Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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PC28F640P33TF60A
Micron Technology
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
60 ns
TOP
YES
NO
S-PBGA-B64
67108864 bit
FLASH
16
4,63
64
4194304 words
4M
85 Cel
-40 Cel
4MX16
PLASTIC/EPOXY
BGA
BGA64,8X8,40
SQUARE
GRID ARRAY
8
PARALLEL
2.5/3.3
Not Qualified
16K,64K
.002 Amp
Flash Memories
28 mA
CMOS
INDUSTRIAL
BALL
1 mm
BOTTOM
NOR TYPE
RC48F4400P0VB00A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE; Type: NOR TYPE;
85 ns
536870912 bit
8, 510
33554432 words
32M
32MX16
4
1.8,1.8/3.3
.000005 Amp
51 mA
PC28F320J3F75E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE; Sector Size (Words): 128K;
75 ns
33554432 bit
32
2097152 words
2M
2MX16
4/8
260
3/3.3
128K
.00012 Amp
80 mA
30
PC28F128J3F75D
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Current: 80 mA;
134217728 bit
128
8388608 words
8M
8MX16
RC28F640P30TF65A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE; Sector Size (Words): 16K,64K;
65 ns
.000055 Amp
50 mA
PC28F128P30BF65E
Micron Technology's PC28F128P30BF65E is an 8MX16 NOR flash memory with 64 terminals, operating at -40 to 85°C. It features a 16K/64K sector size and 1.8V power supply, suitable for industrial applications requiring fast access times of 65ns and low standby current of 0.000055A.
4,127
MT29F16G08ABCCBH1-10:C
MT29F16G08ABCCBH1-10:C by Micron Technology is a 2GX8 SLC NAND flash memory with 4K sectors and 2147483648 words. It operates at 3/3.3V, has a package style of GRID ARRAY, and uses parallel interface. Ideal for commercial applications requiring fast access time and low standby current.
20 ns
R-PBGA-B100
17179869184 bit
4K
100
2147483648 words
2G
70 Cel
0 Cel
2GX8
BGA100,10X17,40
RECTANGULAR
512K
.00005 Amp
COMMERCIAL
SLC NAND TYPE
MT29F8G08ABCBBH1-12:B
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
8589934592 bit
2K
1073741824 words
1G
1GX8
1.8
MT29F8G08ABCBBH1-12IT:B
Micron Technology's MT29F8G08ABCBBH1-12IT:B is a 1.8V SLC NAND flash memory with 1GX8 organization, 4K page size, and 512K sector size. It operates in industrial temperature range (-40 to 85 °C) with parallel interface and 100 terminals on a grid array package. Ideal for applications requiring high-density memory storage and fast access times.
MT29F32G08ABCABH1-10:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
34359738368 bit
4294967296 words
4G
4GX8
8K
1.8,3/3.3
1M
.00001 Amp
MT29F64G08AECABH1-10:A
MT29F64G08AECABH1-10:A by Micron Technology is a 8GX8 SLC NAND flash memory with 8K sectors. It operates at temperatures from 0 to 70 °C and has a max access time of 20 ns. Suitable for commercial applications, it features a package style of GRID ARRAY and uses parallel interface with 100 terminals.
68719476736 bit
8589934592 words
8G
8GX8
MT29F64G08AECABH1-10IT:A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Command User Interface: YES;
MT29F256G08AUCABH3-10:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
274877906944 bit
32K
MT29F256G08AUCABH3-10IT:A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA100,10X17,40;
MT29F128G08AKCABH2-10:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY;
137438953472 bit
16K
17179869184 words
16G
16GX8
MT29F128G08AMCABH2-10:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Organization: 16GX8;
MT29F128G08AMCABH2-10IT:A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Ready or Busy: YES;
MT29F64G08AKCCBH2-10Z:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
MT29F32G08ABCABH1-10Z:A
Micron Technology's MT29F32G08ABCABH1-10Z:A is a 4GX8 SLC NAND flash memory with 4294967296 words capacity. It operates at temperatures from 0 to 70°C, with a max access time of 20 ns. Ideal for commercial applications requiring high memory density and low standby current consumption.
MT29F64G08AECABH1-10ITZ:A
MT29F64G08AECABH1-10ITZ:A by Micron Technology is an 8GX8 SLC NAND flash memory with 8K sectors. Operating at -40 to 85 °C, it has a memory density of 68719476736 bit and max access time of 20 ns. Ideal for industrial applications requiring fast, reliable data storage with low standby current consumption.
MT29F64G08AECABH1-10Z:A
MT29F64G08AECABH1-10Z:A by Micron Technology is a 8GX8 SLC NAND flash memory with 8K sectors and 1M word sector size. Operating at 0-70 °C, it has a max access time of 20 ns and consumes up to 50 mA current. Ideal for commercial applications requiring high memory density and fast data access.
MT29F128G08AKCABH2-10Z:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Page Size (words): 8K;
MT29F128G08AKCABH2-10ITZ:A
Micron Technology's MT29F128G08AKCABH2-10ITZ:A is a 16GX8 SLC NAND flash memory with 1M sector size and 8K page size. It operates at industrial temperature grade, with parallel interface and 100 terminals in a grid array package. Ideal for applications requiring high-speed data storage and retrieval.
