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MC32PF1550A5EP

NXP Semiconductors

MC32PF1550A5EP by NXP Semiconductors

MC32PF1550A5EP by NXP Semiconductors is a Power Management IC with 1 function. It has a package style of CHIP CARRIER, HEAT SINK/SLUG and very thin profile. It operates at temperatures ranging from -40 to 85 °C and has a nominal voltage of 3.6 V. Its application includes power supply management circuits.

Median Price

$2.576

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,935 parts In-Stock

1+ parts

$2.193

100+ parts

-

1k+ parts

$2.094

10k+ parts

$2.070

2,935

$2.193

-

$2.094

$2.070

Verical

USA . 9,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.960

10k+ parts

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9,800

-

-

$2.960

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Flip Electronics (Authorized)

USA . 1,470 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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1,470

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,792 parts In-Stock

1+ parts

$2.083

100+ parts

-

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10k+ parts

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4,792

$2.083

-

-

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$5.029

100+ parts

-

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600

$5.029

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-

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Vyrian

USA . 6,771 parts In-Stock

1+ parts

-

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6,771

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Anansix

USA . 2,802 parts In-Stock

1+ parts

-

100+ parts

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2,802

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Flip Electronics

USA . 1,470 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,470

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,432 parts In-Stock

1+ parts

$1.780

100+ parts

$1.736

1k+ parts

$1.727

10k+ parts

-

2,432

$1.780

$1.736

$1.727

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Ampacity Inc.

Singapore . 2,211 parts In-Stock

1+ parts

$1.780

100+ parts

-

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2,211

$1.780

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Corphita

USA . 246 parts In-Stock

1+ parts

$1.974

100+ parts

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246

$1.974

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$4.928

100+ parts

-

1k+ parts

$4.731

10k+ parts

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2,000

$4.928

-

$4.731

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Continental Prestige Electronics

USA . 5,253 parts In-Stock

1+ parts

$5.029

100+ parts

-

1k+ parts

-

10k+ parts

$4.928

5,253

$5.029

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-

$4.928

Corohmni

South Africa . 9 parts In-Stock

1+ parts

$7.883

100+ parts

-

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9

$7.883

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AZTECH Wire

Italy . 827 parts In-Stock

1+ parts

$15.650

100+ parts

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827

$15.650

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Microchip USA

USA . 3,636 parts In-Stock

1+ parts

$18.452

100+ parts

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3,636

$18.452

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-

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Aztec Data Supply Inc.

USA . 4,169 parts In-Stock

1+ parts

$23.146

100+ parts

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1k+ parts

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4,169

$23.146

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UNI Independent Distributors

Spain . 4,721 parts In-Stock

1+ parts

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4,721

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Argo Parts USA

USA . 3,290 parts In-Stock

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100+ parts

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3,290

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Overview

Upgrade your power management system with the MC32PF1550A5EP by NXP Semiconductors. As a leading manufacturer, NXP Semiconductors delivers unparalleled quality and reliability in their products. The MC32PF1550A5EP is a versatile power management IC that offers numerous applications. With its compact size and advanced features, this chip carrier ensures efficient power supply management. Experience the benefits of increased energy efficiency, precise voltage control, and optimal thermal management. Trust NXP Semiconductors to deliver superior performance and value for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's use of plastic/epoxy material ensures durability and reliability.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation, making this product suitable for various applications.

No. of Functions: 1

With a single function, this power management IC simplifies circuit design and improves efficiency.

Package Shape: SQUARE

The square shape of the package offers efficient space utilization and allows for compact designs.

Nominal Supply Voltage (Vsup): 3.6 V

Operating at a nominal supply voltage of 3.6V ensures compatibility with a wide range of power sources.

No. of Terminals: 40

The multiple terminals provide flexible connectivity options for better integration into electronic systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style, combined with a heat sink/slug and a very thin profile, enables effective heat dissipation and space-saving designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product exhibits reliable performance even under challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures operation in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish enhances corrosion resistance, ensuring a longer lifespan for the product.

Terminal Position: QUAD

The quad terminal position facilitates easy and secure electrical connections, contributing to system stability.

Maximum Seated Height: 0.9 mm

With a maximum seated height of only 0.9mm, this power management IC allows for low-profile designs and compact layouts.

Width (mm): 5 mm

With a width of 5mm, this product offers flexibility in board layouts and space-constrained applications.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

This power management IC is specifically designed for power supply management circuits, ensuring efficient and reliable voltage regulation.

Minimum Supply Voltage (Vsup): 2.5 V

The minimum supply voltage requirement of 2.5V ensures compatibility with various power sources, providing versatility in system designs.

Maximum Time At Peak Reflow Temperature (s): 40

This product can withstand a maximum time of 40 seconds at peak reflow temperature, making it suitable for reflow soldering processes.

Peak Reflow Temperature °C: 260

Operating at a peak reflow temperature of 260°C, this power management IC can withstand high-temperature manufacturing processes.

Length: 5 mm

With a length of 5mm, this product offers compactness and facilitates miniaturized designs.

Nominal Threshold Voltage (V): +6.5V

The nominal threshold voltage of +6.5V ensures accurate and reliable voltage level detection, enhancing system performance.

No. of Channels: 7

With seven channels, this power management IC provides ample functionality for multi-channel power management applications.

Terminal Form: NO LEAD

The no-lead terminal form enhances the thermal performance of the IC, reducing thermal resistance and enabling efficient heat dissipation.

Terminal Pitch: 0.4 mm

The terminal pitch of 0.4mm allows for precise and secure connections, facilitating reliable power transfer.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product can withstand moderate humidity environments, ensuring durability.

Maximum Supply Voltage (Vsup): 4.5 V

Operating at a maximum supply voltage of 4.5V, this power management IC offers compatibility with a wide range of power sources.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization of voltage thresholds, providing flexibility in various applications.

Technical Specifications

Power Management ICs MC32PF1550A5EP attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

7

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+6.5V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

5 mm

Trade Compliance

MC32PF1550A5EP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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