Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MF1S5030XDA4 by NXP Semiconductors is a versatile power management IC designed for microelectronic assemblies. It features a 16-terminal, no-lead design with an operating temp range of -25 °C to 70 °C. Ideal for power supply support circuits in compact applications.
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The plastic/epoxy package material provides excellent durability and protects the IC from environmental factors, making it ideal for a variety of applications.
Surface mount capability enables more compact designs and simplifies assembly processes, allowing for efficient use of PCB space and reducing manufacturing costs.
The rectangular shape is advantageous for better layout on PCB, facilitating effective routing of traces and optimizing the overall performance of the circuit.
With 16 terminals, this IC offers a versatility of connections for various functionalities, allowing for more complex power management solutions.
The microelectronic assembly style is designed for high-density circuits, ensuring reliable connections and reducing the potential for signal interference.
A maximum operating temperature of 70 °C ensures reliability and stable performance under moderately high thermal conditions, making it suitable for demanding environments.
The minimum operating temperature of -25 °C allows the IC to function in harsh, cold conditions, providing a wide operating range for diverse applications.
Being classified as a power supply support circuit highlights its capability to manage power effectively, ensuring stable voltage and current regulation for connected devices.
No lead terminals facilitate a compact design and improve performance by reducing parasitic inductance, making it ideal for high-frequency applications.
Power Management ICs MF1S5030XDA4 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors
Adjustable Threshold:
Other IC type:
JESD-30 Code:
Moisture Sensitivity Level (MSL):
No. of Channels:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Surface Mount:
Temperature Grade:
Terminal Form:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
MF1S5030XDA4 Other Function Semiconductors trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
BSS138LT3G
Onsemi
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
1N4148WT
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SBAV99LT1G
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
Taitron Components
SMBJ18CA
General Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Eic Semiconductor
B340A-13-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBT2907ALT1G
Rochester Electronics
PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 200 MHz; Maximum Collector Current (IC): .6 A; Terminal Form: GULL WING;
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LL4148
Promax-johnton
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
SS14
Goodwork Semiconductor
National Semiconductor
2N7002
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
BSS138
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Minimum DS Breakdown Voltage: 50 V; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
1N4148
Microchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
FT232RQ-REEL
FTDI
FTDI's FT232RQ-REEL is a USB bus controller with 32 terminals, operating at 3.3-5.25V. It supports data transfer rates up to 60MBps and clock frequency of 12.02MHz, suitable for RS232/RS422/RS485 interfaces in various applications like industrial automation and communication systems.
STM32H743IIT6
STMicroelectronics
STM32H743IIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications due to its wide temperature range (-40°C to 85°C) and various connectivity options (CAN, I2C, UART, USB).
LTC2945IMS#PBF
Analog Devices
LTC2945IMS#PBF by Analog Devices is a Power Management IC with 12 terminals, operating b/w -40 to 85°C. It supports supply voltages from 2.7V to 80V and has an adjustable threshold feature. Ideal for industrial applications requiring precise power monitoring in compact spaces.
TPS3700QDDCRQ1
Texas Instruments
TPS3700QDDCRQ1 by Texas Instruments is a power management IC with a nominal voltage of 5V. It has a small outline package style and is suitable for automotive applications. Its adjustable threshold and dual terminal position make it versatile for various power supply support circuits.
TPS386000RGPR
TPS386000RGPR by Texas Instruments is a Power Management IC with 20 terminals, operating at -40 to 125 °C. It has a supply voltage range of 1.8-6.5 V and features adjustable threshold levels for automotive applications. This surface-mount chip carrier package is designed for power supply management circuits with very thin profile dimensions of 4x4 mm.
LTC4357IDCB#TRMPBF
Linear Technology
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: HVSON; Package Shape: RECTANGULAR; Surface Mount: YES;
LTC6811IG-1#TRPBF
LTC6811IG-1#TRPBF by Analog Devices is a Power Management IC with 12 channels, Vsup range of 11V to 55V, and operating temp from -40°C to 85°C. It is used in industrial applications for power supply management circuits due to its small outline package and CMOS technology.
FUSB302BMPX
FUSB302BMPX by Onsemi is a Power Management IC with 14 terminals, operating voltage range of 2.7V to 5.5V, and temperature range of -40°C to 85°C. It features adjustable threshold, surface mount package style, and industrial temperature grade suitable for power supply support circuits in various applications.
TPS2051BDGNR
TPS2051BDGNR by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 2.7V to 5.5V, and temperature range of -40°C to 85°C. It is designed for industrial applications requiring a small outline package with surface mount capability and dual terminal position.
