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NX5P2553GVH

NXP Semiconductors

NX5P2553GVH by NXP Semiconductors

NX5P2553GVH from NXP Semiconductors is a compact power management IC designed for industrial applications. It operates within a temperature range of -40 °C to 85 °C, supports 3/5V supplies, and features a low supply current of 0.225 mA. Its dual terminal design ensures efficient surface mounting in space-constrained environments.

Median Price

$0.235

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 505,946 parts In-Stock

1+ parts

-

100+ parts

$0.235

1k+ parts

$0.195

10k+ parts

$0.174

505,946

-

$0.235

$0.195

$0.174

DigiKey

USA . 505,946 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.290

505,946

-

-

-

$0.290

Verical

USA . 505,946 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.217

505,946

-

-

-

$0.217

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,887 parts In-Stock

1+ parts

$0.183

100+ parts

-

1k+ parts

-

10k+ parts

-

3,887

$0.183

-

-

-

Vyrian

USA . 3,375 parts In-Stock

1+ parts

$0.193

100+ parts

-

1k+ parts

-

10k+ parts

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3,375

$0.193

-

-

-

Anansix

USA . 2,607 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,607

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,079 parts In-Stock

1+ parts

$0.174

100+ parts

-

1k+ parts

-

10k+ parts

-

3,079

$0.174

-

-

-

Microchip USA

USA . 4,270 parts In-Stock

1+ parts

$0.370

100+ parts

-

1k+ parts

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10k+ parts

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4,270

$0.370

-

-

-

Kepictronics

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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30,000

-

-

-

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UNI Independent Distributors

Spain . 5,601 parts In-Stock

1+ parts

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100+ parts

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5,601

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Vigor

Singapore . 308 parts In-Stock

1+ parts

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308

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Overview

Elevate your designs with the NX5P2553GVH from NXP Semiconductors, a leader in innovative power management solutions. This compact IC enhances efficiency and reliability across diverse applications, ensuring optimal performance even in challenging environments. With its robust industrial temperature range and surface-mount convenience, you can trust it to deliver superior quality and longevity, providing exceptional value that empowers your projects and drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern circuit boards, enhancing efficiency in space utilization.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout design on PCBs, providing optimal use of available space.

Power Supplies (V): 3/5

Compatibility with 3V and 5V power supplies makes this IC versatile for a wide range of devices and applications.

No. of Terminals: 6

Having 6 terminals allows for adequate connectivity options while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, providing a smaller footprint without compromising performance.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in high-temperature environments, ideal for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is suitable for extreme temperature conditions, enhancing its application range.

Terminal Position: DUAL

Dual terminal positioning improves connection stability and facilitates easier soldering and assembly in circuits.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product maintains performance within harsh environments, suitable for industrial uses.

Maximum Supply Current (Isup): 0.225 mA

A low maximum supply current of 0.225 mA translates to energy efficiency, making this IC a good choice for battery-powered devices.

Terminal Form: NO LEAD

No lead terminal form offers a compact design while promoting environmental compliance and ease in manufacturing.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density placement on PCBs, making this IC suitable for advanced electronic systems.

Technical Specifications

Power Management ICs NX5P2553GVH attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N6

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC6,.06,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.225 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

NX5P2553GVH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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