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MF1S5001XDUD

NXP Semiconductors

MF1S5001XDUD by NXP Semiconductors

MF1S5001XDUD by NXP Semiconductors is a power management IC designed for efficient energy regulation. It operates b/w -25 °C and 70 °C, features a no-lead terminal form, and comes in an uncasded chip package. Ideal for compact applications requiring reliable power supply support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,979 parts In-Stock

1+ parts

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2,979

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Vyrian

USA . 2,083 parts In-Stock

1+ parts

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2,083

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Anansix

USA . 79 parts In-Stock

1+ parts

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79

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 349 parts In-Stock

1+ parts

$5.500

100+ parts

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349

$5.500

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UNI Independent Distributors

Spain . 7,522 parts In-Stock

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7,522

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Corphita

USA . 4,492 parts In-Stock

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4,492

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Perfect Parts

USA . 6 parts In-Stock

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6

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Overview

Elevate your designs with the MF1S5001XDUD from NXP Semiconductors, a leader in innovative power management solutions. This robust power management IC offers exceptional reliability and efficiency, catering to diverse applications from consumer electronics to industrial systems. With its superior quality and performance, you can trust that your projects will thrive under varying environmental conditions, enhancing longevity and user satisfaction. Experience unparalleled value and seamless integration with NXP's renowned engineering excellence.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for efficient and compact integration into various circuit designs, making it ideal for space-constrained applications.

Package Style (Meter): UNCASED CHIP

The unencased chip design facilitates better thermal management and enables customization options for specific applications.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in a wide range of environments, suitable for industrial applications.

Minimum Operating Temperature: -25 °C

With a minimum operating temperature of -25 °C, this IC can function effectively in colder climates, making it versatile for various applications.

Terminal Position: UPPER

The upper terminal position allows for easy accessibility during assembly and maintenance, enhancing convenience for engineers.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply support, this IC is optimized for efficiency, ensuring stable power management and improved overall system performance.

Terminal Form: NO LEAD

The no-lead terminal form minimizes parasitic inductance and capacitance, contributing to better electrical performance and signal integrity.

Technical Specifications

Power Management ICs MF1S5001XDUD attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

NO

JESD-30 Code:

X-XUUC-N

No. of Channels:

1

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

MF1S5001XDUD Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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