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S28HS02GTFPBHV050

Infineon Technologies

S28HS02GTFPBHV050 by Infineon Technologies

S28HS02GTFPBHV050 by Infineon Technologies is a NOR type Flash Memory with 2GX1 organization, operating at up to 166 MHz clock frequency. It has a memory density of 2147483648 bits and operates on a nominal voltage of 1.8V. This synchronous flash memory is suitable for applications requiring high-speed data storage and retrieval in electronic devices.

Median Price

$25.718

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 469 parts In-Stock

1+ parts

-

100+ parts

$22.860

1k+ parts

$20.450

10k+ parts

$19.250

469

-

$22.860

$20.450

$19.250

Verical

USA . 469 parts In-Stock

1+ parts

-

100+ parts

$28.575

1k+ parts

$25.563

10k+ parts

$24.063

469

-

$28.575

$25.563

$24.063

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 49 parts In-Stock

1+ parts

$39.865

100+ parts

-

1k+ parts

-

10k+ parts

-

49

$39.865

-

-

-

Vyrian

USA . 5,228 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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5,228

-

-

-

-

Digiode

USA . 838 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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838

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 602 parts In-Stock

1+ parts

$3.041

100+ parts

-

1k+ parts

-

10k+ parts

-

602

$3.041

-

-

-

Aztec Data Supply Inc.

USA . 28,339 parts In-Stock

1+ parts

$3.440

100+ parts

-

1k+ parts

-

10k+ parts

-

28,339

$3.440

-

-

-

Modulus Dynamics

Lithuania . 2,061 parts In-Stock

1+ parts

$4.530

100+ parts

$4.349

1k+ parts

$4.168

10k+ parts

-

2,061

$4.530

$4.349

$4.168

-

Ampacity Inc.

Singapore . 691 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

-

10k+ parts

-

691

$5.000

-

-

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AZTECH Wire

Italy . 462 parts In-Stock

1+ parts

$15.212

100+ parts

-

1k+ parts

-

10k+ parts

-

462

$15.212

-

-

-

Semicontronic

India . 57 parts In-Stock

1+ parts

$25.040

100+ parts

$24.414

1k+ parts

$24.289

10k+ parts

-

57

$25.040

$24.414

$24.289

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Continental Prestige Electronics

USA . 663 parts In-Stock

1+ parts

$39.865

100+ parts

-

1k+ parts

-

10k+ parts

$39.068

663

$39.865

-

-

$39.068

Netroflash

USA . 500 parts In-Stock

1+ parts

$39.865

100+ parts

-

1k+ parts

-

10k+ parts

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500

$39.865

-

-

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Argo Parts USA

USA . 3,725 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,725

-

-

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Corphita

USA . 789 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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789

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-

Overview

Unlock the power of reliable and high-quality flash memory with the S28HS02GTFPBHV050 by Infineon Technologies. As a trusted manufacturer in the industry, Infineon brings you a cutting-edge product that offers seamless functionality and performance for a wide range of applications. Whether you are looking to enhance your IoT devices or streamline your automotive systems, this flash memory delivers exceptional value, efficiency, and durability. Upgrade your technology with the S28HS02GTFPBHV050 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protection for the flash memory chip.

Surface Mount: YES

Being surface mountable makes it easier to integrate this flash memory into various electronic devices without the need for special mounting hardware.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage of 1.8V makes this flash memory energy efficient and suitable for battery-operated devices.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this flash memory can withstand harsh operating environments and temperature fluctuations.

Type: NOR TYPE

The NOR type flash memory offers high-speed read capabilities, making it ideal for applications where fast read access is critical.

Technical Specifications

Flash Memory S28HS02GTFPBHV050 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

166 MHz

JESD-30 Code:

S-PBGA-B24

Memory Density:

2147483648 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

2147483648 words

No. of Words Code:

2G

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2GX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Programming Voltage (V):

1.8

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Position:

BOTTOM

Type:

NOR TYPE

Trade Compliance

S28HS02GTFPBHV050 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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