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NX5P2553GUZ

NXP Semiconductors

NX5P2553GUZ by NXP Semiconductors

NX5P2553GUZ from NXP Semiconductors is a compact power management IC designed for industrial applications. It operates within a temperature range of -40 °C to 85 °C, supports 3/5V supplies, and features a low supply current of 0.225 mA. Its small outline and gull-wing terminals make it ideal for space-constrained designs.

Median Price

$0.267

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$0.277

1k+ parts

$0.230

10k+ parts

$0.205

4,000

-

$0.277

$0.230

$0.205

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.257

4,000

-

-

-

$0.257

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 394 parts In-Stock

1+ parts

$0.217

100+ parts

-

1k+ parts

-

10k+ parts

-

394

$0.217

-

-

-

Vyrian

USA . 4,336 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,336

-

-

-

-

Anansix

USA . 116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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116

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 338 parts In-Stock

1+ parts

$0.205

100+ parts

-

1k+ parts

-

10k+ parts

-

338

$0.205

-

-

-

Microchip USA

USA . 343 parts In-Stock

1+ parts

$0.385

100+ parts

-

1k+ parts

-

10k+ parts

-

343

$0.385

-

-

-

AZTECH Wire

Italy . 581 parts In-Stock

1+ parts

$10.920

100+ parts

-

1k+ parts

-

10k+ parts

-

581

$10.920

-

-

-

UNI Independent Distributors

Spain . 2,438 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,438

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-

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Vigor

Singapore . 887 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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887

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-

Overview

Elevate your designs with the NX5P2553GUZ from NXP Semiconductors—a trusted leader in power management solutions. This compact, dual-terminal IC delivers exceptional efficiency and reliability across diverse applications, from industrial automation to smart devices. With a rugged temperature range and low supply current, it ensures optimal performance even in challenging environments, providing unmatched value and peace of mind for engineers and manufacturers alike. Choose quality; choose NXP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body ensures long-lasting performance and protection against environmental factors, making it ideal for industrial applications.

Surface Mount: YES

Surface mount capability allows for compact design and easier integration into modern electronic circuits, enhancing manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space utilization on PCBs, allowing for higher density designs and optimized layouts.

Power Supplies (V): 3/5

Supports multiple voltage levels (3V and 5V), providing flexibility for use in various power management applications.

No. of Terminals: 6

The 6-terminal design offers additional connectivity options while maintaining a compact footprint, ideal for streamlined designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile are perfect for applications where space is at a premium, such as portable and handheld devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can be used in a broader range of environments without performance degradation.

Minimum Operating Temperature: -40 °C

The capability to operate as low as -40 °C ensures reliability in extreme conditions, making it suitable for industrial and outdoor applications.

Terminal Position: DUAL

Dual terminal position enhances versatility in PCB layout and improves the ease of soldering during the assembly process.

Temperature Grade: INDUSTRIAL

Industrial temperature grading indicates this IC is designed for robust performance in demanding environments, ensuring reliability over a wide temperature range.

Maximum Supply Current (Isup): 0.225 mA

A low maximum supply current results in lower power consumption, promoting energy efficiency in battery-powered devices.

Terminal Form: GULL WING

The gull-wing terminal form provides excellent soldering characteristics, promoting strong electrical connections and mechanical stability.

Terminal Pitch: 0.95 mm

The 0.95 mm terminal pitch is suitable for modern PCB designs, allowing for compact configurations without sacrificing performance.

Technical Specifications

Power Management ICs NX5P2553GUZ attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G6

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.225 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trade Compliance

NX5P2553GUZ Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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