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MC33771BTB1AE/R2

NXP Semiconductors

MC33771BTB1AE/R2 by NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Surface Mount: YES;

Median Price

$5.929

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,295 parts In-Stock

1+ parts

-

100+ parts

$5.270

1k+ parts

$4.720

10k+ parts

$4.440

1,295

-

$5.270

$4.720

$4.440

Verical

USA . 1,295 parts In-Stock

1+ parts

-

100+ parts

$6.588

1k+ parts

$5.900

10k+ parts

$5.550

1,295

-

$6.588

$5.900

$5.550

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,023 parts In-Stock

1+ parts

$5.567

100+ parts

-

1k+ parts

-

10k+ parts

-

2,023

$5.567

-

-

-

Vyrian

USA . 3,264 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,264

-

-

-

-

Anansix

USA . 874 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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874

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,542 parts In-Stock

1+ parts

$5.274

100+ parts

-

1k+ parts

-

10k+ parts

-

3,542

$5.274

-

-

-

AZTECH Wire

Italy . 964 parts In-Stock

1+ parts

$8.470

100+ parts

-

1k+ parts

-

10k+ parts

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964

$8.470

-

-

-

Microchip USA

USA . 3,077 parts In-Stock

1+ parts

$24.472

100+ parts

-

1k+ parts

-

10k+ parts

-

3,077

$24.472

-

-

-

UNI Independent Distributors

Spain . 1,543 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,543

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Technical Specifications

Power Management ICs MC33771BTB1AE/R2 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Channels:

14

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

61.6 V

Minimum Supply Voltage (Vsup):

9.6 V

Nominal Supply Voltage (Vsup):

56 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

10 mm

Trade Compliance

MC33771BTB1AE/R2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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