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MC32PF1510A6EPR2

NXP Semiconductors

MC32PF1510A6EPR2 by NXP Semiconductors

MC32PF1510A6EPR2 by NXP Semiconductors is a Power Management IC with 40 terminals, operating at -40 to 85°C. It features a nominal voltage of 5V, suitable for industrial applications requiring power supply management circuits in compact square chip carrier packages.

Median Price

$3.464

Lifecycle Status

Suppliers In-Stock

7

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1k+

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IBS Electronics

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Nova Conductors

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Digiode

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One Stop Electronics

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AZTECH Wire

Italy . 560 parts In-Stock

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Ampacity Inc.

Singapore . 823 parts In-Stock

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Microchip USA

USA . 6,681 parts In-Stock

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Argo Parts USA

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Overview

Unleash the power of cutting-edge technology with the MC32PF1510A6EPR2 from NXP Semiconductors. As a leader in Power Management ICs, NXP ensures top-notch quality and reliability in every product. This versatile chip carrier with very thin profile is ideal for various applications in industrial settings. With adjustable threshold and 8 channels, this power supply management circuit offers unparalleled performance and efficiency. Experience the value and benefits of NXP's innovative solutions with the MC32PF1510A6EPR2.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on a PCB surface, making it convenient for assembly and integration into electronic devices.

Nominal Supply Voltage (Vsup): 5 V

With a standard supply voltage of 5V, this power management IC can be easily integrated into a variety of electronic systems without the need for additional voltage regulation.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand elevated temperatures and operate reliably in demanding industrial environments.

Width (mm): 5 mm

The compact width of 5mm allows for space-efficient layouts on PCBs, ideal for applications where size is a constraint.

Minimum Supply Voltage (Vsup): 3.8 V

The ability to operate at a minimum supply voltage of 3.8V ensures compatibility with a wide range of power sources, making this IC versatile in different applications.

Technical Specifications

Power Management ICs MC32PF1510A6EPR2 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC40,.2SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

7 V

Minimum Supply Voltage (Vsup):

3.8 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

5 mm

Trade Compliance

MC32PF1510A6EPR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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