MT29F128G08AMCABH2-10ITZ:A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Power Supplies (V): 1.8,3/3.3;
MT29F128G08AMCABH2-10Z:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Standby Current: .00001 Amp;
MT29F256G08AUCABH3-10ITZ:A
Micron Technology's MT29F256G08AUCABH3-10ITZ:A is a SLC NAND flash memory with 32K sectors, 8K page size, and 1M sector size. It operates at temperatures from -40 to 85°C and has a max access time of 20 ns. Ideal for industrial applications requiring high-density memory with low standby current.
MT29F256G08AUCABH3-10Z:A
N25Q064A13E14D0E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 108 MHz;
108 MHz
20
100000 Write/Erase Cycles
R-PBGA-B24
24
8MX8
BGA24,4X6,40
SERIAL
SPI
.0001 Amp
20 mA
HARDWARE/SOFTWARE
M29W128GL70ZA6DE
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
70 ns
8/16
M29W128GSH70ZA6E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE; No. of Words Code: 8M;
M29W128GSH70ZS6E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE; No. of Words: 8388608 words;
M29W128GSL70ZA6E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE; Organization: 8MX16;
M29W128GSL70ZS6E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA64,8X8,40;
MT29F8G08ADBFAH4-AAT:FTR
Micron Technology's MT29F8G08ADBFAH4-AAT:FTR is a SLC NAND flash memory with 1GX8 organization, 8-bit memory width, and 8589934592 bit density. It operates in ASYNCHRONOUS mode with a temperature range of -40 to 105 °C. Ideal for applications requiring high-speed data storage in compact devices.
X-PBGA-B
1
ASYNCHRONOUS
105 Cel
UNSPECIFIED
NOT SPECIFIED
MTFC8GLWDM-3LAATZ
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
R-PBGA-B153
13 mm
FLASH CARD
153
SYNCHRONOUS
OPEN-DRAIN
BGA153,14X14,20
GRID ARRAY, THIN PROFILE, FINE PITCH
1.2 mm
3.6 V
2.7 V
.5 mm
11.5 mm
THGBMHG7C2LBAIL
Toshiba
FLASH; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
-25 Cel
2.7
OTHER
THGBMHG8C4LBAIR
FLASH; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
R-PBGA-B169
169
34359738368 words
32G
32GX8
MT29F4G16ABADAH4-AIT:D
Micron's MT29F4G16ABADAH4-AIT:D is a 256MX16 SLC NAND flash memory with 3.3V programming voltage. Operating in industrial temperatures (-40 to 85°C), it offers 4294967296-bit memory density for parallel applications. The package features a grid array style with bottom terminal position, suitable for surface mount designs.
R-PBGA-B63
e1
4294967296 bit
63
268435456 words
256M
256MX16
3.3
TIN SILVER COPPER
SST26WF016BAT-104I/CS
Microchip Technology
SST26WF016BAT-104I/CS by Microchip: 16MX1 organization, 104 MHz clock frequency, SPI serial bus type. Ideal for industrial applications requiring NOR flash memory with 100000 write/erase cycles endurance and 1.8V programming voltage.
104 MHz
R-PBGA-B8
16777216 bit
16777216 words
16M
16MX1
3-STATE
BGA8,3X5,23
TS 16949
.64 mm
25 mA
1.95 V
1.65 V
.886 mm
THGBMJG6C1LBAIL
Kioxia Holdings
Kioxia Holdings' THGBMJG6C1LBAIL is an 8GX8 flash memory IC with 68719476736-bit memory density. It operates b/w -25°C to 85°C, with a voltage range of 2.7V to 3.6V. This rectangular GRID ARRAY package is surface-mountable and ideal for applications requiring high-speed data storage in compact devices.
11 mm
MTFC16GAPALGT-AIT
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Organization: 16GX8;
200 MHz
5
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
AEC-Q100
.8 mm
NAND TYPE
MTFC16GAPALHT-AIT
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
18 mm
GRID ARRAY, VERY THIN PROFILE
14 mm
THGBMJG8C2LBAIL
Kioxia Holdings' THGBMJG8C2LBAIL is a Flash Memory with 32GX8 organization, 274877906944 bit memory density, and CMOS technology. It features a package style of GRID ARRAY, operates b/w -25 to 85 °C, and has a terminal pitch of 0.5 mm. Ideal for applications requiring high-speed data storage in compact devices.
THGBMJG8C4LBAU8
Kioxia Holdings THGBMJG8C4LBAU8 is a 32GX8 flash memory with 274877906944 bit density. It operates b/w -40 to 105 °C, suitable for industrial applications. With a terminal pitch of 0.5 mm and package style GRID ARRAY, it offers high-speed data storage in compact devices.
S25HS02GTFABHV153
Infineon Technologies
FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS; Maximum Clock Frequency (fCLK): 166 MHz;
166 MHz
S-PBGA-B24
2147483648 bit
3
2GX1
2 V
1.7 V
S26HL02GTFGBHB043
FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B24; Maximum Supply Voltage (Vsup): 3.6 V;
133 MHz
S26HL02GTFGBHB050
FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel; Type: NOR TYPE;
S26HS02GTFPBHM053
FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Type: NOR TYPE; Screening Level: AEC-Q100;
125 Cel
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