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MF1S5000XDA8

NXP Semiconductors

MF1S5000XDA8 by NXP Semiconductors

MF1S5000XDA8 by NXP Semiconductors is a versatile power management IC designed for microelectronic assemblies. It operates b/w -25 °C and 70 °C, features a 14-terminal no-lead design, and supports efficient power supply applications. Ideal for compact electronic devices, it ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,367 parts In-Stock

1+ parts

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1k+ parts

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3,367

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Vyrian

USA . 1,704 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,704

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Anansix

USA . 255 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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255

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 487 parts In-Stock

1+ parts

$1.500

100+ parts

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1k+ parts

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10k+ parts

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487

$1.500

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UNI Independent Distributors

Spain . 7,541 parts In-Stock

1+ parts

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100+ parts

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7,541

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Corphita

USA . 533 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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533

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Overview

Unlock the power of innovation with the MF1S5000XDA8 from NXP Semiconductors. Renowned for their commitment to quality and cutting-edge technology, NXP empowers your designs with reliable performance in various applications, from industrial automation to consumer electronics. With its compact, surface-mount design, this Power Management IC enhances efficiency, minimizes heat, and optimizes energy use—delivering unmatched value that drives your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and protects the internal components, making this power management IC reliable for various applications.

Surface Mount: YES

Being surface mount compatible makes it easy to integrate into compact circuit designs, ideal for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, allowing for more efficient layout and design flexibility.

No. of Terminals: 14

Having 14 terminals provides sufficient connectivity options, enabling versatile integration while ensuring reliable performance.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

This package style is suited for high-density applications, ensuring compactness and efficient design.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures stable performance in a variety of environments, making it suitable for numerous applications.

Minimum Operating Temperature: -25 °C

The ability to operate at temperatures as low as -25 °C allows for use in extreme environments, increasing the versatility of the product.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit ensures efficient power management, making it an ideal choice for improving overall system performance.

Terminal Form: NO LEAD

No lead terminals offer a smaller footprint, enabling a more compact design and reducing inductance for better performance.

Technical Specifications

Power Management ICs MF1S5000XDA8 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PXMA-N14

Moisture Sensitivity Level (MSL):

NOT APPLICABLE

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

MF1S5000XDA8 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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