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MF1S5000XDA4

NXP Semiconductors

MF1S5000XDA4 by NXP Semiconductors

MF1S5000XDA4 by NXP Semiconductors is a versatile power management IC designed for microelectronic assemblies. It features a 16-terminal, no-lead design with an operating temp range of -25 °C to 70 °C. Ideal for power supply support circuits in compact applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,365 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,365

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Anansix

USA . 2,221 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,221

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Digiode

USA . 1,425 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,425

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,595 parts In-Stock

1+ parts

$5.500

100+ parts

-

1k+ parts

-

10k+ parts

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1,595

$5.500

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Futuretech Components

Singapore . 17,000 parts In-Stock

1+ parts

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17,000

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UNI Independent Distributors

Spain . 7,335 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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7,335

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Corphita

USA . 3,999 parts In-Stock

1+ parts

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3,999

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Perfect Parts

USA . 132 parts In-Stock

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132

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Overview

Unlock the power of efficiency with the MF1S5000XDA4 from NXP Semiconductors, a leader in innovative solutions. Designed for reliability and performance, this Power Management IC excels in a myriad of applications, providing seamless support for your electronic designs. With its robust construction and versatile functionality, it ensures optimal energy management while enhancing system longevity—perfect for today’s tech-driven world. Elevate your projects with unparalleled quality and expertise from NXP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides excellent durability and resistance to environmental factors, making the IC reliable in various applications.

Surface Mount: YES

With surface mount technology, this IC can be easily integrated into compact designs, saving board space and allowing for high-density assembly.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on the PCB and enhances thermal management, making it suitable for larger power applications.

No. of Terminals: 16

Having 16 terminals allows for diverse connectivity options, providing flexibility in circuit design and increasing functionality.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly style ensures high reliability and performance, making it an ideal choice for advanced electronics.

Maximum Operating Temperature: 70 °C

Operating up to 70 °C ensures performance stability in a wide range of environmental conditions, suitable for various industrial applications.

Minimum Operating Temperature: -25 °C

With a minimum temperature rating of -25 °C, this IC is capable of functioning in extreme cold, increasing its versatility in applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed as a power supply support circuit, this IC is essential for managing power distribution and enhancing the reliability of electronic devices.

Terminal Form: NO LEAD

The no lead terminal form contributes to a reduced footprint on the PCB and provides improved electrical performance by minimizing parasitic effects.

Technical Specifications

Power Management ICs MF1S5000XDA4 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PXMA-N16

Moisture Sensitivity Level (MSL):

NOT APPLICABLE

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

MF1S5000XDA4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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