Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; Memory Density: 2147483648 bit;
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Flash Memory S26HS02GTFPBHB050 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies
Maximum Clock Frequency (fCLK):
JESD-30 Code:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Programming Voltage (V):
Screening Level:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
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Technology:
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Type:
S26HS02GTFPBHB050 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
LM555CM
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
SMBJ18CA
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
LL4148
TDK
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); No. of Phases: 1; No. of Elements: 1; Maximum Output Current: .2 A;
BAV99
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
SS14
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
2N7002
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Littelfuse
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
STM32H743BIT6
STMicroelectronics
STM32H743BIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 208 terminals, and 1085440 bytes of RAM. It features 2 DAC channels, 32 ADC channels, and operates at a max clock frequency of 48 MHz. Ideal for industrial applications requiring high-speed processing and extensive peripheral connectivity.
CDSOT23-SM712
Bourns
Bourns CDSOT23-SM712 is a bidirectional Transient Voltage Suppressor diode with 400W peak power dissipation and 20uA reverse current. Ideal for surge protection in applications requiring a max clamping voltage of 14V, such as IEC-61000-4-2 compliant systems. Operates b/w -55°C to 150°C with matte tin finish and Gull Wing terminals.
M24308/2-1F
Air Electro
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; MIL Conformity: YES; Additional Features: STANDARD: MIL-DTL-24308;
Lite-on Semiconductor
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
Weitron Technology
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358D-T
LM358D-T by NXP Semiconductors is a dual operational amplifier with 70dB CMRR, 1000kHz unity gain bandwidth, and 9000uV max input offset voltage. Widely used in commercial applications due to its small outline package and low bias current of 0.5uA.
BSS138
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (ID): .22 A; Package Shape: RECTANGULAR;
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
FDV303N
Onsemi
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
M29W160EB70N6E
M29W160EB70N6E by STMicroelectronics is a 1MX16 NOR flash memory with 3V nominal voltage. Operating in asynchronous mode, it offers fast access time of 70ns and low standby current of 0.0001Amp. Ideal for industrial applications requiring high-density memory with common flash interface and parallel programming capability.
MX25V1635FM1I
Macronix
Macronix MX25V1635FM1I is a 16Mb Flash Memory with 80MHz clock frequency, operating at -40 to 85°C. It has a serial interface, 3V programming voltage, and is ideal for industrial applications requiring high memory density in a small outline package.
W25Q32JVSNIQ
Winbond Electronics
W25Q32JVSNIQ by Winbond Electronics is a 4MX8 flash memory with a memory density of 33554432 bit. It operates at a max clock frequency of 133 MHz and has an industrial temperature grade. This flash memory is commonly used in applications that require high-speed data storage and retrieval.
ASFC4G31M-51BIN
Alliance Memory
FLASH CARD;
W25Q128JVSIQ
Winbond Electronics' W25Q128JVSIQ is a 16Mx8 NOR flash memory with 133MHz clock frequency, SPI serial bus type. Operating at -40 to 85°C, it offers 100K write/erase cycles and supports hardware/software write protection. Ideal for industrial applications requiring high-speed data storage in compact form factor.
SST25VF020B-80-4I-SAE-T
Microchip Technology
SST25VF020B-80-4I-SAE-T by Microchip: 2MX1 flash memory with 80 MHz clock, SPI serial bus. Ideal for industrial applications, offers 100000 write/erase cycles and operates at -40 to 85 °C.
W25Q64JVZPIQ
Winbond Electronics' W25Q64JVZPIQ is a 3.3V NOR flash memory with 8Mx8 organization, SPI serial bus type, and 133MHz clock frequency. Ideal for industrial applications requiring high endurance of 100K write/erase cycles, it offers a compact package style with small outline and very thin profile for space-constrained designs.
AT25SF641-SUB-T
Adesto Technologies
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE; Surface Mount: YES;
AT25DF081A-SSH-T
Atmel
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
S25FL512SAGMFI011
S25FL512SAGMFI011 by Infineon Technologies is a NOR type flash memory with 64Mx8 organization, operating at 133MHz. It features a 100000 write/erase cycle endurance and SPI serial bus interface. Ideal for industrial applications requiring high-speed synchronous operation in a small outline package.
