide temperature range, and a flexible supply voltage, making it ideal for industrial use. With 10 channels and adjustable thresholds, this chip carrier offers unmatched performance and reliability. Trust NXP to provide you with cutting-edge solutions that enhance efficiency and streamline operations. Elevate your power management capabilities with the MC32PF3001A7EPR2.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and efficient installation onto circuit boards, saving time and effort in the assembly process.

Nominal Supply Voltage (Vsup): 3.6 V

The nominal supply voltage of 3.6V provides stable and reliable power to the device, ensuring consistent performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this power management IC can withstand high temperatures, making it suitable for a variety of industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures that this power management IC can function reliably in harsh environmental conditions.

Width (mm): 7 mm

The compact width of 7mm allows for space-saving installation in tight or crowded electronic devices.

No. of Channels: 10

Having 10 channels allows this power management IC to efficiently handle multiple power supply circuits and support various components within a system.

Technical Specifications

Power Management ICs MC32PF3001A7EPR2 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Additional Features:

OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

10

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7 mm

Trade Compliance

MC32PF3001A7EPR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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