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MF1S5030XDA4

NXP Semiconductors

MF1S5030XDA4 by NXP Semiconductors

MF1S5030XDA4 by NXP Semiconductors is a versatile power management IC designed for microelectronic assemblies. It features a 16-terminal, no-lead design with an operating temp range of -25 °C to 70 °C. Ideal for power supply support circuits in compact applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,846 parts In-Stock

1+ parts

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1k+ parts

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3,846

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Digiode

USA . 2,957 parts In-Stock

1+ parts

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1k+ parts

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2,957

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Anansix

USA . 2,052 parts In-Stock

1+ parts

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100+ parts

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2,052

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 131 parts In-Stock

1+ parts

$7.500

100+ parts

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1k+ parts

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131

$7.500

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UNI Independent Distributors

Spain . 7,178 parts In-Stock

1+ parts

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7,178

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Corphita

USA . 4,361 parts In-Stock

1+ parts

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4,361

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Perfect Parts

USA . 132 parts In-Stock

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132

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Overview

Unlock unparalleled efficiency with the MF1S5030XDA4 from NXP Semiconductors, a leader in innovative power management solutions. This versatile IC is designed for seamless integration in diverse applications, ensuring optimal performance even in challenging environments. Crafted with NXP's commitment to quality and reliability, it empowers designers to create energy-efficient systems that drive value and innovation, ultimately enhancing user experience and satisfaction.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides excellent durability and protects the IC from environmental factors, making it ideal for a variety of applications.

Surface Mount: YES

Surface mount capability enables more compact designs and simplifies assembly processes, allowing for efficient use of PCB space and reducing manufacturing costs.

Package Shape: RECTANGULAR

The rectangular shape is advantageous for better layout on PCB, facilitating effective routing of traces and optimizing the overall performance of the circuit.

No. of Terminals: 16

With 16 terminals, this IC offers a versatility of connections for various functionalities, allowing for more complex power management solutions.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly style is designed for high-density circuits, ensuring reliable connections and reducing the potential for signal interference.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability and stable performance under moderately high thermal conditions, making it suitable for demanding environments.

Minimum Operating Temperature: -25 °C

The minimum operating temperature of -25 °C allows the IC to function in harsh, cold conditions, providing a wide operating range for diverse applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being classified as a power supply support circuit highlights its capability to manage power effectively, ensuring stable voltage and current regulation for connected devices.

Terminal Form: NO LEAD

No lead terminals facilitate a compact design and improve performance by reducing parasitic inductance, making it ideal for high-frequency applications.

Technical Specifications

Power Management ICs MF1S5030XDA4 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PXMA-N16

Moisture Sensitivity Level (MSL):

NOT APPLICABLE

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

MF1S5030XDA4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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