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NX5P2553GU6Z

NXP Semiconductors

NX5P2553GU6Z by NXP Semiconductors

NX5P2553GU6Z from NXP Semiconductors is a compact power management IC designed for industrial applications. It operates within a temperature range of -40 °C to 85 °C, supports 3/5V supplies, and features a low supply current of 0.225 mA. Its surface mount design ensures efficient space utilization in electronic devices.

Median Price

$0.305

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

$0.317

1k+ parts

$0.263

10k+ parts

$0.235

2,800

-

$0.317

$0.263

$0.235

Verical

USA . 2,800 parts In-Stock

1+ parts

-

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10k+ parts

$0.293

2,800

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-

-

$0.293

Distributors (In-Stock)

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Digiode

USA . 937 parts In-Stock

1+ parts

$0.247

100+ parts

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937

$0.247

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Vyrian

USA . 6,377 parts In-Stock

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6,377

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Anansix

USA . 989 parts In-Stock

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989

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,612 parts In-Stock

1+ parts

$0.234

100+ parts

-

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1,612

$0.234

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Microchip USA

USA . 146 parts In-Stock

1+ parts

$0.443

100+ parts

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146

$0.443

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AZTECH Wire

Italy . 929 parts In-Stock

1+ parts

$20.830

100+ parts

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929

$20.830

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QUARKTWIN TECHNOLOGY LTD

USA . 5,342 parts In-Stock

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5,342

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UNI Independent Distributors

Spain . 4,472 parts In-Stock

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4,472

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Vigor

Singapore . 880 parts In-Stock

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880

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Overview

Elevate your designs with the NX5P2553GU6Z from NXP Semiconductors, a leader in innovative power management solutions. This compact IC promises exceptional performance and reliability, ideal for industrial applications where precision is critical. With robust temperature resilience and low power consumption, it ensures efficiency in demanding environments. Choosing NXP means investing in quality that drives success—empower your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and reliability, making the IC suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for compact design and ease of integration into modern electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCB layouts, facilitating efficient design.

Power Supplies (V): 3/5

Supporting multiple power supply voltages provides flexibility for various system requirements.

No. of Terminals: 6

The 6-terminal configuration strikes a balance between functionality and compactness, useful for many applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, enhancing design versatility.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the IC is suitable for industrial environments and demanding applications.

Minimum Operating Temperature: -40 °C

The wide temperature range (-40 °C to 85 °C) ensures reliable operation in extreme conditions, making it versatile for various industries.

Terminal Position: DUAL

Dual terminal positions provide flexible mounting options, simplifying PCB design and layout.

Temperature Grade: INDUSTRIAL

Designed with an industrial temperature grade, this IC is suitable for rugged applications requiring higher reliability.

Maximum Supply Current (Isup): 0.225 mA

Low supply current makes this IC energy-efficient, ideal for battery-operated devices and power-sensitive applications.

Terminal Form: NO LEAD

No-lead terminal form minimizes footprint and enables greater design density, enhancing the overall PCB design.

Terminal Pitch: 0.635 mm

A 0.635 mm terminal pitch is standard for high-density applications, making it compatible with a range of designs.

Technical Specifications

Power Management ICs NX5P2553GU6Z attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N6

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC6,.08,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.225 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

NX5P2553GU6Z Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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