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NX5P2924CUKZ

NXP Semiconductors

NX5P2924CUKZ by NXP Semiconductors

NX5P2924CUKZ from NXP Semiconductors is a compact power management IC designed for industrial applications. It operates within a voltage range of 1-5.5V, with a max supply current of 0.11mA and supports temperatures from -40 °C to 85 °C. Its surface mount design ensures efficient integration in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,002 parts In-Stock

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Digiode

USA . 2,702 parts In-Stock

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Anansix

USA . 96 parts In-Stock

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One Stop Electronics

USA . 1,163 parts In-Stock

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$0.500

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Vigor

Singapore . 208 parts In-Stock

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$0.640

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Microchip USA

USA . 396 parts In-Stock

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$0.736

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AZTECH Wire

Italy . 910 parts In-Stock

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Corphita

USA . 4,946 parts In-Stock

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UNI Independent Distributors

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Overview

Elevate your designs with the NX5P2924CUKZ from NXP Semiconductors, a leader in innovative power management solutions. This compact, surface-mount IC offers unmatched reliability for industrial applications, ensuring optimal performance even in extreme temperatures. With NXP's commitment to quality and cutting-edge technology, you gain enhanced energy efficiency and robust functionality, making it the perfect choice for your next project. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection, making the IC suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact designs and reduces PCB space, which is ideal for modern electronics.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on PCBs, allowing for efficient circuit layouts.

Power Supplies (V): 1/5.5

Supports a wide input voltage range from 1V to 5.5V, ensuring compatibility with various power supply requirements.

No. of Terminals: 6

Having 6 terminals enables flexible connectivity options and simplifies the integration process into electronic designs.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array enhances the performance by offering improved electrical and thermal characteristics while optimizing space.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in demanding thermal environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The capability to operate down to -40 °C ensures performance in extreme cold conditions, enhancing its applicability in diverse environments.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates a lower profile, which is beneficial for space-constrained designs.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates the IC's robustness during the soldering process, ensuring reliable assembly.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grade, this IC is designed for long-term reliability in challenging conditions.

Maximum Supply Current (Isup): 0.11 mA

Ultra-low supply current of 0.11 mA contributes to energy efficiency, making this IC ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal form enhances solderability and improves electrical performance, ensuring a reliable connection.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density integration, which is increasingly important in advanced electronic designs.

Technical Specifications

Power Management ICs NX5P2924CUKZ attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PBGA-B6

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA6,2X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1/5.5

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.11 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Trade Compliance

NX5P2924CUKZ Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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