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MC32PF3001A1EP

NXP Semiconductors

MC32PF3001A1EP by NXP Semiconductors

MC32PF3001A1EP by NXP Semiconductors is a Power Management IC with 48 terminals, operating b/w -40 to 85°C. It supports 10 channels, has an adjustable threshold, and a supply voltage range of 2.8V to 4.5V. Ideal for industrial applications requiring precise power supply support circuits in compact square chip carrier packages.

Median Price

$6.408

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 848 parts In-Stock

1+ parts

$9.080

100+ parts

$5.310

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$4.500

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848

$9.080

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$4.500

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Verical

USA . 9,880 parts In-Stock

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$3.736

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$3.736

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Digiode

USA . 2,154 parts In-Stock

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$5.928

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$5.928

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Vyrian

USA . 1,538 parts In-Stock

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$6.240

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1,538

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Flip Electronics

USA . 1,300 parts In-Stock

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1,300

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Anansix

USA . 339 parts In-Stock

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339

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Ampacity Inc.

Singapore . 630 parts In-Stock

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$5.300

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630

$5.300

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Corphita

USA . 4,548 parts In-Stock

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$5.616

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4,548

$5.616

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Corohmni

South Africa . 479 parts In-Stock

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$13.228

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479

$13.228

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Microchip USA

USA . 1,573 parts In-Stock

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$19.152

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iodParts Technologies Inc.

India . 5,250 parts In-Stock

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Argo Parts USA

USA . 3,434 parts In-Stock

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UNI Independent Distributors

Spain . 2,589 parts In-Stock

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Continental Prestige Electronics

USA . 1,251 parts In-Stock

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A-Z Elektronik GmbH

Germany . 225 parts In-Stock

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Aranea Global

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Overview

Elevate your power management solutions with the MC32PF3001A1EP by NXP Semiconductors. This high-quality Power Management IC offers unparalleled performance and reliability, thanks to the expertise of its renowned manufacturer. Ideal for a wide range of applications, this versatile chip carrier ensures optimal power supply support and peak reflow temperature, making it a must-have for industrial-grade projects. Experience the value and benefits of seamless power management with the MC32PF3001A1EP - delivering efficiency and innovation in a compact, surface-mount package.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy integration into PCB designs, saving space and reducing overall footprint.

Nominal Supply Voltage (Vsup): 3.6 V

Optimal supply voltage for efficient power management and performance.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes this product suitable for industrial applications where temperature fluctuations occur.

Terminal Finish: TIN

Tin terminal finish offers good conductivity and solderability, ensuring reliable connections.

No. of Channels: 10

Multiple channels allow for versatile power management capabilities, making this product suitable for a range of applications.

Minimum Supply Voltage (Vsup): 2.8 V

Low minimum supply voltage ensures compatibility with a variety of power sources and systems.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that the product can withstand moderate exposure to moisture during handling and storage.

Adjustable Threshold: YES

Ability to adjust threshold levels provides flexibility in power management settings for customization.

Technical Specifications

Power Management ICs MC32PF3001A1EP attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Additional Features:

OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

10

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7 mm

Trade Compliance

MC32PF3001A1EP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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