Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Surface Mount: YES; Minimum Operating Temperature: -25 Cel;
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$2.500
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$11.540
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$99.990
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Corphita
Power Management ICs MF1S5031XDUD,005 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors
Adjustable Threshold:
Other IC type:
JESD-30 Code:
No. of Channels:
No. of Functions:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Surface Mount:
Temperature Grade:
Terminal Form:
Terminal Position:
MF1S5031XDUD,005 Other Function Semiconductors trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - MCU Dip Supply Situation 12/May/2015
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
BAV99
Toshiba
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
ULN2003ADR
Texas Instruments
ULN2003ADR by Texas Instruments is a NPN BJT with 7 elements, max IC of 0.5A, and VCEsat of 1.6V. Ideal for switching applications in small outline packages with Gull Wing terminals.
STM32H753ZIT6
STMicroelectronics
STM32H753ZIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20-Ch 16-Bit ADC and 2-Ch 12-Bit DAC channels. With a clock frequency of up to 48 MHz, it is ideal for industrial applications requiring CAN, Ethernet, and USB connectivity. This microcontroller operates b/w -40°C to +85°C temperature range.
SS14
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Forward Voltage (VF): .5 V;
2N7002DWH6327XTSA1
Infineon Technologies
2N7002DWH6327XTSA1 by Infineon: N-CHANNEL FET with 60V DS Breakdown Voltage, 0.3A ID, and 3ohm RDS. Ideal for SWITCHING applications in small outline packages with GULL WING terminals.
CR0805-FX-10R0ELF
Bourns
Bourns CR0805-FX-10R0ELF is a SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for applications requiring a temperature range of -55 to 155 °C, such as automotive electronics and industrial control systems.
IRLML6401TRPBF
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
SMBJ18CA
Thinking Electronic Industrial
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
1N4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358D-T
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDV303N
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Transistor Application: SWITCHING; JESD-609 Code: e3;
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
Itt Semiconductor
ULN2803A
Motorola
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
Excel (Suzhou) Semiconductor
FDV304P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
LT4256-2IS8#PBF
Linear Technology
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
ISPPAC-POWR1014A-01TN48I
Lattice Semiconductor
ISPPAC-POWR1014A-01TN48I by Lattice Semiconductor is a Power Management IC with 48 terminals and 10 channels. It operates at a nominal voltage of 3.3V, supports power supplies of 2.5/5,3/3.3V, and has an adjustable threshold feature. This IC is ideal for industrial applications requiring precise power management in compact spaces.
ZXCT1109SA-7
Diodes Incorporated
ZXCT1109SA-7 by Diodes Inc. is a Power Management IC with 20V nominal voltage, suitable for automotive applications. It features small outline package style, matte tin terminal finish, and operates b/w -40 to 125°C temperature range. Ideal for power supply support circuits in compact designs.
LTC4364HMS-2#TRPBF
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LT4256-1IS8#PBF
INA226AIDGSR
INA226AIDGSR by Texas Instruments is a Power Management IC with 10 terminals, operating at -40 to 125 °C. It has a supply voltage range of 2.7V to 5.5V and is suitable for automotive applications due to its small outline package style and low supply current of 0.42 mA.
AP22653W6-7
AP22653W6-7 by Diodes Inc. is a Power Management IC with 6 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 3-5.5V and adjustable threshold feature. This IC is ideal for power supply support circuits in various applications requiring compact design and surface mount capability.
MAX6371KA+T
Maxim Integrated
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: LSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
TPS2052BDRBT
TPS2052BDRBT by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 2.7V to 5.5V, and max current of 0.09mA. It is ideal for industrial applications requiring dual-channel power supply support circuits in a small outline package with very thin profile. The IC features nickel/palladium/gold terminal finish and can operate b/w -40°C to 85°C temperature range.
LTC2945HUD-1#PBF
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 12; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
TPS2052BDGNG4
TPS2052BDGNG4 by Texas Instruments is a Power Management IC with 3.3V nominal voltage, 8 terminals, and dual terminal position. It is used in power supply support circuits for industrial applications due to its small outline package style and wide operating temperature range from -40°C to 85°C.
