Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Surface Mount: YES; Adjustable Threshold: NO;
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$0.500
UNI Independent Distributors
Corphita
Power Management ICs MF1S5001XDUD,005 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors
Adjustable Threshold:
Other IC type:
JESD-30 Code:
No. of Channels:
No. of Functions:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
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MF1S5001XDUD,005 Other Function Semiconductors trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LM358N
Texas Instruments
LM358N by Texas Instruments is an operational amplifier with 2 functions, offering a max input offset voltage of 9000 uV and a nominal common mode reject ratio of 85 dB. Widely used in commercial applications, it operates at temperatures ranging from 0 to 70 °C and has a unity gain bandwidth of 1000 kHz.
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
MBR130T1G
Onsemi
MBR130T1G by Onsemi is a Schottky rectifier diode with max output current of 1A and max repetitive peak reverse voltage of 30V. It operates b/w -65 to 125°C, suitable for surface mount applications in electronics requiring low forward voltage drop.
SS14
Goodwork Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
FDV304P
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
BSS123LT1G
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
LM358AN
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BAV99-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
ROHM
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
1N4148
Leshan Radio
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Toshiba
Micro Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Baneasa S A
CRCW06030000Z0EAHP
Vishay Intertechnology
Vishay Intertechnology's CRCW06030000Z0EAHP is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating temp range -55 to 155 °C, it's SMT package style makes it ideal for automotive applications meeting AEC-Q200 standard.
1N4148WS
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; No. of Elements: 1; Maximum Output Current: .2 A; Config: SINGLE;
Sangdest Microelectronics (Nanjing)
ERJU06F10R0V
Panasonic
ERJU06F10R0V by Panasonic is an 0805 size SMT fixed resistor with a resistance of 10 ohm and 1% tolerance. It operates b/w -55 to 155 °C, suitable for AEC-Q200 standards in automotive applications due to its high temperature coefficient of 100 ppm/°C. With a max operating voltage of 150 V and power dissipation of 0.125 W, it is ideal for surface mounting type.
LM317T
Inchange Semiconductor
Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;
MIC2009YM6-TR
Micrel
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM5069MMX-1/NOPB
LM5069MMX-1/NOPB by Texas Instruments is a Power Management IC with 48V nominal voltage and 500A max output current. It features a small outline package, matte tin terminal finish, and automotive temperature grade. Ideal for power supply support circuits in applications requiring high voltage and low power consumption.
TPS3701DDCR
TPS3701DDCR by Texas Instruments is a Power Management IC with 6 terminals, operating from -40 to 125 °C. It has a supply voltage range of 1.8-36V and adjustable threshold at +0.04V, suitable for automotive applications requiring power supply support circuits in compact designs.
UC3906DW
UC3906DW by Texas Instruments is a Power Management IC with 16 terminals, operating b/w -20 to 70°C. It supports supply voltages from 5V to 40V and features a small outline package for power supply applications. The IC has a rectangular shape, measures 10.3mm in length, and is suitable for surface mount assembly with a max reflow temperature of 260°C.
TPS26602RHFT
TPS26602RHFT by Texas Instruments is a Power Management IC with 24V nominal voltage and 2.23A max output current. It features a rectangular package style, suitable for automotive applications, with a temperature range of -40 to 125°C. This IC supports power supply circuits in compact designs with surface mount capability.
MCP130T-300I/TT
Microchip Technology
MCP130T-300I/TT by Microchip Technology is a Power Management IC with 3 terminals, operating voltage range of 1-5.5V, and industrial temperature grade. It is a surface-mount device in a small outline package suitable for power supply support circuits in various applications.
TUSB4041IPAPQ1
TUSB4041IPAPQ1 by Texas Instruments is a Power Management IC with a supply voltage range of 0.99V to 1.26V. It has a package style of flatpack, heat sink/slug, thin profile, and fine pitch. This IC is commonly used as a power supply support circuit in industrial applications.
TPS3808G01DBVT
TPS3808G01DBVT by Texas Instruments is a Power Management IC with 6 terminals, operating voltage range of 1.7V to 6.5V, and adjustable threshold voltage of +0.405V. It is designed for automotive applications, featuring a small outline package with nickel/palladium/gold terminal finish for surface mount assembly at temperatures up to 260°C.
