Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MF1S5001XDUF by NXP Semiconductors is a surface mount power management IC designed for robust applications. It operates b/w -25 °C and 70 °C, featuring a no-lead terminal form for efficient space utilization. Ideal for power supply support circuits in compact devices.
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The surface mount capability allows for efficient and compact designs, making this Power Management IC suitable for applications where space is limited.
Being an uncashed chip provides flexibility in custom packaging, which can lead to reduced size and weight in final products.
With a maximum operating temperature of 70 °C, this IC is resilient in moderate temperature environments, ensuring reliability during operation.
The capability to operate in temperatures as low as -25 °C makes this IC suitable for outdoor and harsh environment applications.
Upper terminal positioning simplifies PCB layout and facilitates easier soldering in high-density applications.
Designed as a power supply support circuit, this IC optimally manages power distribution, enhancing overall system performance and efficiency.
The no-lead terminal form supports high-density designs and advanced packaging techniques, contributing to improved efficiency in space-constrained applications.
Power Management ICs MF1S5001XDUF attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors
Adjustable Threshold:
Other IC type:
JESD-30 Code:
No. of Channels:
No. of Functions:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Qualification:
Surface Mount:
Temperature Grade:
Terminal Form:
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MF1S5001XDUF Other Function Semiconductors trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
2N7002
Weitron Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Terminal Finish: TIN LEAD; Maximum Operating Temperature: 150 Cel;
1N4148WS
Synsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
SMBJ18CA
Changzhou Starsea Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
MBR0540T1G
Onsemi
MBR0540T1G by Onsemi is a Schottky rectifier diode with max. forward voltage of 0.62V and max. output current of 0.5A, ideal for applications requiring high efficiency power conversion in small outline packages. Operating temp range: -55 to 150°C, with peak reflow temp at 260°C, making it suitable for various electronic devices needing reliable rectification performance in compact designs.
2N2222A
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
SS14
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WSF-7
Diodes Incorporated
1N4148WSF-7 by Diodes Inc. is a single silicon rectifier diode with max output current of 0.25A and max reverse voltage of 100V. It operates b/w -55 to 150°C, has a small outline package style, and is suitable for surface mount applications in various electronic circuits.
Allegro MicroSystems
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SDR0604-101KL
Bourns
SDR0604-101KL by Bourns is a surface mount fixed inductor with a nominal inductance of 100 uH. It is a general purpose inductor suitable for power applications, with a max rated current of 0.52 A and a self-resonance frequency of 9 MHz.
MBR1560CT
General Instrument
MBR1560CT by General Instrument is a common cathode rectifier diode with a max forward voltage of 0.75V and max output current of 15A. It is used for efficiency applications, has a package shape of rectangular, and can operate in temperatures ranging from -65 to 150 °C.
Philips Components
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Transys Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM555CN
Texas Instruments
LM555CN by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V. It operates b/w 0°C to 70°C, making it suitable for commercial applications. This rectangular package IC has dual terminals and uses bipolar technology for pulse generation in various electronic circuits.
LM107H/883
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
LM358N
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
MAX809STRG
MAX809STRG by Onsemi is a Power Management IC with 3.3V nominal voltage, suitable for industrial applications. It features a small outline package with matte tin finish and operates in temperatures ranging from -40 to 105°C. With a max supply current of 0.0025mA, it provides power supply support in compact designs.
MAX809STRGH
MAX809STRGH by Onsemi is a Power Management IC with 3.3V Nominal Voltage, suitable for industrial applications. It features a small outline package style, Gull Wing terminal form, and can operate in temperatures ranging from -40 to 105°C. This IC supports power supply circuits and is designed for surface mount installation.
MAX17526AATP+T
Analog Devices
MAX17526AATP+T by Analog Devices is a Power Management IC with 20 terminals, operating at -40 to 125 °C. It supports supply voltages from 5.5V to 60V and has an adjustable threshold of +12.4V, making it ideal for automotive applications requiring precise power management in a compact square package.
FDC6326L
FDC6326L by Onsemi is a power management IC with a nominal voltage of 5V. It has a small outline, thin profile package style and is surface mountable. This IC is commonly used as a power supply support circuit in various applications.
LTC2955IDDB-1#TRMPBF
LTC2955IDDB-1#TRMPBF by Analog Devices is a Power Management IC with 10 terminals, operating from -40 to 85°C. It supports supply voltages from 1.5V to 36V and has an adjustable threshold feature. This IC is ideal for industrial applications requiring precise power supply support circuits in compact spaces.
SM72442MT/NOPB
National Semiconductor
Power Management Circuits; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
TPS3809K33DBVT
TPS3809K33DBVT by Texas Instruments is a Power Management IC with a nominal voltage of 3.3V, suitable for industrial applications. It features a small outline package style, dual terminal position, and low power consumption at 0.025mA max supply current. Ideal for power supply support circuits in temperature-sensitive environments.
TPS2051BDGN
TPS2051BDGN by Texas Instruments is a Power Management IC with 8 terminals, operating at -40 to 85°C. It supports a nominal voltage of 3.3V and has a max supply current of 0.07mA. Ideal for industrial applications requiring power supply support circuits in compact spaces.
BQ76952PFBR
BQ76952PFBR by Texas Instruments is a Power Management IC with 48 terminals, operating from -40 to 85°C. It has a supply voltage range of 4.7V to 80V and features 16 channels for power supply management circuits. The IC is designed for industrial applications requiring adjustable threshold settings and high-temperature operation up to 260°C during reflow.
FPF2101
Onsemi's FPF2101 is a Power Management IC with 5 terminals, operating from -40 to 85°C. It supports supply voltages from 1.8V to 5.5V and has a small outline package suitable for power supply circuits in various applications.
LTC2954ITS8-2#TRMPBF
LTC2954ITS8-2#TRMPBF by Analog Devices is a Power Management IC with 8 terminals, operating from -40 to 85°C. It supports supply voltages from 2.7V to 26.4V and has an adjustable threshold feature. Ideal for industrial applications requiring a compact, surface-mountable solution with CMOS technology.
LM5060MM/NOPB
Power Management Circuits; No. of Terminals: 10; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Finish: MATTE TIN;
ZXCT1110W5-7
ZXCT1110W5-7 by Diodes Inc. is a Power Management IC with Vsup range of 2.5V to 36V, operating temp from -40°C to 125°C, and small outline package style. Ideal for automotive applications requiring power supply support circuits in compact spaces.
INA219BID
INA219BID by Texas Instruments is a Power Management IC with 3.3V nominal voltage and 1mA max supply current. It features a small outline package style, suitable for automotive applications. With a temperature range of -40 to 125°C, it offers precise power monitoring in compact designs.
MAX16054AZT+T
Maxim Integrated
POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LTC4365ITS8-1#TRMPBF
Linear Technology
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LTC3350EUHF#TRPBF
LTC3350EUHF#TRPBF by Analog Devices is a Power Management IC with 38 terminals, operating from -40 to 125 °C. It supports supply voltages from 4.5V to 35V and has an adjustable threshold of 1.3V, making it ideal for power supply support circuits in various applications.
MAX17613AATP+T
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
LTC4367HMS8#PBF
LTC4367HMS8#PBF by Analog Devices is a Power Management IC with 8 terminals, operating b/w -40 to 125°C. It supports supply voltages from 2.5V to 60V and has an adjustable threshold feature. Ideal for automotive applications due to its small outline package and surface mount capability.
FPF2193
Fairchild Semiconductor
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
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MF1S5030XDA4/V1J
NXP Semiconductors
NXP Semiconductors' MF1S5030XDA4/V1J is a Power Management IC with 16 terminals, plastic/epoxy body, and rectangular package shape. Ideal for power supply support circuits, it operates b/w -25°C to 70°C. Suitable for surface mount applications in microelectronic assemblies.
MF1S5000XDA8
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 14; Package Shape: RECTANGULAR; Surface Mount: YES; No. of Channels: 1;
MF1S5030XDA4,118
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Shape: RECTANGULAR; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;
MF1S5001XDUD2/V1
POWER SUPPLY SUPPORT CIRCUIT;
MF1S5009DUD
POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Surface Mount: YES; No. of Channels: 1;
MF1S5001XDUD
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; No. of Functions: 1;
MF1S5030XDA4/V1
MF1S5000XDA4,118
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Shape: RECTANGULAR; Surface Mount: YES; Adjustable Threshold: NO;
MF1S5000XDA8,118
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 14; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Form: NO LEAD;
MF1S5001XDUD/V1
MF1S5009DA4
POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: OTHER; Package Shape: RECTANGULAR; Surface Mount: YES; No. of Channels: 1; Terminal Position: UNSPECIFIED;
MF1S5000XDA8/V1J
MF1S5030XDA4
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Shape: RECTANGULAR; Surface Mount: YES; Minimum Operating Temperature: -25 Cel;
MF1S5000XDA4/V1J
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Shape: RECTANGULAR; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
MF1S5001XDUF,005
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Form: NO LEAD;
MF1S5001XDUD,005
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Surface Mount: YES; Adjustable Threshold: NO;
MF1S5000XDA4
MF1S5000XDA4/V1
MF1S5000XDA8/V1
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