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MC32PF1510A7EP

NXP Semiconductors

MC32PF1510A7EP by NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD;

Median Price

$2.616

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,028 parts In-Stock

1+ parts

-

100+ parts

$2.470

1k+ parts

$2.210

10k+ parts

$2.080

3,028

-

$2.470

$2.210

$2.080

Verical

USA . 1,196 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.763

10k+ parts

$2.600

1,196

-

-

$2.763

$2.600

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,825 parts In-Stock

1+ parts

$2.270

100+ parts

-

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3,825

$2.270

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-

Vyrian

USA . 4,189 parts In-Stock

1+ parts

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4,189

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Flip Electronics

USA . 1,960 parts In-Stock

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1,960

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DigiKey Marketplace

USA . 940 parts In-Stock

1+ parts

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940

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Anansix

USA . 776 parts In-Stock

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776

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 599 parts In-Stock

1+ parts

$2.151

100+ parts

-

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599

$2.151

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AZTECH Wire

Italy . 672 parts In-Stock

1+ parts

$18.930

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672

$18.930

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Microchip USA

USA . 1,742 parts In-Stock

1+ parts

$19.094

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1,742

$19.094

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UNI Independent Distributors

Spain . 6,881 parts In-Stock

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6,881

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Continental Prestige Electronics

USA . 940 parts In-Stock

1+ parts

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$3.180

1k+ parts

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940

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$3.180

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Technical Specifications

Power Management ICs MC32PF1510A7EP attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

NICKEL PALLADIUM GOLD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MC32PF1510A7EP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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