AT45DB081E-SSHN2B-T
Renesas Electronics
AT45DB081E-SSHN2B-T by Renesas Electronics is a NOR type flash memory with 1MX8 organization, SPI serial bus type, and 133 MHz max clock frequency. It is ideal for industrial applications requiring 100000 write/erase cycles, with a small outline package style and operating temperature range of -40 to 85 °C.
S25FL128SAGMFIR01
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words: 33554432 words;
EPCS1SI8N
Intel
EPCS1SI8N by Intel is a 128Kx8 configuration memory with 1048576-bit memory density. It operates at a max clock frequency of 40 MHz and has an endurance of 100,000 write/erase cycles. This flash memory chip is ideal for industrial applications requiring reliable and high-speed data storage.
IS25LQ040B-JNLE
Integrated Silicon Solution
IS25LQ040B-JNLE by Integrated Silicon Solution is a 4Mx1 Flash Memory with 104MHz clock frequency, operating at -40 to 105°C. It has a supply voltage range of 2.3V to 3.6V and is ideal for industrial applications requiring high-speed synchronous operation in a small outline package.
MT25QL128ABA1EW9-0SITTR
Micron Technology
Micron Technology's MT25QL128ABA1EW9-0SITTR is a 128Mbit flash memory with synchronous operation, 133MHz clock frequency, and 100000 write/erase cycles. Ideal for industrial applications requiring high endurance and reliable data storage in a compact package.
W25Q64JVSSIQT
Winbond Electronics' W25Q64JVSSIQT is a 3.3V Flash Memory with 8MX8 organization, operating at up to 133MHz clock frequency. Ideal for industrial applications, it offers 67108864-bit memory density in a small outline package with dual terminals and Gull Wing form factor.
KLMAG1JETD-B0410
Samsung
FLASH; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Density: 137438953472 bit;
S25FL128SAGNFI011
S25FL128SAGNFI011 by Infineon is a NOR type flash memory with 32Mx4 organization, operating at 133MHz. It has a small outline package, synchronous mode, and supports SPI serial bus type. Ideal for industrial applications requiring high endurance with 100k write/erase cycles.
S29WS128P0SBFW000
Spansion
FLASH; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: VFBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
S29GL01GS10DHI013
FLASH; No. of Terminals: 64; Package Code: LBGA; Package Shape: SQUARE; Memory Width: 8; Maximum Supply Voltage (Vsup): 3.6 V;
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S26HL01GTFPBHI010
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B24; Parallel or Serial: SERIAL;
S26HL01GTFPBHB010
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel; Parallel or Serial: SERIAL;
S26HL01GTFPBHA020
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Type: NOR TYPE; Length: 8 mm;
S26HL01GTFPBHI000
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Endurance: 2560000 Write/Erase Cycles; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE;
S26HL01GTFPBHB020
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Maximum Seated Height: 1 mm; JESD-30 Code: S-PBGA-B24;
S26HL01GTFPBHB000
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 2.7 V; Type: NOR TYPE;
S26HL01GTFPBHI013
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Parallel or Serial: SERIAL; Width: 8 mm;
S26HL01GTFPBHA003
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Length: 8 mm; Package Body Material: PLASTIC/EPOXY;
S26HL01GTFPBHB013
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; No. of Words Code: 128M; Maximum Clock Frequency (fCLK): 166 MHz;
S26HL01GTFPBHA023
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Output Characteristics: OPEN-DRAIN; Terminal Position: BOTTOM;
S26HL01GTFPBHB033
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Package Equivalence Code: BGA24,5X5,40; Package Body Material: PLASTIC/EPOXY;
S26HL01GTFPBHB023
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Parallel or Serial: SERIAL; Maximum Seated Height: 1 mm;
S26HL01GTFPBHA033
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Technology: CMOS; Package Body Material: PLASTIC/EPOXY;
S26HL01GTFPBHI003
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Parallel or Serial: SERIAL; Terminal Position: BOTTOM;
S26HL01GTFPBHA013
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Surface Mount: YES; Terminal Position: BOTTOM;
S26HL01GTFPBHB003
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Maximum Seated Height: 1 mm; Screening Level: AEC-Q100;
S26HL01GTFPBHA000
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; No. of Words: 134217728 words; Terminal Form: BALL;
S26HL01GTFPBHA010
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Terminal Position: BOTTOM; Maximum Clock Frequency (fCLK): 166 MHz;
S26HL01GTFPBHA030
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Serial Bus Type: SPI; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE;
S26HL01GTFPBHB030
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE; Parallel or Serial: SERIAL;
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