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SST26WF016BAT-104I/CS

Microchip Technology

SST26WF016BAT-104I/CS by Microchip Technology

SST26WF016BAT-104I/CS by Microchip: 16MX1 organization, 104 MHz clock frequency, SPI serial bus type. Ideal for industrial applications requiring NOR flash memory with 100000 write/erase cycles endurance and 1.8V programming voltage.

Median Price

$1.850

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$1.850

100+ parts

-

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150

$1.850

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Vyrian

USA . 2,010 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,010

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$1.813

100+ parts

-

1k+ parts

$1.740

10k+ parts

-

1,000

$1.813

-

$1.740

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Continental Prestige Electronics

USA . 4,195 parts In-Stock

1+ parts

$1.850

100+ parts

-

1k+ parts

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10k+ parts

$1.813

4,195

$1.850

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-

$1.813

Argo Parts USA

USA . 619 parts In-Stock

1+ parts

$1.850

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-

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619

$1.850

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Ampacity Inc.

Singapore . 489 parts In-Stock

1+ parts

$5.000

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489

$5.000

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Microchip USA

USA . 37,032 parts In-Stock

1+ parts

$12.795

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37,032

$12.795

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AZTECH Wire

Italy . 384 parts In-Stock

1+ parts

$16.153

100+ parts

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384

$16.153

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Fulton Briggs Corp.

USA . 3,393 parts In-Stock

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3,393

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Overview

Elevate your electronics with the Microchip Technology SST26WF016BAT-104I/CS Flash Memory. Known for their top-notch quality and innovative technology, Microchip Technology delivers a reliable product that offers endless possibilities in various applications. From enhancing performance to ensuring data security, this Flash Memory provides value and benefits that exceed customer expectations. Upgrade your devices with the best in the industry and experience the advantages of cutting-edge technology with Microchip's SST26WF016BAT-104I/CS.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for high reliability and easy handling.

Operating Mode: SYNCHRONOUS

Allows for precise timing and faster data transfer speeds.

Nominal Supply Voltage / Vsup (V): 1.8

Low power consumption and compatibility with various systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures for versatile usage.

Organization: 16MX1

Provides a large memory capacity for storing data efficiently.

Write Protection: HARDWARE/SOFTWARE

Enhanced security features to protect data integrity.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with reliable performance under harsh conditions.

Memory IC Type: FLASH

Flash memory technology offers fast read and write speeds for efficient data storage.

Technical Specifications

Flash Memory SST26WF016BAT-104I/CS attributes and parameters. Explore more Flash Memory devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

100

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B8

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA8,3X5,23

Package Shape:

Package Style (Meter):

GRID ARRAY

Parallel or Serial:

SERIAL

Programming Voltage (V):

1.8

Screening Level:

TS 16949

Maximum Seated Height:

.64 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000005 Amp

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.886 mm

Terminal Position:

BOTTOM

Type:

NOR TYPE

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

SST26WF016BAT-104I/CS Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.A

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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