Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Memory Width: 1; Minimum Operating Temperature: -40 Cel;
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Vyrian
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Digiode
Modulus Dynamics
$4.200
$4.032
$3.864
AZTECH Wire
$11.480
Corphita
Flash Memory S26HS02GTFPBHB043 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies
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S26HS02GTFPBHB043 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
LM317T
Inchange Semiconductor
Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;
SS14
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Secos
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;
BAV99
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N5819HW-7-F
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Texas Instruments
LM358N by Texas Instruments is an operational amplifier with 2 functions, offering a max input offset voltage of 9000 uV and a nominal common mode reject ratio of 85 dB. Widely used in commercial applications, it operates at temperatures ranging from 0 to 70 °C and has a unity gain bandwidth of 1000 kHz.
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
FDC5614P
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
EU2B-YS3203C
Idec
ROTARY SWITCH;
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
LM107H/883
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
Sensitron Semiconductor
Continental Device India
1N4148
Renesas Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
ULN-2803A
Sprague Electric
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
CRG0805F10K
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10000 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
S29AL016J70TFI010
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-609 Code: e3;
S29GL128P11FFI010
Infineon Technologies
S29GL128P11FFI010 by Infineon is a 128Mx1 NOR flash memory with 128 sectors, operating at 3V. It features a parallel interface, 110ns access time, and supports common flash interface. Ideal for industrial applications requiring fast data access and reliable storage in a compact grid array package.
SST26VF032B-104V/SM
Microchip Technology
SST26VF032B-104V/SM by Microchip Technology is a 32Mb NOR Flash Memory with SPI interface, operating at 104MHz clock frequency. It offers 100000 Write/Erase cycles endurance and operates in industrial temperature range (-40 to 105°C). Ideal for applications requiring high-speed data transfer and reliable non-volatile memory storage.
S29JL032J70TFI310
S29JL032J70TFI310 by Infineon Technologies is a 2MX16 NOR flash memory with 3V nominal voltage. It features synchronous operation, 8K/64K sector size, and 70ns max access time. Ideal for industrial applications requiring fast data retrieval and reliable non-volatile storage in compact designs.
W25Q128JVSIM
Winbond Electronics
W25Q128JVSIM by Winbond Electronics is a 16MX8 NOR type flash memory with 133 MHz clock frequency. It operates at 3.3V, has 100000 write/erase cycles endurance, and uses SPI serial bus. Ideal for industrial applications requiring high-speed data storage in compact devices.
S25FL128SAGNFI003
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Minimum Data Retention Time: 20;
THGBMNG5D1LBAIT
Toshiba
Toshiba's THGBMNG5D1LBAIT Flash Memory features 4GX8 organization, MLC NAND type, and 34359738368 bit memory density. Ideal for applications requiring high memory capacity and fast data access with a temperature range of -25 to 85 °C.
SDSDQAF3-008G-I
Sandisk
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Form: NO LEAD; Memory Density: 68719476736 bit;
MTFC8GAMALBH-AAT
Micron Technology
MTFC8GAMALBH-AAT by Micron Technology is a NAND flash memory with 8GX8 organization, 68719476736 bit memory density, and 105°C max operating temp. It is suitable for industrial applications requiring high-speed data storage in compact devices.
MTFC16GAPALBH-ITTR
MTFC16GAPALBH-ITTR by Micron Technology is a 16GX8 NAND flash memory with 17179869184 words capacity. Operating at up to 200 MHz, it has a thin profile and fine pitch package style suitable for industrial applications. With a temperature range of -40 to 85 °C, it offers high-speed synchronous operation in a compact form factor.
SDCIT2/8GBSP
Kingston Technology Company
Kingston's SDCIT2/8GBSP is a rectangular flash memory chip with 8GX8 organization, SLC NAND type, and 3.3V programming voltage. Ideal for applications requiring high endurance with 30K write/erase cycles and a memory density of 68719476736 bits.
EPCS64SI16N
Intel
EPCS64SI16N by Intel is a 8MX8 configuration memory with 67108864-bit density. It operates at 3.3V, has a max clock frequency of 40MHz, and offers 100000 write/erase cycles endurance. Ideal for industrial applications requiring reliable non-volatile memory with small outline package style.
SST25VF016B-75-4I-S2AF
SST25VF016B-75-4I-S2AF by Microchip: 16MX1 NOR Flash Memory with 80MHz clock, SPI serial bus. Ideal for industrial applications, offers 100k write/erase cycles and operates at -40 to 85°C. Package style: small outline, terminal finish: nickel palladium gold.
S29GL512P10TFIR10
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HTSSOP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
AT45DB321D-SU-SL383
Dialog Semiconductor
AT45DB321D-SU-SL383 by Dialog Semiconductor is a NOR type flash memory with 32MX1 organization and 33554432 bit memory density. It operates at a max clock frequency of 66 MHz and has a min data retention time of 20 years. This flash memory is commonly used in applications that require high-speed data storage and retrieval, such as embedded systems and consumer electronics.
S29AL016J70TFI013
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Length: 18.4 mm;
S25FL256SAGMFI011
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
SST26VF016B-104I/SN-RN
SST26VF016B-104I/SN-RN by Microchip: 16MX1 NOR Flash Memory, 104 MHz clock freq., SPI serial bus. Ideal for industrial applications requiring high-speed synchronous operation and 100000 write/erase cycles. Operating temp range -40 to 85 °C with AEC-Q100 screening level.
W25Q128JWPIQ
W25Q128JWPIQ by Winbond Electronics is a NOR type flash memory with 16Mx8 organization, operating at up to 133 MHz clock frequency. It offers 100000 write/erase cycles and is ideal for industrial applications requiring high-speed synchronous operation in a small outline package.
SST25VF080B-50-4C-S2AF
Silicon Storage Technology
FLASH; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE; Type: NOR TYPE; Minimum Operating Temperature: 0 Cel;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
S26HL01GTFPBHI010
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B24; Parallel or Serial: SERIAL;
S26HL01GTFPBHB010
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel; Parallel or Serial: SERIAL;
S26HL01GTFPBHA020
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Type: NOR TYPE; Length: 8 mm;
S26HL01GTFPBHI000
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Endurance: 2560000 Write/Erase Cycles; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE;
S26HL01GTFPBHB020
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Maximum Seated Height: 1 mm; JESD-30 Code: S-PBGA-B24;
S26HL01GTFPBHB000
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 2.7 V; Type: NOR TYPE;
S26HL01GTFPBHI013
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Parallel or Serial: SERIAL; Width: 8 mm;
S26HL01GTFPBHA003
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Length: 8 mm; Package Body Material: PLASTIC/EPOXY;
S26HL01GTFPBHB013
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; No. of Words Code: 128M; Maximum Clock Frequency (fCLK): 166 MHz;
S26HL01GTFPBHA023
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Output Characteristics: OPEN-DRAIN; Terminal Position: BOTTOM;
S26HL01GTFPBHB033
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Package Equivalence Code: BGA24,5X5,40; Package Body Material: PLASTIC/EPOXY;
S26HL01GTFPBHB023
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Parallel or Serial: SERIAL; Maximum Seated Height: 1 mm;
S26HL01GTFPBHA033
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Technology: CMOS; Package Body Material: PLASTIC/EPOXY;
S26HL01GTFPBHI003
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Parallel or Serial: SERIAL; Terminal Position: BOTTOM;
S26HL01GTFPBHA013
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Surface Mount: YES; Terminal Position: BOTTOM;
S26HL01GTFPBHB003
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Maximum Seated Height: 1 mm; Screening Level: AEC-Q100;
S26HL01GTFPBHA000
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; No. of Words: 134217728 words; Terminal Form: BALL;
S26HL01GTFPBHA010
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Terminal Position: BOTTOM; Maximum Clock Frequency (fCLK): 166 MHz;
S26HL01GTFPBHA030
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Serial Bus Type: SPI; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE;
S26HL01GTFPBHB030
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE; Parallel or Serial: SERIAL;
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