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NX5P2925CUKZ

NXP Semiconductors

NX5P2925CUKZ by NXP Semiconductors

NX5P2925CUKZ from NXP Semiconductors is a compact power management IC designed for industrial applications. It operates within a voltage range of 1.2V to 5V, with a max supply current of 0.15mA and supports temperatures from -40 °C to 85 °C. Its surface mount design ensures efficient integration in space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,374 parts In-Stock

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6,374

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Digiode

USA . 1,938 parts In-Stock

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Anansix

USA . 1,118 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 498 parts In-Stock

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$1.168

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498

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One Stop Electronics

USA . 664 parts In-Stock

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$7.500

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664

$7.500

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AZTECH Wire

Italy . 305 parts In-Stock

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$13.730

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305

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UNI Independent Distributors

Spain . 2,397 parts In-Stock

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Vigor

Singapore . 389 parts In-Stock

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389

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Corphita

USA . 131 parts In-Stock

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Overview

Elevate your designs with the NX5P2925CUKZ from NXP Semiconductors, a leader in cutting-edge power management solutions. This robust IC ensures reliable performance across industrial applications, offering unmatched efficiency and stability in extreme temperatures. With its compact design and seamless integration, it empowers engineers to create innovative products while saving energy and reducing costs. Experience the quality and excellence that NXP is renowned for!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for higher density and smaller footprints on PCBs, enhancing design flexibility and saving space.

Package Shape: RECTANGULAR

The rectangular shape provides efficient use of board space, aligning well with modern PCB designs.

Power Supplies (V): 1.2/5

Supports multiple power supply voltages, making it versatile for various applications in power management.

No. of Terminals: 6

The 6-terminal configuration simplifies connections while ensuring reliable performance in power management tasks.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array design allows for better thermal dissipation and electrical performance, which is crucial in power management applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can function reliably in demanding environments, enhancing its application range.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures ensures reliable performance in cold environments, making it suitable for industrial usage.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easier assembly and better performance in applications with limited space.

Peak Reflow Temperature °C: 260

The high peak reflow temperature aids in compatibility with lead-free soldering processes, ensuring compliance with modern manufacturing standards.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this product is engineered to withstand extreme conditions, giving it an edge in robust applications.

Maximum Supply Current (Isup): 0.15 mA

Low supply current leads to energy efficiency, contributing to longer battery life in portable devices.

Terminal Form: BALL

Ball terminal form ensures reliable electrical connections with reduced inductance, enhancing overall performance.

Terminal Pitch: 0.5 mm

A fine pitch of 0.5 mm allows for high-density designs, making it an excellent choice for space-constrained applications.

Technical Specifications

Power Management ICs NX5P2925CUKZ attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PBGA-B6

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA6,2X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/5

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.15 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Trade Compliance

NX5P2925CUKZ Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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