LTC4364HDE-2#PBF
Linear Technology
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 14; Package Code: HVSON; Package Shape: RECTANGULAR; Surface Mount: YES;
LM5069MM-2
National Semiconductor
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE; Surface Mount: YES;
LTC4368IDD-2#PBF
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 10; Package Code: HVSON; Package Shape: SQUARE; Surface Mount: YES;
LTC2945HMS#PBF
Analog Devices
LTC2945HMS#PBF by Analog Devices is a Power Management IC with 12 terminals, operating from -40 to 125 °C. It supports supply voltages from 4V to 80V and has an adjustable threshold feature. Ideal for automotive applications due to its CMOS technology and compact design.
NCP333FCT2G
NCP333FCT2G by Onsemi is a Power Management IC with 3.3V supply voltage, suitable for power supply support circuits. It features a grid array package style, very thin profile, and fine pitch terminals. Operating temperature ranges from -40 to 85°C, making it ideal for various applications requiring precise power management in compact spaces.
MMPF0100NPAEP
The NXP Semiconductors MMPF0100NPAEP is a Power Management IC with 56 terminals, 14 channels, and MOS technology. It operates b/w -40 to 85°C, supports a supply voltage range of 2.8V to 4.5V, and has an adjustable threshold feature. Ideal for industrial applications requiring precise power management in compact spaces.
LTC4412HS6#TRMPBF
LTC4412HS6#TRMPBF by Analog Devices is a Power Management IC with 12V nominal voltage, -40 to 150°C operating temperature range, and 28V max supply voltage. It is used in automotive applications for power supply support circuits due to its small outline package and dual terminal position.
MIC2091-1YM5-TR
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 5; Package Code: LSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LTC6811HG-1#PBF
POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 48; Package Code: SSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM5060Q1MM/NOPB
LM5060Q1MM/NOPB by Texas Instruments is a Power Management IC with 10 terminals, operating temperature range of -40 to 125°C, and max supply voltage of 65V. It is designed for automotive applications, offering adjustable threshold voltage at +5.1V and supporting power supplies up to 14V with a max output current of 500A.
LTC4367CMS8#PBF
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE; Surface Mount: YES;
TPS3700DDCR
TPS3700DDCR by Texas Instruments is a Power Management IC with 6 terminals, operating voltage range of 1.8V to 18V, and adjustable threshold feature. It is designed for automotive applications, offering a small outline package style and dual terminal position for space-constrained environments. With a low supply current of 0.013mA, it ensures efficient power supply support in various electronic systems.
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MF1S5030XDA4/V1J
NXP Semiconductors' MF1S5030XDA4/V1J is a Power Management IC with 16 terminals, plastic/epoxy body, and rectangular package shape. Ideal for power supply support circuits, it operates b/w -25°C to 70°C. Suitable for surface mount applications in microelectronic assemblies.
MF1S5000XDA8
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 14; Package Shape: RECTANGULAR; Surface Mount: YES; No. of Channels: 1;
MF1S5030XDA4,118
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Shape: RECTANGULAR; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;
MF1S5001XDUD2/V1
POWER SUPPLY SUPPORT CIRCUIT;
MF1S5009DUD
POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Surface Mount: YES; No. of Channels: 1;
MF1S5001XDUD
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; No. of Functions: 1;
MF1S5030XDA4/V1
MF1S5000XDA4,118
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Shape: RECTANGULAR; Surface Mount: YES; Adjustable Threshold: NO;
MF1S5000XDA8,118
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 14; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Form: NO LEAD;
MF1S5001XDUD/V1
MF1S5001XDUF
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; Minimum Operating Temperature: -25 Cel;
MF1S5009DA4
POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: OTHER; Package Shape: RECTANGULAR; Surface Mount: YES; No. of Channels: 1; Terminal Position: UNSPECIFIED;
MF1S5000XDA8/V1J
MF1S5030XDA4
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Shape: RECTANGULAR; Surface Mount: YES; Minimum Operating Temperature: -25 Cel;
MF1S5000XDA4/V1J
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Shape: RECTANGULAR; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
MF1S5001XDUF,005
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Form: NO LEAD;
MF1S5000XDA4
MF1S5000XDA4/V1
MF1S5000XDA8/V1
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