LTC4011CFE
Analog Devices
LTC4011CFE by Analog Devices is a Power Management IC with 20 terminals and a small outline package. It operates at temperatures b/w 0°C to 70°C and has an adjustable threshold. This IC is commonly used as a power supply support circuit in various applications.
TPS25200DRVT
TPS25200DRVT by Texas Instruments is a Power Management IC with 6 terminals, operating b/w -40 to 125°C. It supports supply voltages from 2.5V to 6.5V and has an output current of 2.9A, making it ideal for automotive applications requiring precise power supply support in a compact form factor.
TPS2052BDRBR
TPS2052BDRBR by Texas Instruments is a Power Management IC with 3.3V nominal voltage, 8 terminals, and dual terminal position. It is used in power supply support circuits for industrial applications due to its small outline package style and wide operating temperature range from -40°C to 85°C.
TPS2052BDGN
TPS2052BDGN by Texas Instruments is a Power Management IC with 8 terminals, operating b/w -40 to 85°C. It supports a supply voltage range of 2.7V to 5.5V and has dual channels for power supply circuits. This small outline package is ideal for industrial applications requiring precise power management in compact spaces.
MMPF0100F9ANESR2
NXP Semiconductors
NXP Semiconductors' MMPF0100F9ANESR2 is a Power Management IC with 56 terminals, operating at -40 to 105°C. It features a 3.6V nominal voltage, suitable for industrial applications requiring MOS technology and adjustable threshold capabilities.
MAX811TEUS-T
Onsemi
MAX811TEUS-T by Onsemi is a Power Management IC with 3.3V nominal voltage, 4 terminals, and CMOS technology. It is used in power supply support circuits for industrial applications, operating b/w -40 to 85°C with a max seated height of 1.14mm.
TPS26632RGET
TPS26632RGET by Texas Instruments is a Power Management IC with 24V nominal voltage and 6A max output current. It features a chip carrier package style, suitable for automotive applications. With adjustable threshold and surface mount capability, it offers efficient power supply support in compact designs.
TPS650250RHBR
TPS650250RHBR by Texas Instruments is a Power Management IC with 32 terminals, Vsup of 3.6V, and max output current of 1.6A. Ideal for industrial applications requiring precise power supply support circuits in compact spaces.
LTC4417HGN#PBF
LTC4417HGN#PBF by Analog Devices is a Power Management IC with 24 terminals, operating from -40 to 125 °C. It supports a supply voltage range of 2.5V to 36V and has an adjustable threshold of +1V. Ideal for automotive applications due to its small outline package and CMOS technology.
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MF1S5030XDA4/V1J
NXP Semiconductors' MF1S5030XDA4/V1J is a Power Management IC with 16 terminals, plastic/epoxy body, and rectangular package shape. Ideal for power supply support circuits, it operates b/w -25°C to 70°C. Suitable for surface mount applications in microelectronic assemblies.
MF1S5000XDA8
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 14; Package Shape: RECTANGULAR; Surface Mount: YES; No. of Channels: 1;
MF1S5030XDA4,118
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Shape: RECTANGULAR; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;
MF1S5001XDUD2/V1
POWER SUPPLY SUPPORT CIRCUIT;
MF1S5009DUD
POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Surface Mount: YES; No. of Channels: 1;
MF1S5001XDUD
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; No. of Functions: 1;
MF1S5030XDA4/V1
MF1S5000XDA4,118
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Shape: RECTANGULAR; Surface Mount: YES; Adjustable Threshold: NO;
MF1S5000XDA8,118
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 14; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Form: NO LEAD;
MF1S5001XDUD/V1
MF1S5001XDUF
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; Minimum Operating Temperature: -25 Cel;
MF1S5009DA4
POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: OTHER; Package Shape: RECTANGULAR; Surface Mount: YES; No. of Channels: 1; Terminal Position: UNSPECIFIED;
MF1S5000XDA8/V1J
MF1S5030XDA4
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Shape: RECTANGULAR; Surface Mount: YES; Minimum Operating Temperature: -25 Cel;
MF1S5000XDA4/V1J
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Shape: RECTANGULAR; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
MF1S5001XDUF,005
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Form: NO LEAD;
MF1S5001XDUD,005
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Surface Mount: YES; Adjustable Threshold: NO;
MF1S5000XDA4
MF1S5000XDA4/V1
MF1S5000XDA8/V1
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