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MC34PF1510A6EPR2

NXP Semiconductors

MC34PF1510A6EPR2 by NXP Semiconductors

MC34PF1510A6EPR2 by NXP Semiconductors is a Power Management IC with 40 terminals, operating b/w -40 to 105°C. It features an adjustable threshold, 8 channels, and supports a supply voltage range of 3.8V to 7V. Ideal for industrial applications requiring precise power supply management in compact spaces.

Median Price

$4.358

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 14,500 parts In-Stock

1+ parts

$5.630

100+ parts

$3.600

1k+ parts

$3.384

10k+ parts

$3.096

14,500

$5.630

$3.600

$3.384

$3.096

Mouser Electronics

USA . 668 parts In-Stock

1+ parts

$7.230

100+ parts

$4.350

1k+ parts

$3.390

10k+ parts

$3.310

668

$7.230

$4.350

$3.390

$3.310

Rochester

USA . 9,000 parts In-Stock

1+ parts

-

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$2.760

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$2.470

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$2.330

9,000

-

$2.760

$2.470

$2.330

Verical

USA . 5,000 parts In-Stock

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$3.087

10k+ parts

$2.913

5,000

-

-

$3.087

$2.913

Distributors (In-Stock)

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Digiode

USA . 945 parts In-Stock

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$2.536

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945

$2.536

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Vyrian

USA . 8,594 parts In-Stock

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Anansix

USA . 1,841 parts In-Stock

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Chip Stock

USA . 880 parts In-Stock

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880

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Corohmni

South Africa . 43 parts In-Stock

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$1.058

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$1.058

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Corphita

USA . 2,166 parts In-Stock

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$2.403

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$2.403

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Microchip USA

USA . 6,449 parts In-Stock

1+ parts

$16.630

100+ parts

$16.520

1k+ parts

$16.470

10k+ parts

$16.420

6,449

$16.630

$16.520

$16.470

$16.420

Modulus Dynamics

Lithuania . 133 parts In-Stock

1+ parts

$20.902

100+ parts

$20.902

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$20.902

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133

$20.902

$20.902

$20.902

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iodParts Technologies Inc.

India . 20,000 parts In-Stock

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Argo Parts USA

USA . 4,292 parts In-Stock

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Lixinc

USA . 3,164 parts In-Stock

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UNI Independent Distributors

Spain . 1,481 parts In-Stock

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Continental Prestige Electronics

USA . 1,246 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Discover the cutting-edge MC34PF1510A6EPR2 by NXP Semiconductors, a top-tier Power Management IC that guarantees unparalleled performance and reliability. With a focus on innovation and quality, NXP Semiconductors has solidified its reputation as a leader in the industry. This versatile IC is perfect for a wide range of applications, providing customers with seamless integration and optimized functionality. Whether you're looking for efficient power supply management or superior temperature control, this product delivers exceptional value and benefits that will exceed your expectations. Elevate your projects with the MC34PF1510A6EPR2 and experience the difference today!

Feature Benefit Bullets

Insertion Loss: 0.54 dB

Low insertion loss ensures minimal signal loss during transmission, making this product ideal for high-performance RF applications.

Inductance (Primary): 9 uH

The high inductance value allows for efficient impedance matching and signal transformation in RF circuits.

Packing Method: TR, EMBOSSED PLASTIC, 7 INCH

This packaging method ensures easy handling and protection during shipping, making it convenient for bulk orders.

Dimensions: L4.45XB4.19XH3.05 (mm)

Compact dimensions make it suitable for space-constrained applications, while maintaining high performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this RF transformer can withstand harsh environmental conditions, ensuring reliable operation.

Minimum Cutoff Frequency: 0.3 GHz

The low minimum cutoff frequency allows for effective signal filtering and processing in RF systems.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this transformer can operate in cold environments without performance degradation.

Terminal Finish: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

The terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections in RF circuits.

Maximum Cutoff Frequency: 500 MHz

The high maximum cutoff frequency allows for efficient signal processing and bandwidth in RF applications.

Transformer Type: RF TRANSFORMER

Specifically designed for RF applications, ensuring optimal performance and compatibility with RF systems.

Mounting Feature: SURFACE MOUNT

Surface mount design allows for easy and secure installation on PCBs, making it suitable for automated assembly processes.

Technical Specifications

Power Management ICs MC34PF1510A6EPR2 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC40,.2SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

7 V

Minimum Supply Voltage (Vsup):

3.8 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

5 mm

Trade Compliance

MC34PF1510A6EPR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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