LT1641-2IS8#PBF
LT1641-2IS8#PBF by Analog Devices is a Power Management IC with 24V Vsup, -40 to 85°C operating temp range, and 80V max Vsup. It's used in industrial applications for power supply support circuits due to its adjustable threshold feature and small outline package style.
PLM74801QDRRRQ1
PLM74801QDRRRQ1 by Texas Instruments is a Power Management IC with AEC-Q100 screening, suitable for automotive applications. It features a nominal voltage of 12V, adjustable threshold, and operates in temperatures ranging from -40 to 125°C. This IC has a small outline package style with low profile and dual terminal position.
LTC4368IMS-2#PBF
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 10; Package Code: HTSSOP; Package Shape: SQUARE; Surface Mount: YES;
INA234AIYBJR
Texas Instruments' INA234AIYBJR is a Power Management IC with 8 terminals and a supply voltage range of 1.7V to 5.5V. Featuring a very thin profile, fine pitch grid array package, it operates b/w -40°C to 125°C. Ideal for power supply support circuits, this IC offers an adjustable threshold voltage of 0.95V for various applications.
LTC1760CFW#TRPBF
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LTC2945CUD#PBF
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 12; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
MAX809STRGH
MAX809STRGH by Onsemi is a Power Management IC with 3.3V Nominal Voltage, suitable for industrial applications. It features a small outline package style, Gull Wing terminal form, and can operate in temperatures ranging from -40 to 105°C. This IC supports power supply circuits and is designed for surface mount installation.
TPL5010DDCR
TPL5010DDCR by Texas Instruments is a Power Management IC with Vsup range of 1.8V to 5.5V, operating temp from -40°C to 105°C. It has a small outline package, suitable for industrial applications requiring low supply current and adjustable threshold functionality.
LTC4417HUF#PBF
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
FPF2002
Fairchild Semiconductor
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 5; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
MAX809SEUR-T
Maxim Integrated
MAX809SEUR-T by Maxim Integrated is a Power Management IC with 3.3V supply voltage, 1.2V min supply voltage, and 5.5V max supply voltage. It is used in power supply support circuits for industrial applications due to its small outline, thin profile package style and dual terminal position.
BQ24070RHLR
BQ24070RHLR by Texas Instruments is a Power Management IC with 20 terminals, operating b/w -40 to 85°C. It supports power supplies from 4.3V to 16V, with an adjustable threshold and peak reflow temperature of 260°C. Ideal for industrial applications requiring low supply current and thin profile packaging.
TPS26636PWPT
TPS26636PWPT by Texas Instruments is a Power Management IC with 20 terminals, operating at -40 to 125 °C. It supports a max output current of 6A and has an adjustable threshold for automotive applications. The package is rectangular in shape, made of plastic/epoxy, and suitable for surface mount with a small outline design.
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MF1S5030XDA4/V1J
NXP Semiconductors
NXP Semiconductors' MF1S5030XDA4/V1J is a Power Management IC with 16 terminals, plastic/epoxy body, and rectangular package shape. Ideal for power supply support circuits, it operates b/w -25°C to 70°C. Suitable for surface mount applications in microelectronic assemblies.
MF1S5000XDA8
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 14; Package Shape: RECTANGULAR; Surface Mount: YES; No. of Channels: 1;
MF1S5030XDA4,118
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Shape: RECTANGULAR; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;
MF1S5001XDUD2/V1
POWER SUPPLY SUPPORT CIRCUIT;
MF1S5009DUD
POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Surface Mount: YES; No. of Channels: 1;
MF1S5001XDUD
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; No. of Functions: 1;
MF1S5030XDA4/V1
MF1S5000XDA4,118
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Shape: RECTANGULAR; Surface Mount: YES; Adjustable Threshold: NO;
MF1S5000XDA8,118
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 14; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Form: NO LEAD;
MF1S5001XDUD/V1
MF1S5001XDUF
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; Minimum Operating Temperature: -25 Cel;
MF1S5009DA4
POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: OTHER; Package Shape: RECTANGULAR; Surface Mount: YES; No. of Channels: 1; Terminal Position: UNSPECIFIED;
MF1S5000XDA8/V1J
MF1S5000XDA4/V1J
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Shape: RECTANGULAR; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
MF1S5001XDUF,005
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Form: NO LEAD;
MF1S5001XDUD,005
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Surface Mount: YES; Adjustable Threshold: NO;
MF1S5000XDA4
MF1S5000XDA4/V1
MF1S5000XDA8/V1
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