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BGA Flash Memory 71

Flash Memory
Part# Info Specs
Part RoHS Manufacturer Description Maximum Access Time Additional Features Alternate Memory Width Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Ready or Busy Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Serial Bus Type Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Type Width Maximum Write Cycle Time (tWC) Write Protection
S26HL02GTFGBHM040 by Infineon Technologies

S26HL02GTFGBHM040

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel; Maximum Supply Voltage (Vsup): 3.6 V;

133 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

125 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

3

AEC-Q100

3.6 V

2.7 V

3

YES

CMOS

BALL

BOTTOM

NOR TYPE

S26HL02GTFGBHM043 by Infineon Technologies

S26HL02GTFGBHM043

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM; Moisture Sensitivity Level (MSL): 3;

133 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

125 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

3

AEC-Q100

3.6 V

2.7 V

3

YES

CMOS

BALL

BOTTOM

NOR TYPE

S26HS02GTFPBHB053 by Infineon Technologies

S26HS02GTFPBHB053

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3; Package Style (Meter): GRID ARRAY;

166 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

105 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS02GTFPBHV053 by Infineon Technologies

S28HS02GTFPBHV053

Infineon Technologies

S28HS02GTFPBHV053 by Infineon Technologies is a NOR type Flash Memory with 2GX1 organization and 166 MHz clock frequency. Operating at -40 to 105 °C, it has a memory density of 2147483648 bits. Suitable for applications requiring high-speed synchronous operation in electronic devices.

166 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

105 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS01GTGZBHV033 by Infineon Technologies

S28HS01GTGZBHV033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Memory Density: 1073741824 bit; Organization: 1GX1;

200 MHz

S-PBGA-B24

1073741824 bit

FLASH

1

3

1

24

1073741824 words

1G

SYNCHRONOUS

105 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

SPI

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S26HS02GTFPBHM050 by Infineon Technologies

S26HS02GTFPBHM050

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B24; Maximum Clock Frequency (fCLK): 166 MHz;

166 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

125 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS01GTGZBHB033 by Infineon Technologies

S28HS01GTGZBHB033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Organization: 1GX1; JESD-30 Code: S-PBGA-B24; Technology: CMOS;

200 MHz

S-PBGA-B24

1073741824 bit

FLASH

3

1

24

1073741824 words

SYNCHRONOUS

105 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

BGA

GRID ARRAY

1.8

AEC-Q100

SPI

2 V

1.7 V

1.8

CMOS

BOTTOM

NOR TYPE

S28HS01GTGZBHV030 by Infineon Technologies

S28HS01GTGZBHV030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; Maximum Supply Voltage (Vsup): 2 V;

200 MHz

S-PBGA-B24

1073741824 bit

FLASH

1

3

1

24

1073741824 words

1G

SYNCHRONOUS

105 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

SPI

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS01GTGZBHM033 by Infineon Technologies

S28HS01GTGZBHM033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Screening Level: AEC-Q100; Serial Bus Type: SPI;

200 MHz

S-PBGA-B24

1073741824 bit

FLASH

1

3

1

24

1073741824 words

1G

SYNCHRONOUS

125 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

SPI

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS01GTGZBHM030 by Infineon Technologies

S28HS01GTGZBHM030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM; Package Style (Meter): GRID ARRAY;

200 MHz

S-PBGA-B24

1073741824 bit

FLASH

1

3

1

24

1073741824 words

1G

SYNCHRONOUS

125 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

SPI

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS01GTGZBHI033 by Infineon Technologies

S28HS01GTGZBHI033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY; Maximum Clock Frequency (fCLK): 200 MHz;

200 MHz

S-PBGA-B24

1073741824 bit

FLASH

1

3

1

24

1073741824 words

1G

SYNCHRONOUS

85 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

SPI

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S26HS02GTFPBHM043 by Infineon Technologies

S26HS02GTFPBHM043

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Programming Voltage (V): 1.8; No. of Functions: 1;

166 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

125 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S26HS02GTFPBHM040 by Infineon Technologies

S26HS02GTFPBHM040

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; Screening Level: AEC-Q100;

166 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

125 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS01GTGZBHA033 by Infineon Technologies

S28HS01GTGZBHA033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 2 V; Memory Density: 1073741824 bit;

200 MHz

S-PBGA-B24

1073741824 bit

FLASH

1

3

1

24

1073741824 words

1G

SYNCHRONOUS

85 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

SPI

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS01GTGZBHB030 by Infineon Technologies

S28HS01GTGZBHB030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM; Serial Bus Type: SPI;

200 MHz

S-PBGA-B24

1073741824 bit

FLASH

1

3

1

24

1073741824 words

1G

SYNCHRONOUS

105 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

SPI

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS01GTGZBHI030 by Infineon Technologies

S28HS01GTGZBHI030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Memory Width: 1; Operating Mode: SYNCHRONOUS;

200 MHz

S-PBGA-B24

1073741824 bit

FLASH

1

3

1

24

1073741824 words

1G

SYNCHRONOUS

85 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

SPI

2 V

1.7 V

1.8

YES

CMOS

BOTTOM

NOR TYPE

S25HS02GTFABHV150 by Infineon Technologies

S25HS02GTFABHV150

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 1.8; Terminal Form: BALL;

166 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

105 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S26HS02GTFPBHB043 by Infineon Technologies

S26HS02GTFPBHB043

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Memory Width: 1; Minimum Operating Temperature: -40 Cel;

166 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

105 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S26HS02GTFPBHB050 by Infineon Technologies

S26HS02GTFPBHB050

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; Memory Density: 2147483648 bit;

166 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

105 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S26HL02GTFGBHB053 by Infineon Technologies

S26HL02GTFGBHB053

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES; Programming Voltage (V): 3;

133 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

105 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

3

AEC-Q100

3.6 V

2.7 V

3

YES

CMOS

BALL

BOTTOM

NOR TYPE

S26HS02GTFPBHB040 by Infineon Technologies

S26HS02GTFPBHB040

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 1.8; Memory Density: 2147483648 bit;

166 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

105 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S26HL02GTFGBHB040 by Infineon Technologies

S26HL02GTFGBHB040

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency (fCLK): 133 MHz; Maximum Operating Temperature: 105 Cel;

133 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

105 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

3

AEC-Q100

3.6 V

2.7 V

3

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS02GTFPBHV050 by Infineon Technologies

S28HS02GTFPBHV050

Infineon Technologies

S28HS02GTFPBHV050 by Infineon Technologies is a NOR type Flash Memory with 2GX1 organization, operating at up to 166 MHz clock frequency. It has a memory density of 2147483648 bits and operates on a nominal voltage of 1.8V. This synchronous flash memory is suitable for applications requiring high-speed data storage and retrieval in electronic devices.

166 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

105 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE